Heatsink module for inverter

Patent metadata

Field	Value
Publication number	US-11234348-B2
Application number	US-201916539619-A
Country	US
Kind code	B2
Filing date	Aug 13, 2019
Priority date	Jan 17, 2019
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

Proposed is a heatsink module for an inverter. The heatsink module includes a housing a bottom face, both spaced side walls, and both flanges. The heatsink module include a heat-dissipation plate including a base fixed to the both flanges; and a plurality of heat-dissipation fins extending downward from a bottom of the base. The heatsink module includes a supporter interposed between the bottom face of the housing and the heat-dissipation fins. The supporter has slots defined therein for accommodating at least portions of the heat-dissipation fins respectively.

First claim

What is claimed is:

1. A heatsink module for an inverter, wherein the heatsink module is configured to dissipate heat generated from a main body of the inverter, wherein the heatsink module comprises:
a housing having:
a bottom face;
two spaced side walls vertically extending from two sides of the bottom face respectively; and
two flanges horizontally and inwardly extending from top ends of the two spaced side walls, respectively;

a heat-dissipation plate including:
a base fixed to the two flanges; and
a plurality of heat-dissipation fins extending downward from a bottom of the base; and

a supporter interposed between the bottom face of the housing and the heat-dissipation fins, wherein the supporter has slots defined therein for accommodating at least portions of the heat-dissipation fins respectively,
wherein a bottom of the heat-dissipation fins is spaced at a predetermined distance from the bottom face of the housing,
wherein the supporter further includes a guide surface opposite to the slots and inclined at a predetermined angle, wherein a rail groove for engaging with the bottom face of the housing is formed along a length direction at a lower portion of the supporter corresponding between the guide surface and the slots,
wherein a lower portion of the supporter corresponding to the guide surface is engaged to the bottom face of the housing, and a lower portion of the supporter corresponding to the slots is spaced from the bottom face of the housing by a predetermined distance.

2. The heatsink module of claim 1 , wherein a fixed rail is formed on the bottom face of the housing, wherein the fixed rail is engaged with the supporter to restrict a movement of the supporter.

3. The heatsink module of claim 2 , wherein the rail groove is defined in a bottom of the supporter, wherein the rail groove has a shape corresponding to a shape of the fixed rail such that the fixed rail is press-fitted into the rail groove.

4. The heatsink module of claim 3 , wherein the supporter further includes an elastic portion formed between the rail groove and the slots and made of an elastic material,
wherein when the heat-dissipation fins are engaged with the slots, the elastic portion elastically supports the slots so that the slots presses the heat-dissipation fins.

5. The heatsink module of claim 1 , wherein the supporter has a concave curved top face such that a height thereof gradually increases from a longitudinal center thereof to each of both longitudinal ends thereof.

Assignees

• Lsis Co Ltd

Inventors

• Kim Kyu-Hwa

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• F28F2265/28

  for preventing noise · CPC title

• H05K7/20918

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title