Laser machining device for adjusting focus shift based on contamination level of optical system during laser machining

Patent metadata

Field	Value
Publication number	US-11235419-B2
Application number	US-201816130486-A
Country	US
Kind code	B2
Filing date	Sep 13, 2018
Priority date	Sep 14, 2017
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

A laser machining device includes a first focus movement amount calculation section configured to calculate a focus movement amount based on comparison of a first measurement value obtained by averaging a plurality of measurement values measured by a returning light measurement unit within a first period and a second measurement value obtained by averaging a plurality of measurement values measured by the returning light measurement unit within a second period that is temporally later than the first period; and a focus position correction section configured to correct a focus position during laser machining based on the focus movement amount, and the first period is a period shortly after initiation of laser emission when the external optical system is not warmed up or is a period after correcting the focus position, and the second period is a period after passage of a certain time duration when the external optical system is warmed up.

First claim

The invention claimed is:

1. A laser machining device configured to laser machine a workpiece while correcting a focus shift due to contamination of an optical system, the laser machining device comprising:
a laser oscillator;
an external optical system being external to the laser oscillator and configured to guide laser light from the laser oscillator and focus the laser light on the surface of a workpiece;
a returning light measurement unit that measures an energy amount of returning light reflected by the workpiece and returning to the laser machining device; and
a focus shift adjustment unit that adjusts, based on the energy amount of the returning light of the laser light having an output as high as that used for laser machining during laser machining, a focus shift due to contamination of the external optical system,

wherein
the focus shift adjustment unit:
calculates a first focus movement amount based on comparison of a first measurement value obtained by averaging a plurality of measurement values measured by the returning light measurement unit within a first period and a second measurement value obtained by averaging a plurality of measurement values measured by the returning light measurement unit within a second period that is temporally later than the first period; and
corrects a focus position during laser machining based on the calculated first focus movement amount, and

the first period is a period shortly after initiation of laser emission when the external optical system is not warmed up or is a period after correcting the focus position, and the second period is a period after passage of a certain time duration when the external optical system is warmed up.

2. The laser machining device of claim 1 , wherein:
a time of hole formation machining and a time of machining other than the hole formation machining is distinguished based on identification information for identifying a type of laser machining to be executed.

3. A laser machining device configured to laser machine a workpiece while correcting a focus shift due to contamination of an optical system, the laser machining device comprising:
a laser oscillator;
an external optical system being external to the laser oscillator and configured to guide laser light from the laser oscillator and focus the laser light on the surface of a workpiece;
a returning light measurement unit that measures an energy amount of returning light reflected by the workpiece and returning to the laser machining device; and
a focus shift adjustment unit that adjusts, based on the energy amount of the returning light of the laser light having an output as high as that used for laser cutting during laser cutting, a focus shift due to contamination of the external optical system, wherein
the focus shift adjustment unit:
issues, with respect to the laser oscillator, a command to emit laser light at a predetermined output or a command to not emit laser light;
calculates a focus movement amount based on comparison of a first measurement value obtained by averaging peak values measured by the returning light measurement unit when changing from the command not to emit laser light to the command to emit laser light within a first period and a second measurement value obtained by averaging peak values measured by the returning light measurement unit when changing from the command not to emit laser light to the command to emit laser light within a second period that is temporally later than the first period; and
corrects a focus position during laser cutting based on the calculated focus movement amount, and

the first period is a period shortly after initiation of laser emission when the external optical system is not warmed up or is a period after correcting the focus position, and the second period is a period after passage of a certain time duration when the external optical system is warmed up.

4. A laser machining device configured to laser machine a workpiece while correcting a focus shift due to contamination of an optical system, the laser machining device comprising:
a laser oscillator;
an external optical system being external to the laser oscillator and configured to guide laser light from the laser oscillator and focus the laser light on the surface of a workpiece;
a returning light measurement unit that measures an energy amount of returning light reflected by the workpiece and returning to the laser machining device; and
a focus shift adjustment unit that adjusts, based on the energy amount of the returning light of the laser light having an output as high as that used for laser cutting during laser cutting, a focus shift due to contamination of the external optical system,

wherein
the focus shift adjustment unit:
calculates a change amount per unit time of the energy amount of the returning light measured by the returning light measurement unit;
calculates a focus movement amount based on comparison of a first measurement value obtained by averaging peak values measured by the returning light measurement unit when the calculated change amount per unit time within a first period is greater than or equal to a certain value and a second measurement value obtained by averaging peak values measured by the returning light measurement unit when the calculated change amount per unit time within a second period that is temporally later than the first period is equal to or greater than a certain value; and
corrects a focus position during laser cutting based on the calculated focus movement amount, and

the first period is a period shortly after initiation of laser emission when the external optical system is not warmed up or is a period after correcting the focus position, and the second period is a period after passage of a certain time duration when the external optical system is warmed up.

5. The laser machining device of claim 1 , wherein the focus shift adjustment unit further:
corrects, in a case that a correction amount is incorrect even when correction of the focus position is repeated, a laser power level based on comparison of the first measurement value and the second measurement value.

6. The laser machining device of claim 1 , wherein:
the focus shift adjustment unit further calculates a second focus movement amount based on comparison of a first measurement value measured by the returning light measurement unit at a time of a first hole formation machining and a second measurement value measured by the returning light measurement unit at a time of a second hole formation machining that is temporally later than the time of the first hole formation machining; and
the time of the first hole formation machining is a point in time shortly after initiation of laser emission when the external optical system is not warmed up or is a point in time after correcting the focus position, and the time of the second hole formation machining is a point in time after passage of a certain time duration when the external optical system is warmed up.

7. The laser machining device of claim 6 , wherein the focus shift adjustment unit further switches, based on identification information for identifying a type of laser machining to be executed between calculation of the first focus movement amount and calculation of the second focus movement amount.

8. A laser machining device configured to laser machine a workpiece while correcting a focus shift due to contamination of an optical system, the laser machining device comprising:
a laser oscillator;
an external optical system being external to the laser oscillator and configured to guide laser light from the laser oscillator and focus the laser light on the surface of a workpiece;
a returning light measurement unit that meas

Assignees

• Fanuc Corp

Inventors

• Izumi Takashi

Classifications

• B23K26/30

  of three-dimensional [3D] seams · CPC title

• B23K26/046 Primary

  Automatically focusing the laser beam · CPC title

• B23K26/0648

  comprising lenses · CPC title

• B23K26/707

  for monitoring laser beam transmission optics · CPC title

• B23K26/21

  by welding · CPC title