Aluminum alloy compositions and methods of making and using the same

Patent metadata

Field	Value
Publication number	US-11220729-B2
Application number	US-201615160926-A
Country	US
Kind code	B2
Filing date	May 20, 2016
Priority date	May 20, 2016
Publication date	Jan 11, 2022
Grant date	Jan 11, 2022

Abstract

The present disclosure concerns embodiments of aluminum alloy compositions exhibiting microstructural stability and strength at high temperatures. The disclosed aluminum alloy compositions comprise particular combinations of components that contribute the ability of the compositions to exhibit improved microstructural stability and hot tearing resistance as compared to conventional alloys. Also disclosed herein are embodiments of methods of making and using the alloys.

First claim

We claim:

1. A composition, comprising:
(i) an alloy component comprising
6.6 wt % to 8 wt % copper,
0.18 wt % to 0.3 wt % zirconium,
0.05 wt % to less than 0.5 wt % manganese,
less than 0.1 wt % silicon,
zero to less than 0.01 wt % magnesium,
titanium, and
a balance of aluminum; and

(ii) an amount of a grain refiner component comprising 2 wt % to 6 wt % titanium, 0.5 wt % to 2 wt % boron, and a remainder wt % of aluminum;
wherein any vanadium, if present in the alloy, is provided solely by unavoidable impurities and wherein the composition provides a cast alloy that exhibits an average hot tearing value ranging from 1.5 to 2.5.

2. The composition of claim 1 , further comprising 0.05 wt % to less than 0.2 wt % iron.

3. The composition of claim 2 , wherein the wt % of manganese is greater than the wt % of iron.

4. The composition of claim 1 , wherein the wt % of zirconium is greater than the wt % of titanium present in the alloy component.

5. The composition of claim 1 , further comprising nickel, cobalt, antimony, or a combination thereof.

6. The composition of claim 5 , wherein the nickel is present in an amount ranging from greater than 0 wt % to less than 0.01 wt %; the cobalt is present in an amount ranging from greater than 0 wt % to less than 0.1 wt %; the antimony is present in an amount ranging from greater than 0 wt % to less than 0.1 wt %; or a combination thereof.

7. The composition of claim 1 , wherein the manganese is present in an amount greater than 3 times the amount of silicon present.

8. The composition of claim 1 , wherein the wt % of the manganese ranges from 0.1 wt % to less than 0.5 wt %.

9. The composition of claim 1 , wherein the amount of the grain refiner component is an amount sufficient to provide an additional 0.02 wt % to 0.2 wt % titanium to the composition.

10. The composition of claim 1 , wherein the composition comprises 7 wt % to 8 wt % copper, 0.1 wt % to less than 0.5 wt % manganese, 0.18 wt % zirconium, greater than 0.2 wt % and up to 0.4 wt % titanium, greater than 0 wt % to 0.02 wt % boron, and 85-93 wt % aluminum.

11. The composition of claim 1 , wherein the composition provides a cast alloy comprising strengthening precipitates having an aspect ratio ranging from 30 to 40.

12. An engine component made with the composition of claim 1 .

13. A method for making the composition of claim 1 , comprising:
combining the alloy component with the grain refiner component to provide the composition;
solution treating the composition at a temperature ranging from 525° C. to 540° C.; and
age treating the composition at a temperature ranging from 210° C. to 250° C. or at a temperature ranging from 175° C. to 190° C.

Assignees

• Ut Battelle Llc
• Fca Us Llc
• Nemak Usa Inc

Inventors

• Shyam Amit
• Yamamoto Yukinori
• Shin Dongwon
• Roy Shibayan
• Haynes James A
• Maziasz Philip J
• Sabau Adrian
• Rodriguez-Jasso Andres F
• Gonzalez-Villarreal Jose A
• Talamantes-Silva Jose
• Zhang Lin
• Glaspie Christopher R
• Mirmiran Seyed

Classifications

• C22C21/12

  with copper as the next major constituent · CPC title

• C22C21/16

  with magnesium · CPC title

• C22C21/18 Primary

  with zinc · CPC title

• C22F1/057

  of alloys with copper as the next major constituent · CPC title

• C22C21/14

  with silicon · CPC title