Housing, electronic device, method for manufacturing housing, and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-11229129-B2
Application number	US-202017136159-A
Country	US
Kind code	B2
Filing date	Dec 29, 2020
Priority date	Mar 25, 2019
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space interposed. The side surface part is provided around the first space and is connected to the upper surface part and the lower surface part. The upper surface part and the side surface part include a first material. The lower surface part includes a second material that is softer than the first material. A portion that includes the second material is exposed for at least a portion of the contact surface.

First claim

What is claimed is:

1. A housing, comprising:
a lower surface part including a contact surface contacting an adherend;
an upper surface part separated in a vertical direction from the lower surface part with a first space interposed;
a side surface part provided around the first space and connected to the upper surface part and the lower surface part,
the upper surface part and the side surface part including a first material,
the lower surface part including a second material,
the second material being a resin material that is softer than the first material,
a portion of the lower surface part that includes the second material being exposed for at least a portion of the contact surface.

2. The housing according to claim 1 , wherein
the lower surface part is formed of the second material and is bonded to the side surface part.

3. The housing according to claim 2 , wherein
at least a portion of the lower surface part overlaps the side surface part in a direction perpendicular to the vertical direction.

4. The housing according to claim 2 , wherein
one edge of a bonding surface between the lower surface part and the side surface part is positioned at the contact surface.

5. The housing according to claim 1 , wherein
the first material includes a resin material, and
a crosslink density of the second material is less than a crosslink density of the first resin material.

6. The housing according to claim 1 , wherein
the first material includes at least one of silicone, urethane, epoxy, Teflon (registered trademark), polycarbonate, nylon, or acrylic, and
the second material includes at least one of a silicone gel, a urethane gel, or an acrylic gel.

7. An electronic device, comprising:
the housing according to claim 1 ;
an electronic component provided inside the first space.

8. A housing, comprising:
a first housing structure including
a first lower surface part including a first contact surface contacting an adherend,
a first upper surface part separated in a vertical direction from the first lower surface part with a first space interposed, and
a first side surface part provided around the first space and connected to the first upper surface part and the first lower surface part;

a second housing structure including
a second lower surface part including a second contact surface contacting the adherend,
a second upper surface part separated in the vertical direction from the second lower surface part with a second space interposed, and
a second side surface part provided around the second space and connected to the second upper surface part and the second lower surface part; and

a coupler connected to the first housing structure and the second housing structure,
the first space and the second space communicating with each other in a third space inside the coupler.

9. The housing according to claim 8 , wherein
the first upper surface part, the first side surface part, the second upper surface part, and the second side surface part include a first material,
the first lower surface part and the second lower surface part include a second material, and
the second material is a resin material that is softer than the first material.

10. The housing according to claim 9 , wherein
the first material includes a resin material, and
a crosslink density of the second material is less than a crosslink density of the first resin material.

11. An electronic device, comprising:
the housing according to claim 8 ;
a first electronic component provided inside the first space; and
a second electronic component provided inside the second space.

12. The electronic device according to claim 11 , wherein
wiring is provided in the third space of the coupler and connects the first electronic component and the second electronic component.

13. A method for manufacturing a housing, the method comprising:
bonding a second member to a second housing part of a first member to define a first space surrounded with the first and second members, the first member including a first housing part and the second housing part, the second housing part being connected to an outer perimeter of the first housing part, the first member including a first material, the second member including a second material that is softer than the first material.

14. The method for manufacturing the housing according to claim 13 , wherein
the first material includes a first resin material, and
the second material is a resin material having a lower crosslink density than the first resin material.

15. A method for manufacturing an electronic device, the method comprising:
bonding a second member to a second housing part of a first member in a state in which a device is provided in a first space surrounded with the first and second members, the first member including a first housing part and the second housing part, the second housing part being connected to an outer perimeter of the first housing part, the first member including a first material, the second member including a second material that is softer than the first material.

16. The method for manufacturing the electronic device according to claim 15 , wherein
the first material includes a first resin material, and
the second material is a resin material having a lower crosslink density than the first resin material.

Assignees

• Toshiba Kk

Inventors

• Komatsu Izuru
• Asagiri Satoru

Classifications

• A61B2562/187

  Strain relief means · CPC title

• A61B2562/164

  the sensor is mounted in or on a conformable substrate or carrier · CPC title

• A61B2562/12

  Manufacturing methods specially adapted for producing sensors for in-vivo measurements · CPC title

• A61B2560/0412

  Low-profile patch shaped housings · CPC title

• A61B5/6833

  Adhesive patches · CPC title