Systems, devices and methods for spark plasma sintering

US11229950B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11229950-B2
Application numberUS-201815959617-A
CountryUS
Kind codeB2
Filing dateApr 23, 2018
Priority dateApr 21, 2017
Publication dateJan 25, 2022
Grant dateJan 25, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of forming an article including: contacting a fugitive tool with a powdered parent material; densifying the powdered material; and destructively removing the fugitive tool. A coating of a different material may be formed against the parent material using a similar approach.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming an article comprising: contacting a porous fugitive tool comprising a carbonaceous material, a silica based ceramic, or a ceramic comprising alumina, zircon and/or cristobalite with a powdered parent material; densifying the powdered material; and destructively removing the porous fugitive tool, wherein densifying employs spark plasma sintering (SPS) and destructively removing the tool comprises burning in air or leaching with a hot caustic solution; wherein the parent material has nanoscale morphology. 2. The method of claim 1 , wherein the porous fugitive tool is embedded in the powdered parent material. 3. The method of claim 1 , further comprising placing the porous fugitive tool in contact with a non-fugitive tool. 4. A method of forming a coating comprising applying a coating material to a porous fugitive tool comprising a carbonaceous material, a silica based ceramic, or a ceramic comprising alumina, zircon and/or cristobalite; placing powdered parent material in contact with the coating material on the porous fugitive tool; densifying the powdered parent material and destructively removing the porous fugitive tool, wherein densifying employs spark plasma sintering (SPS) and destructively removing the tool comprises burning in air or leaching with a hot caustic solution; wherein the parent material has nanoscale morphology. 5. The method of claim 4 , wherein the porous fugitive tool is embedded in the powdered parent material. 6. The method of claim 4 , further comprising placing the porous fugitive tool in contact with a non-fugitive tool. 7. The method of claim 4 , wherein the coating imparts catalytic reactivity to the surface of the densified parent material. 8. A method of locating an interior component comprising contacting a component with a porous fugitive tool comprising a carbonaceous material, a silica based ceramic, or a ceramic comprising alumina, zircon and/or cristobalite; placing the porous fugitive tool in a non-fugitive tool; placing powdered parent material in contact with the porous fugitive tool; densifying the powdered parent material and destructively removing the porous fugitive tool wherein densifying employs spark plasma sintering (SPS) and destructively removing the tool comprises burning in air or leaching with a hot caustic solution. 9. The method of claim 8 , wherein the porous fugitive tool is embedded in the powdered parent material. 10. The method of claim 8 , further comprising placing the porous fugitive tool in contact with the non-fugitive tool. 11. The method of claim 8 , wherein the parent material has nanoscale morphology.

Assignees

Inventors

Classifications

  • B22F3/105Primary

    by using electric current {other than for infrared radiant energy}, laser radiation or plasma (B22F3/11 takes precedence){; by ultrasonic bonding (B22F3/115 takes precedence)} · CPC title

  • with separating means for articles to be sintered · CPC title

  • Thermal after-treatment · CPC title

  • Aspects linked to processes or compositions used in powder metallurgy · CPC title

  • Applying a current during sintering, e.g. plasma sintering [SPS], electrical resistance heating or pulse electric current sintering [PECS] · CPC title

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Frequently asked questions

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What does patent US11229950B2 cover?
A method of forming an article including: contacting a fugitive tool with a powdered parent material; densifying the powdered material; and destructively removing the fugitive tool. A coating of a different material may be formed against the parent material using a similar approach.
Who is the assignee on this patent?
Mikro Systems Inc, Raytheon Tech Corp
What technology area does this patent fall under?
Primary CPC classification B22F3/105. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 25 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).