Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body

Patent metadata

Field	Value
Publication number	US-11230502-B2
Application number	US-201916354800-A
Country	US
Kind code	B2
Filing date	Mar 15, 2019
Priority date	Mar 23, 2018
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

The composite sintered body includes AlN and MgAl2O4. The open porosity of the composite sintered body is lower than 0.1%. The relative density of the composite sintered body is not lower than 99.5%. The total percentage of the AlN and the MgAl2O4 contained in the composite sintered body is not lower than 95 weight percentage and not higher than 100 weight percentage. The percentage of the MgAl2O4 contained in the composite sintered body is not lower than 15 weight percentage and not higher than 70 weight percentage. It is thereby possible to provide a high-density composite sintered body having high plasma corrosion resistance, high volume resistivity, and high thermal conductivity.

First claim

The invention claimed is:

1. A composite sintered body, comprising:
aluminum nitride; and
spinel,
wherein the open porosity is lower than 0.1%,
the relative density is not lower than 99.5%,
the total percentage of said aluminum nitride and said spinel contained in said composite sintered body is not lower than 95 weight percentage and not higher than 100 weight percentage, and
the percentage of said spinel contained in said composite sintered body is not lower than 15 weight percentage and not higher than 70 weight percentage.

2. The composite sintered body according to claim 1 , wherein
the percentage of magnesium oxide as a constituent crystal phase contained in said composite sintered body is substantially 0 weight percentage.

3. The composite sintered body according to claim 1 , wherein the lattice constant of said spinel is not lower than 8.075 angstrom.

4. The composite sintered body according to claim 1 , wherein
magnesium is solid-solved in said aluminum nitride.

5. The composite sintered body according to claim 1 , wherein
assuming that the plasma etching rate of a sintered body containing aluminum nitride in an amount of 100 weight percentage is 1, the plasma etching rate of said composite sintered body is not higher than 0.5.

6. The composite sintered body according to claim 1 , wherein the volume resistivity at 700° C. is not lower than 7.0×10 7 Ω·cm.

7. The composite sintered body according to claim 1 , wherein the thermal conductivity at 600° C. is not lower than 15 W/m K.

8. A semiconductor manufacturing apparatus member used in a semiconductor manufacturing apparatus, being formed by using said composite sintered body according to claim 1 .

9. The semiconductor manufacturing apparatus member according to claim 8 , comprising:
a plate-like main body formed by using said composite sintered body, having an upper surface on which a semiconductor substrate is placed;
a resistance heating element disposed inside said main body; and
an internal electrode disposed between said resistance heating element and said upper surface of said main body inside said main body.

10. A method of manufacturing the composite sintered body according to claim 1 , comprising the steps of:
a) molding mixed powder in which aluminum nitride and an additive containing magnesium and aluminum are mixed, into a green body having a predetermined shape; and
b) generating a composite sintered body containing aluminum nitride and spinel by hot-press sintering of said green body,
wherein the total percentage of said aluminum nitride and said additive contained in said mixed powder is not lower than 95 weight percentage and not higher than 100 weight percentage in said operation a), and
said mixed powder contains
magnesium in an amount of not lower than 5 weight percentage and not higher than 18 weight percentage in terms of magnesium oxide, and
aluminum in an amount of not lower than 10 weight percentage and not higher than 44 weight percentage in terms of aluminum oxide.

11. The method of manufacturing a composite sintered body according to claim 10 , wherein
said additive contains spinel and magnesium oxide.

12. The method of manufacturing a composite sintered body according to claim 10 , wherein said additive contains magnesium oxide and aluminum oxide.

13. The composite sintered body according to claim 1 , wherein the percentage of said spinel contained in said composite sintered body is not lower than 18 weight percentage.

Assignees

• Ngk Insulators Ltd

Inventors

• Yagi En
• Katsuda Yuji

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• C04B35/443 Primary

  Magnesium aluminate spinel · CPC title

• C04B2235/3222

  Aluminates other than alumino-silicates, e.g. spinel (MgAl2O4) · CPC title