Fabric-based items having strands with embedded components

Patent metadata

Field	Value
Publication number	US-11233012-B2
Application number	US-201816134839-A
Country	US
Kind code	B2
Filing date	Sep 18, 2018
Priority date	Mar 19, 2018
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

A fabric-based item may include fabric formed from intertwined strands of material with embedded circuitry. The strands of material may be formed from dielectric materials such as polymers. The strands of material may be formed from joined segments of polymer strand material or other material. Each joined segment may contain a potentially distinct circuit. Some joined segments may include one or more conductive lines. The conductive lines may run parallel to each other along the length of the joined segments to form circuit interconnects. Conductive lines may be joined to contact pads on integrated circuits and other embedded components formed from semiconductor dies. Control circuitry formed from the integrated circuits embedded in strands of material in the fabric and other control circuitry may be used to control the circuitry embedded in the fabric.

First claim

What is claimed is:

1. A fabric-based item, comprising:
fabric formed from intertwined strands of material including a strand of material with multiple joined strand segments, wherein the joined strand segments include electrically interconnected electrical devices embedded within polymer strand material, wherein the polymer strand material has a longitudinal axis, wherein the joined strand segments comprise first strand segments and second strand segments, wherein each of the first strand segments and the second strand segments comprises at least two parallel conductive lines embedded in the polymer strand material, and wherein each of the conductive lines has a longitudinal axis that is parallel to the longitudinal axis of the polymer strand material; and
control circuitry configured to control the electrically interconnected electrical components.

2. The fabric-based item defined in claim 1 wherein the first strand segments have semiconductor dies that are joined by the second strand segments, and wherein the second strand segments have embedded conductive lines that are electrically coupled to contacts on the semiconductor dies.

3. The fabric-based item defined in claim 2 wherein each of the semiconductor dies has opposing first and second sides, a first contact on the first side that is coupled to a first of the embedded conductive lines, and a second contact on the second side that is coupled to a second of the embedded conductive lines.

4. The fabric-based item defined in claim 3 wherein the first and second conductive lines comprise respective first and second metal lines that are bonded respectively to the first and second contacts.

5. The fabric-based item defined in claim 2 wherein the at least two parallel conductive lines embedded in the polymer strand material run along the strand of material having the joined strand segments.

6. The fabric-based item defined in claim 5 wherein the semiconductor dies include light-emitting devices.

7. The fabric-based item defined in claim 5 wherein the semiconductor dies include integrated circuit dies.

8. The fabric-based item defined in claim 1 wherein each of the first strand segments contains an embedded conductive line and the second strand segments are electrically coupled to the first strand segments.

9. The fabric-based item defined in claim 8 wherein the second strand segments each include a semiconductor die with a light-emitting device.

10. The fabric-based item defined in claim 8 wherein the second strand segments each include a sensor.

11. The fabric-based item defined in claim 8 wherein the second strand segments each include a haptic output device.

12. The fabric-based item defined in claim 1 wherein the control circuitry comprises an integrated circuit embedded in the polymer strand material of the joined strand segments.

13. A fabric-based item, comprising:
fabric comprising:
intertwined polymer strands that each has first strand segments joined to second strand segments, wherein the first and second strand segments each have rotational alignment structures including protrusions and recesses configured to rotationally align the first strand segments and the second strand segments; and
electrical components embedded in the polymer strands, wherein the electrical components have contact pads that are electrically connected to conductive lines embedded in the polymer strands; and

control circuitry configured to control the electrical components.

14. The fabric-based item defined in claim 13 wherein the electrical components comprise integrated circuit dies and wherein the conductive lines are bonded to the contact pads.

15. The fabric-based item defined in claim 14 wherein the first strand segments each include a respective one of the electrical components.

16. The fabric-based item defined in claim 15 wherein the second strand segments each include a respective one of the conductive lines.

17. A strand of dielectric material formed from joined segments, the strand comprising:
first strand segments that each include first and second parallel metal lines embedded in first polymer strand material, wherein the first polymer strand material has a longitudinal axis, and wherein the first and second metal lines each have a longitudinal axis that is parallel to the longitudinal axis of the first polymer strand material; and
second strand segments that each include a semiconductor die embedded in second polymer strand material.

18. The strand of dielectric material defined in claim 17 wherein the first strand segments each include a third parallel metal line that is embedded in the first polymer strand material and runs parallel to the first and second parallel metal lines of that strand segment.

19. The strand of dielectric material defined in claim 18 wherein the first and second strand segments have circular cross-sectional shapes with rotational alignment structures.

Assignees

• Apple Inc

Inventors

• Keating Steven J
• Sunshine Daniel D
• Grena Benjamin J

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611 Primary

  for connecting multiple chips together · CPC title