Method for bonding dissimilar metals to each other

Patent metadata

Field	Value
Publication number	US-11235408-B2
Application number	US-201716320862-A
Country	US
Kind code	B2
Filing date	Oct 12, 2017
Priority date	Oct 17, 2016
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

Provided is a method for bonding dissimilar metals to each other, the method comprising: dissimilar metal layer-forming steps (P2), (P3), (P4) for supplying, to form dissimilar metal layers; a second metal layer-forming step (P5) for supplying, on the surface of the dissimilar metal layers, a filler material formed of a second metal, and heating the filler material formed of the second metal to a temperature equal to or higher than a melting point of the second metal, to form a second metal layer formed of the second metal; and a second material-to-be-bonded welding step (P6) for welding a second material to be bonded that is formed of the second metal, onto the second metal layer.

First claim

The invention claimed is:

1. A method for bonding dissimilar metals to each other, the method comprising:
providing a first material, including a first metal, to be bonded to a second material, including a second metal, the first and second metals being the dissimilar metals;
a dissimilar metal layer forming step of supplying a mixed filler material, including a filler material formed of the first metal and particles formed of the second metal having a higher melting point than the first metal, to a surface of the first material, and heating the mixed filler material to a temperature equal to or higher than a melting point of the first metal and lower than a melting point of the second metal, to form a dissimilar metal layer;
a second metal layer forming step of supplying a filler material formed of the second metal to a surface of the dissimilar metal layer, and heating the filler material formed of the second metal to a temperature equal to or higher than the melting point of the second metal, to form a second metal layer formed of the second metal; and
a second material-to-be-bonded welding step of welding the second material to the second metal layer.

2. The method for bonding dissimilar metals to each other according to claim 1 ,
wherein a dissimilar metal laminated layer structure in which a plurality of the dissimilar metal layers are sequentially laminated is formed by repeating the dissimilar metal layer forming step,
wherein execution is made such that a proportion of the first metal in the mixed filler material to be used in a first dissimilar metal layer forming step of a laminating sequence is larger than a proportion of the second metal, and
wherein second and subsequent dissimilar metal layer forming steps of the laminating sequence are executed such that, as the laminating sequence increases, the proportion of the second metal becomes sequentially larger and the proportion of the first metal becomes sequentially smaller.

3. The method for bonding dissimilar metals to each other according to claim 1 ,
wherein a dissimilar metal laminated layer structure in which a plurality of the dissimilar metal layers are sequentially laminated is formed by repeating the dissimilar metal layer forming step, and
wherein the plurality of dissimilar metal layer forming steps are executed such that a particle diameter of each of particles of the second metal becomes sequentially smaller as the laminating sequence increases.

4. The method for bonding dissimilar metals to each other according to claim 1 ,
wherein a dissimilar metal laminated layer structure in which a plurality of the dissimilar metal layers are sequentially laminated is formed by repeating the dissimilar metal layer forming step, and
wherein the plurality of dissimilar metal layer forming steps are executed such that a heating temperature of the mixed filler material becomes higher as the laminating sequence increases.

5. The method for bonding dissimilar metals to each other according to claim 1 ,
wherein the filler material formed of the first metal is a wire.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Fujiya Yasuyuki
• Ishii Ken

Classifications

• B23K31/12 Primary

  relating to investigating the properties, e.g. the weldability, of materials · CPC title

• B23K9/04 Primary

  Welding for other purposes than joining, e.g. built-up welding · CPC title

• B22F10/25

  Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS] · CPC title

• B22F2998/10

  Processes characterised by the sequence of their steps · CPC title

• B22F2207/13

  Size gradients · CPC title