Modulated thermal conductance thermal enclosure
US-10593967-B2 · Mar 17, 2020 · US
Modulated thermal conductance thermal enclosure
US11223054B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11223054-B2 |
| Application number | US-202016781133-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 4, 2020 |
| Priority date | Jun 30, 2016 |
| Publication date | Jan 11, 2022 |
| Grant date | Jan 11, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposed in the gap.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method comprising: pressing a porous material between two plates such that the plates are separated from each other by a gap defined by the porous material; including a vapor generating material in the gap; and in a partial vacuum, depositing a conformal sealing layer to cover the porous material in the gap between the two plates to form a gas seal of the porous material and vapor generating material from ambient and maintain the partial vacuum. 2. The method of claim 1 , wherein the porous material comprises a mixture of fumed silica, fiberglass, and silicon carbide. 3. The method of claim 1 , wherein the vapor generating material comprises cyclohexane, 1-Butanol, Cyclohexane, Ethanol, Ethyl acetate, or water vapor. 4. The method of claim 1 , wherein the sealing layer comprises a polymer material and a metal layer disposed between the polymer layer and ambient. 5. The method of claim 1 , wherein the vapor generating material has a pressure vs. temperature relationship that modulates the thermal conductance of the vapor in the gap between the enclosure plates.
Assignees
Inventors
Classifications
- H01M8/04067Primary
Heat exchange or temperature measuring elements, thermal insulation, e.g. heat pipes, heat pumps, fins · CPC title
Fuel cells · CPC title
- H01M8/2475Primary
Enclosures, casings or containers of fuel cell stacks · CPC title
Fuel cells in portable systems, e.g. mobile phone, laptop · CPC title
related to heat exchange · CPC title
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Frequently asked questions
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- What does patent US11223054B2 cover?
- A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material dispo…
- Who is the assignee on this patent?
- Honeywell Int Inc
- What technology area does this patent fall under?
- Primary CPC classification H01M8/04067. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 11 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).