Mask plate, method for forming via-hole, method for forming display substrate, the display substrate, and display device

US11226550B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11226550-B2
Application numberUS-201816083243-A
CountryUS
Kind codeB2
Filing dateJan 11, 2018
Priority dateJun 14, 2017
Publication dateJan 18, 2022
Grant dateJan 18, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a mask plate, a method for forming a via-hole, a method for forming a display substrate, the display substrate, and a display device. The mask plate is configured to form the via-hole in a layer, and includes a transparent pattern for the formation of the via-hole. The transparent pattern includes one or more curved edge, so the via-hole formed using the mask plate is provided with one or more curved edges at its bottom.

First claim

Opening claim text (preview).

What is claimed is: 1. A mask plate for forming a via-hole in a layer, comprising a transparent pattern for the formation of the via-hole, wherein the transparent pattern comprises one or more curved edges, wherein the transparent pattern comprises one or more serrated or rippled edges, wherein the transparent pattern comprises a body portion and a plurality of teeth arranged on the body portion, wherein a width of each tooth in a direction perpendicular to an extension direction of a tip of each tooth is reduced gradually from a first value greater than a resolution of an exposure machine to a second value smaller than the resolution of the exposure machine in the extension direction, and the exposure machine is configured to form the via-hole. 2. The mask plate according to claim 1 , wherein the transparent pattern is approximately of a square or circular shape. 3. The mask plate according to claim 1 , wherein a gradient angle of the via-hole is smaller than or equal to 50°. 4. A method for forming a via-hole, comprising: providing a layer; and forming the via-hole in the layer using a mask plate for forming the via-hole in the layer, comprising a transparent pattern for the formation of the via-hole, wherein the transparent pattern comprises one or more curved edges, wherein the transparent pattern comprises one or more serrated or rippled edges, wherein the transparent pattern comprises a body portion and a plurality of teeth arranged on the body portion, wherein a width of each tooth in a direction perpendicular to an extension direction of a tip of each tooth is reduced gradually from a first value greater than a resolution of an exposure machine to a second value smaller than the resolution of the exposure machine in the extension direction, and the exposure machine is configured to form the via-hole. 5. The method according to claim 4 , wherein when the layer is made of a photoresist material, the forming the via-hole in the layer comprises: placing the mask plate above the layer; and exposing the layer so as to form the via-hole in the layer. 6. The method according to claim 4 , wherein when the layer is not made of the photoresist material, the forming the via-hole in the layer comprises: forming a photoresist layer on the layer; placing the mask plate above the photoresist layer; exposing and developing the photoresist layer, so as to form a photoresist reserved region and a photoresist unreserved region; and etching a portion of the layer at the photoresist unreserved region, so as to form the via-hole in the layer. 7. A method for forming a display substrate, comprising forming a via-hole in a layer of the display substrate using the method according to claim 4 . 8. A display substrate, comprising a layer and a via-hole formed in the layer using the method according to claim 4 , wherein a cross section of the via-hole has one or more curved edges. 9. The display substrate according to claim 8 , wherein the cross section of the via-hole has one or more rippled edges. 10. The display substrate according to claim 8 , wherein the layer comprises at least one insulation layer. 11. The display substrate according to claim 10 , wherein when the at least one insulation layer is a passivation (PVX) layer and the via-hole is of a square shape, a length of each side of the via-hole is smaller than 10 μm. 12. The display substrate according to claim 10 , wherein when the at least one insulation layer is a PVX layer and the via-hole is of a circular shape, a diameter of the via-hole is smaller than 10 μm. 13. The display substrate according to claim 10 , wherein when the at least one insulation layer is an organic (ORG) layer and the via-hole is of a square shape, a length of each side of the via-hole is smaller than 25 μm. 14. The display substrate according to claim 10 , wherein when the at least one insulation layer is an ORG layer and the via-hole is of a circular shape, a diameter of the via-hole is smaller than 25 μm. 15. A display device, comprising the display substrate according to claim 8 . 16. The display device according to claim 15 , wherein the display substrate is an array substrate. 17. The display device according to claim 16 , wherein the array substrate is a Color Filter on Array (COA) array substrate.

Assignees

Inventors

Classifications

  • having a particular composition, shape or crystalline structure of the active layer · CPC title

  • using masks, e.g. half-tone masks · CPC title

  • wherein the TFTs are in active matrices · CPC title

  • adapted for preventing breakage, peeling or short circuiting · CPC title

  • Through-hole connection of the pixel electrode to the active element through an insulation layer · CPC title

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What does patent US11226550B2 cover?
The present disclosure provides a mask plate, a method for forming a via-hole, a method for forming a display substrate, the display substrate, and a display device. The mask plate is configured to form the via-hole in a layer, and includes a transparent pattern for the formation of the via-hole. The transparent pattern includes one or more curved edge, so the via-hole formed using the mask pla…
Who is the assignee on this patent?
Boe Technology Group Co Ltd, Chongqing Boe Optoelectronics Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F1/36. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).