Workpiece processing method

Patent metadata

Field	Value
Publication number	US-11235387-B2
Application number	US-201615559149-A
Country	US
Kind code	B2
Filing date	Mar 7, 2016
Priority date	Mar 20, 2015
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

A workpiece processing method is a method for successively processing a plurality of workpieces including a first workpiece and a second workpiece in a single machining area. The workpiece processing method includes: performing additive manufacturing on the second workpiece in the machining area; and performing subtractive manufacturing on the first workpiece in the machining area while keeping on standby the second workpiece on which additive manufacturing is performed. In this way, the workpiece processing method with improved productivity is provided.

First claim

The invention claimed is:

1. A workpiece processing method for successively processing a plurality of workpieces including a first workpiece and a second workpiece in a single machining area, the workpiece processing method comprising:
performing additive manufacturing on the second workpiece in the single machining area; and
performing subtractive manufacturing on the first workpiece in the single machining area while keeping on standby, outside of the single machining area, the second workpiece on which additive manufacturing has been performed.

2. The workpiece processing method according to claim 1 , wherein
the performing of additive manufacturing on the second workpiece includes performing additive manufacturing on the second workpiece while keeping on standby the first workpiece on which additive manufacturing has been performed.

3. The workpiece processing method according to claim 2 , further comprising:
performing additive manufacturing on a third workpiece in the single machining area while keeping the second workpiece on standby, after the performing of subtractive manufacturing on the first workpiece; and
performing subtractive manufacturing on the second workpiece in the single machining area while keeping on standby the third workpiece on which additive manufacturing has been performed.

4. The workpiece processing method according to claim 2 , further comprising:
performing additive manufacturing on the first workpiece in the single machining area before the performing of additive manufacturing on the second workpiece; and
performing subtractive manufacturing on the second workpiece in the single machining area after the performing of subtractive manufacturing on the first workpiece.

5. The workpiece processing method according to claim 2 , wherein
a manufacturing machine forming the single machining area includes a first workpiece holder and a second workpiece holder capable of holding a workpiece, and
during the performing of additive manufacturing on the second workpiece and during the performing of subtractive manufacturing on the first workpiece, the first workpiece holder holds the first workpiece and the second workpiece holder holds the second workpiece.

6. The workpiece processing method according to claim 5 , wherein
the first workpiece holder and the second workpiece holder are mounted on respective spindles configured to hold and rotate a workpiece.

7. The workpiece processing method according to claim 2 , wherein the single machining area is provided in a manufacturing machine comprising: a workpiece holder disposed in the single machining area and configured to hold a workpiece; and a workpiece transporter including a plurality of grippers capable of gripping a workpiece and configured to transport a workpiece held by the workpiece holder, and wherein
during the performing of additive manufacturing on the second workpiece, the workpiece holder holds the second workpiece and one of the grippers grips the first workpiece,
the workpiece processing method further comprises replacing, by the workpiece transporter, the second workpiece held by the workpiece holder with the first workpiece gripped by the one of the grippers, subsequent to the performing of additive manufacturing on the second workpiece and prior to the performing of subtractive manufacturing on the first workpiece, and
during the performing of subtractive manufacturing on the first workpiece, the workpiece holder holds the first workpiece and another one of the grippers grips the second workpiece.

8. The workpiece processing method according to claim 7 , wherein
the workpiece holder is mounted on a spindle configured to hold and rotate a workpiece.

9. The workpiece processing method according to claim 2 , wherein the single machining area is provided in a manufacturing machine comprising: a first workpiece holder and a second workpiece holder disposed in the single machining area and capable of holding a workpiece; and a workpiece transporter configured to transport a workpiece held by the first workpiece holder and a workpiece held by the second workpiece holder, and wherein
during the performing of additive manufacturing on the second workpiece, the first workpiece holder holds the second workpiece and the second workpiece holder holds the first workpiece,
the workpiece processing method further comprises exchanging, by the workpiece transporter, the second workpiece held by the first workpiece holder with the first workpiece held by the second workpiece holder, subsequent to the performing of additive manufacturing on the second workpiece and prior to the performing of subtractive manufacturing on the first workpiece, and
during the performing of subtractive manufacturing on the first workpiece, the first workpiece holder holds the first workpiece and the second workpiece holder holds the second workpiece.

10. The workpiece processing method according to claim 9 , wherein
the first workpiece holder is mounted on a spindle configured to hold and rotate a workpiece, and
the second workpiece holder is mounted on a tool rest configured to hold a tool.

11. The workpiece processing method according to claim 2 , wherein the single machining area is provided in a manufacturing machine comprising: a first workpiece holder disposed in the single machining area and capable of holding a workpiece; and a second workpiece holder and a third workpiece holder mounted on a tool rest configured to hold a tool and capable of holding a workpiece, and wherein
the workpiece processing method further comprises:
performing additive manufacturing on the first workpiece in the single machining area prior to the performing of additive manufacturing on the second workpiece; and
performing subtractive manufacturing on the second workpiece in the single machining area subsequent to the performing of subtractive manufacturing on the first workpiece,
during the performing of additive manufacturing on the first workpiece and during the performing of additive manufacturing on the second workpiece, the second workpiece holder holds the first workpiece and the third workpiece holder holds the second workpiece,
during the performing of subtractive manufacturing on the first workpiece, the first workpiece holder holds the first workpiece,
during the performing of subtractive manufacturing on the second workpiece, the first workpiece holder holds the second workpiece, and
the workpiece processing method further comprises holding a third workpiece and a fourth workpiece by the second workpiece holder and the third workpiece holder, respectively, until the performing of subtractive manufacturing on the second workpiece is completed.

12. The workpiece processing method according to claim 1 , wherein
the performing of additive manufacturing on the second workpiece includes discharging material powder and simultaneously applying energy to the discharged material powder to melt the discharged material powder and form the second workpiece.

Assignees

• Dmg Mori Co Ltd

Inventors

• Mori Masahiko
• Mezawa Yuhei
• Takashima Shigeyuki
• Sakai Shigetsugu
• Fujishima Makoto

Classifications

• B23K26/342 Primary

  Build-up welding · CPC title

• B22F3/105 Primary

  by using electric current {other than for infrared radiant energy}, laser radiation or plasma (B22F3/11 takes precedence){; by ultrasonic bonding (B22F3/115 takes precedence)} · CPC title

• B22F12/82

  Combination of additive manufacturing apparatus or devices with other processing apparatus or devices · CPC title

• B22F12/88

  Handling of additively manufactured products, e.g. by robots · CPC title

• B22F12/224

  for motion along a direction within the plane of a layer · CPC title