Flexible and conformal electronics using rigid substrates

Patent metadata

Field	Value
Publication number	US-11224124-B2
Application number	US-201916685578-A
Country	US
Kind code	B2
Filing date	Nov 15, 2019
Priority date	Jul 14, 2016
Publication date	Jan 11, 2022
Grant date	Jan 11, 2022

Abstract

A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.

First claim

What is claimed is:

1. A method, comprising:
geometrically modifying a single-piece substrate to include two regions of rigidity separated by a localized region of flexibility, the localized region of flexibility having a lower rigidity than the two regions of rigidity, the localized region of flexibility including a plurality of compliant joints, the plurality of compliant joints including at least one lamina emergent torsional (LET) joint; and
configuring the plurality of compliant joints including the at least one LET joint to form a hinge to angularly deflect, repeatedly, the two regions of rigidity from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate, and from the non-planar configuration of the single-piece substrate to the planar configuration of the single-piece substrate.

2. The method of claim 1 , wherein the localized region of flexibility elastically accommodates substantially all stresses and strains in the single-piece substrate caused by angular deflection of the two regions of rigidity.

3. The method of claim 1 , wherein the localized region of flexibility is a geometrically modified region of the single-piece substrate.

4. The method of claim 3 , wherein the plurality of compliant joints include at least one compliant joint formed by geometrical shaping of the single-piece substrate.

5. The method of claim 4 , wherein the at least one compliant joint formed by geometrical shaping of the single-piece substrate is a LET joint.

6. The method of claim 4 , wherein the at least one compliant joint formed by geometrical shaping of the single-piece substrate includes an array of LET joints as least one of in series or in parallel.

7. The method of claim 1 , wherein the at least one LET joint includes two torsional members and two bending members as sides of a rectangle circumscribing a rectangular slot cut in the localized region of flexibility.

8. The method of claim 7 , wherein the at least one LET joint is configured to transfer a bending load associated with angular deflection of the two regions of rigidity and applied to the at least one LET joint as a torsional load on the two torsional members of the at least one LET joint.

9. The method of claim 1 , wherein the single-piece substrate is a conductor clad substrate.

10. The method of claim 1 , further comprising:
disposing an electrically conducting trace running across the localized region of flexibility to provide an electrical connection to at least one electronic component mounted on at least one of the two regions of rigidity.

11. The method of claim 1 , wherein the single-piece substrate, includes a plurality of localized regions of flexibility disposed along fold axes of an origami pattern.

12. A method, comprising:
forming a localized region of flexibility separating two regions of rigidity in a printed circuit board, the localized region of flexibility having a lower rigidity than the two regions of rigidity, the localized region of flexibility separating the two regions of rigidity, the localized region of flexibility including a plurality of compliant joints, the plurality of compliant joints including at least one lamina emergent torsional (LET) joint; and
configuring the plurality of compliant joints including the at least one LET joint to form a hinge to angularly deflect the two regions of rigidity, repeatedly, from a planar configuration of the printed circuit board to a non-planar configuration of the printed circuit board, and from the non-planar configuration of the printed circuit board to the planar configuration of the printed circuit board,
at least one of the two regions of rigidity of the printed circuit board is configured to receive an electronic device component mounted thereon.

13. The method of claim 12 , wherein the localized region of flexibility elastically accommodates substantially all stresses and strains in the printed circuit board caused by angular deflection of the two regions of rigidity.

14. The method of claim 12 , wherein the plurality of compliant joints include at least one geometrically shaped compliant joint in the printed circuit board.

15. The method of claim 14 , wherein the at least one geometrically shaped compliant joint in the printed circuit board includes at least one LET joint.

16. The method of claim 15 , wherein the at least one LET joint includes:
two torsional members and two bending members as sides of a rectangle circumscribing a rectangular slot cut in the localized region of flexibility, and wherein the at least one LET joint transfers a bending load associated with angular deflection of the two regions of rigidity and applied to the LET joint as a torsional load on the two torsional members of the at least one LET joint.

17. The method of claim 12 , further comprising:
an electrically conducting trace running across the localized region of flexibility.

18. The method of claim 12 , wherein the localized region of flexibility includes a plurality of localized regions of flexibility along fold axes of an origami pattern.

19. A method, comprising:
geometrically modifying a single-piece substrate by disposing a plurality of compliant joints including at least one lamina emergent torsional (LET) joint in a localized region of flexibility separating two regions of rigidity, the localized region of flexibility having a lower rigidity than the two regions of rigidity; and
configuring the plurality of compliant joints including the at least one LET joint as a hinge to angularly deflect the two regions of rigidity, repeatedly, by more than 90° from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate.

20. The method of claim 19 , further comprising:
configuring the localized region of flexibility separating the two regions of rigidity as a hinge to angularly deflect the two regions of rigidity, repeatedly, by 180°.

Assignees

• Brigham Young Univ Byu
• Univ Brigham Young

Inventors

• Defigueiredo Bryce Parker
• Magleby Spencer
• Howell Larry

Classifications

• H10F19/00

  Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules · CPC title

• H05K1/148

  Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means · CPC title

• H02S40/36

  characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H02S30/20 Primary

  Collapsible or foldable PV modules · CPC title