Controlled-emissivity face heated by non-resistive heat source

US11226236B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11226236-B2
Application numberUS-201716074896-A
CountryUS
Kind codeB2
Filing dateApr 21, 2017
Priority dateApr 21, 2017
Publication dateJan 18, 2022
Grant dateJan 18, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an example, an apparatus is described that includes a non-resistive heat source, a thermally conductive face, and a temperature detector. The thermally conductive face has a controlled long-wave infrared emissivity and is in thermal contact with the non-resistive heat source. The temperature detector is positioned to detect a temperature of the thermally conductive face.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: a non-resistive heat source; a thermally conductive face having a controlled long-wave infrared emissivity, wherein the thermally conductive face is in thermal contact with the non-resistive heat source; and a temperature detector positioned to detect a temperature of the thermally conductive face. 2. The apparatus of claim 1 , wherein the non-resistive heat source comprises a transistor. 3. The apparatus of claim 1 , wherein the thermally conductive face comprises an aluminum plate that has been coated with a layer of material having a known emissivity. 4. The apparatus of claim 1 , wherein the controlled long-wave infrared emissivity is diffuse and uniform across an entire surface of the thermally conductive face. 5. The apparatus of claim 1 , further comprising: a printed circuit board positioned to support the non-resistive heat source and the temperature detector; and a thermally conductive interface positioned between the thermally conductive face and the printed circuit board. 6. The apparatus of claim 5 , wherein the thermally conductive interface is electrically non-conductive. 7. The apparatus of claim 5 , further comprising: a spacer positioned to hold the thermally conductive face flat above the printed circuit board. 8. The apparatus of claim 1 , wherein the apparatus is deployed within a three-dimensional printer. 9. A method, comprising: determining an expected value describing heat emitted by an emitter face having a known emissivity, based on a measurement of a temperature of the emitter face; comparing a measurement taken by a non-contact thermal measurement device to the expected value; and determining, based on the comparing, whether the non-contact thermal measurement device is functioning properly. 10. The method of claim 9 , further comprising: heating the emitter face to a setpoint using a non-resistive heat source, prior to the determining the expected value. 11. The method of claim 9 , wherein the determining whether the non-contact thermal measurement device is functioning properly comprises: concluding that the non-contact thermal measurement device is functioning properly when the measurement taken by a non-contact thermal measurement device is within a predefined variance of the expected value. 12. The method of claim 9 , wherein the determining whether the non-contact thermal measurement device is functioning properly comprises: concluding that the non-contact thermal measurement device is not functioning properly when the measurement taken by a non-contact thermal measurement device is not within a predefined variance of the expected value. 13. A non-transitory machine-readable storage medium encoded with instructions executable by a processor, the machine-readable storage medium comprising: instructions to determine an expected value describing heat emitted by an emitter face having a known emissivity, based on a measurement of a temperature of the emitter face; instructions to a measurement taken by a non-contact thermal measurement device to the expected value; and instructions to determine, based on the comparing, whether the non-contact thermal measurement device is functioning properly. 14. The non-transitory machine-readable storage medium of claim 13 , wherein the instructions to determine whether the non-contact thermal measurement device is functioning properly comprise: instructions to conclude that the non-contact thermal measurement device is functioning properly when the measurement taken by a non-contact thermal measurement device is within a predefined variance of the expected value. 15. The non-transitory machine-readable storage medium of claim 13 , wherein the instructions to determine whether the non-contact thermal measurement device is functioning properly comprises: instructions to conclude that the non-contact thermal measurement device is not functioning properly when the measurement taken by a non-contact thermal measurement device is not within a predefined variance of the expected value.

Assignees

Inventors

Classifications

  • Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing · CPC title

  • G01J5/026Primary

    Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control · CPC title

  • Heating; Thermostating · CPC title

  • Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity (for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801) · CPC title

  • Absorbing heated plate or film and temperature detector · CPC title

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Frequently asked questions

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What does patent US11226236B2 cover?
In an example, an apparatus is described that includes a non-resistive heat source, a thermally conductive face, and a temperature detector. The thermally conductive face has a controlled long-wave infrared emissivity and is in thermal contact with the non-resistive heat source. The temperature detector is positioned to detect a temperature of the thermally conductive face.
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification G01J5/026. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).