Local connection device with controlled separation comprising a multidirectional bonding layer

Patent metadata

Field	Value
Publication number	US-11225340-B2
Application number	US-201916556755-A
Country	US
Kind code	B2
Filing date	Aug 30, 2019
Priority date	Aug 31, 2018
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

To enable a local connection with separation on command, a connection device (20) comprises a first base plate (24), a first connection wall (22) forming a protuberance from the first base plate (24) and having an internal surface (22A) delimiting an internal volume (V) located on the side of the first base plate, on a first side, and a first connection surface (22B), a second base plate (28), a second connection wall (26) fixed to the second base plate on a second side and with a second connection surface (26A) covering the first connection wall (22) so as to form a space (S) between the first and second connection surfaces, a bonding layer (30) arranged in the space and extending along at least two distinct directions, and a heat generating material (32) arranged in an internal volume so as to enable heating of the bonding layer.

First claim

The invention claimed is:

1. A connection device ( 20 ) designed to connect a first element ( 18 ) and a second element ( 16 ) and to separate the first and second elements from each other on command, the device comprising:
a first base plate ( 24 ) that can be used to fasten the connection device ( 20 ) onto a surface of the first element ( 18 ),
a first connection wall ( 22 ) forming a protuberance from the first base plate ( 24 ) and having an internal surface ( 22 A) delimiting an internal volume (V) located on the side of the first base plate ( 24 ) on a first side, and a first connection surface ( 22 B) located on a second side opposite the first side,
a second base plate ( 28 ) that can be used to fasten the connection device ( 20 ) onto a surface of the second element ( 16 ),
a second connection wall ( 26 ) fixed to the second base plate ( 28 ) and having a second connection surface ( 26 A) covering the first connection wall ( 22 ) so as to form a space (S) between the first and second connection surfaces ( 22 B, 26 A),
a bonding layer ( 30 ) composed of a layer of adhesive material or a weld, formed in said space (S) in contact with each of the first and second connection surfaces ( 22 B, 26 A), such that the shape of the bonding layer ( 30 ) is such that, when viewed in a section in any plane locally orthogonal to the first base plate ( 24 ), the bonding layer ( 30 ) extends along at least two distinct directions, and
a heat-generating material ( 32 ) arranged in the internal volume (V) so as to heat the bonding layer ( 30 ) by thermal conduction through the first connection wall ( 22 ).

2. The connection device according to claim 1 , wherein the shape of the second connection surface ( 26 A) is homothetic with the shape of the first connection surface ( 22 B).

3. The connection device according to claim 1 , wherein the shape of the bonding layer ( 30 ) is symmetric relative to an axis (A) and is such that, when seen in section in any plane containing the axis (A), the bonding layer ( 30 ) extends along at least two distinct directions.

4. The connection device according to claim 3 , wherein the shape of a section through the bonding layer ( 30 ) centred on the axis (A) is a flat or curved bottom U ( 40 ) with parallel or divergent sides ( 42 ), or is in the form of a dome, a cone or a truncated part of a cone.

5. The connection device according to claim 1 , also comprising an inert support ( 44 ) housed in the internal volume (V) and having an external surface ( 44 A) facing the first connection wall ( 22 ), and the heat-generating material ( 32 ) is arranged in the form of a layer with two opposite surfaces ( 32 A, 32 B) that are respectively facing the external surface ( 44 A) of the inert support ( 44 ) and the internal surface ( 22 A) of the first connection wall ( 22 ).

6. The connection device according to claim 5 , wherein the shape of the external surface ( 44 A) of the inert support ( 44 ) is homothetic with the shape of the internal surface ( 22 A) of the first connection wall ( 22 ).

7. The connection device according to claim 5 , wherein the two opposite surfaces ( 32 A, 32 B) respectively contact the external surface ( 44 A) of the inert support ( 44 ) and face the internal surface ( 22 A) of the first connection wall ( 22 ).

8. The connection device according to claim 7 , wherein the two opposite surfaces ( 32 A, 32 B) respectively contact the external surface ( 44 A) of the inert support ( 44 ) and the internal surface ( 22 A) of the first connection wall ( 22 ).

9. The connection device according to claim 1 , wherein the first base plate ( 24 ) comprises a mounting plate ( 24 A) provided with an orifice ( 24 B) opening up in the internal volume (V) and fixed to the first connection wall ( 22 ), and a cover ( 24 C) installed in the orifice ( 24 B) so as to close off the orifice ( 24 B), such that the internal volume (V) is defined between the internal surface ( 22 A) of the first connection wall ( 22 ) and the cover ( 24 C).

10. An assembly comprising two elements ( 16 , 18 ) with surfaces, on which are fixed respectively the first base plate ( 24 ) and the second base plate ( 28 ) of at least one connection device ( 20 ) according to claim 1 that thus connects the two elements ( 16 , 18 ) to each other.

11. An aircraft ( 60 ) or spacecraft ( 10 ), comprising at least one assembly according to claim 10 .

12. The aircraft ( 60 ) or spacecraft ( 10 ) according to claim 11 , wherein the two elements ( 16 , 18 ) are a payload and a payload dispenser respectively.

13. The aircraft ( 60 ) or spacecraft ( 10 ) according to claim 12 , wherein the two elements ( 16 , 18 ) are connected to each other by a plurality of the connection devices ( 20 ).

14. The aircraft ( 60 ) or spacecraft ( 10 ) according to claim 12 , comprising at least one other payload connected to the payload dispenser by at least one other connection device ( 20 ).

Assignees

• Arianegroup Sas

Inventors

• Medina Felipe
• Glavier Ludovic

Classifications

• B64G1/641 Primary

  Interstage or payload connectors (docking systems B64G1/646) · CPC title

• B64G1/6455

  Pyrotechnics; Using heat · CPC title

• B64G1/643

  for arranging multiple satellites in a single launcher · CPC title

• F16B5/08

  by means of welds or the like (welding B23K) · CPC title

• F42B15/38

  Ring-shaped explosive elements for the separation of rocket parts {(systems for coupling or separating cosmonautic vehicles or parts thereof B64G1/64)} · CPC title