Method for moving a movable platen

US11225007B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11225007-B2
Application numberUS-201816165558-A
CountryUS
Kind codeB2
Filing dateOct 19, 2018
Priority dateOct 23, 2017
Publication dateJan 18, 2022
Grant dateJan 18, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for moving a movable mold mounting plate of a molding machine, wherein the movable mold mounting plate is movable relative to a stationary mold mounting plate and the mold mounting plates are kinematically connected to each other, wherein molding tool parts arranged on the mold mounting plates are brought into abutment to each other in a closed state and wherein the movable mold mounting plate is moved by a drive mechanism and/or the stationary mold mounting plate is moved by an injection device such that, when reaching a predeterminable distance of the mold mounting plates relative to each other, a parameter representing a tilting movement of the mold mounting plates relative to each other is less than or equal to a presettable value.

First claim

Opening claim text (preview).

The invention claimed is: 1. A molding machine, comprising: a stationary mold mounting plate; a movable mold mounting plate which is movable relative to the stationary mold mounting plate; a drive mechanism for moving the movable mold mounting plate; a controlling or regulating device; an injection device; and a first molding tool part on the stationary mold mounting plate and a second molding tool part on the movable mold mounting plate, the first molding tool part and the second molding tool part being configured to be brought into abutment to each other in a closed state, wherein: the stationary mold mounting plate and the movable mold mounting plate are kinematically connected to each other; the drive mechanism is configured to be controlled or regulated by the controlling or regulating device; the controlling or regulating device is configured to move the movable mold mounting plate by the drive mechanism and/or the stationary mold mounting plate by the injection device such that, when reaching a predeterminable distance of the stationary mold mounting plate and the movable mold mounting plate relative to each other, a parameter representing a tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other is less than or equal to a presettable value; the predeterminable distance of the stationary mold mounting plate and the movable mold mounting plate relative to each other is configured such that at least one guide bolt of the first molding tool part enters into at least one guide bore defined in the second molding tool part before reaching the closed state; and the drive mechanism is configured to move the movable mold mounting plate in accordance with a corrected target path and/or changed commands for the drive mechanism, wherein the corrected target path and/or the changed commands for the drive mechanism result from: a target path for the movable mold mounting plate; a correction of the target path for the movable mold mounting plate and/or a change of commands for the drive mechanism, whereby the correction—taking into consideration the tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other—guarantees that, when reaching the predeterminable distance of the stationary mold mounting plate and the movable mold mounting plate relative to each other, the parameter representing the tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other is less than or equal to the presettable value; and the drive mechanism is configured to move the movable mold mounting plate between an open position and a position before reaching the closed state in accordance with the corrected target path and/or the changed commands for the drive mechanism equal to the presettable value. 2. The molding machine according to claim 1 , wherein the stationary mold mounting plate and the movable mold mounting plate are configured such that a temporally changeable tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other occurs by movement of the movable mold mounting plate. 3. The molding machine according to claim 2 , wherein a relative angle between the stationary mold mounting plate and the movable mold mounting plate is the parameter representing the tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other. 4. The molding machine according to claim 2 , wherein the predeterminable distance of the stationary mold mounting plate and the movable mold mounting plate relative to each other is zero. 5. The molding machine according to claim 2 , wherein the molding machine is configured to measure the temporally changeable tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other. 6. The molding machine according to claim 1 , wherein the drive mechanism is configured to perform the correction of the target path and/or the change of commands either in real time or in accordance with a preliminarily generated movement profile for the movable mold mounting plate. 7. The molding machine according to claim 2 , wherein the molding machine is configured to perform an automatic determination of the predeterminable distance of the stationary mold mounting plate and the movable mold mounting plate relative to each other. 8. The molding machine according to claim 1 , further comprising a sensor for detecting the tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other, wherein the sensor is configured to transmit signals of the sensor to the controlling or regulating device. 9. The molding machine according to claim 1 , wherein the presettable value is equal to zero. 10. The molding machine according to claim 1 , wherein the molding machine is configured to minimize the tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other in the target path for the movable mold mounting plate. 11. The molding machine according to claim 5 , wherein the molding machine is configured to display the temporally changeable tilting movement of the stationary mold mounting plate and the movable mold mounting plate relative to each other.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11225007B2 cover?
A method for moving a movable mold mounting plate of a molding machine, wherein the movable mold mounting plate is movable relative to a stationary mold mounting plate and the mold mounting plates are kinematically connected to each other, wherein molding tool parts arranged on the mold mounting plates are brought into abutment to each other in a closed state and wherein the movable mold mounti…
Who is the assignee on this patent?
Engel Austria Gmbh
What technology area does this patent fall under?
Primary CPC classification B29C45/80. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).