Laminate, blister pack, press-through package, and laminate manufacturing method

US11220390B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11220390-B2
Application numberUS-201816478209-A
CountryUS
Kind codeB2
Filing dateJan 15, 2018
Priority dateJan 24, 2017
Publication dateJan 11, 2022
Grant dateJan 11, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in that order, in which the substrate layer contains any one or more kinds of a polyolefin-based resin, a polyester-based resin or a vinyl-based resin, the intermediate layer contains a polyethylene resin and a modified polyethylene resin, and the intermediate layer has a thickness of 5 μm or more and 50 μm or less.

First claim

Opening claim text (preview).

What is claimed is: 1. A laminate consisting essentially of a substrate layer, an intermediate layer, a fluorine-based resin layer, a second intermediate layer, and a second substrate layer in that order, wherein said substrate layer contains any one or more kinds of a polyolefin-based resin, a polyester-based resin or a vinyl-based resin, said substrate layer has a thickness of 45 μm or more and 100 μm or less, a thickness of said second substrate layer relative to a thickness of said substrate layer is 0.95 times to 1.05 times, each of said intermediate layer and said second intermediate layer consists essentially of a linear low density polyethylene and a maleic anhydride-modified polyethylene, a mixing ratio of the linear low density polyethylene and the maleic anhydride-modified polyethylene is 20:80 to 50:50, said intermediate layer has a thickness of 5 μm or more and 50 μm or less, a thickness of said second intermediate layer relative to a thickness of said intermediate layer is 0.9 times to 1.1 times, said fluorine-based resin layer contains polychlorotrifluoroethylene, said fluorine-based resin layer has a thickness of 40 μm or more and 150 μm or less, and said laminate has a water vapor permeability of 0.5 g/m 2 /24 hours or less. 2. The laminate according to claim 1 , wherein said intermediate layer has a thickness of 10 μm or more and 30 μm or less. 3. A blister container comprising the laminate according to claim 1 . 4. A press-through package comprising the laminate according to claim 1 . 5. A method for manufacturing the laminate according to claim 1 , the method comprising a step of simultaneously melt extrusion-molding a resin to be a raw material of said substrate layer, a resin to be a raw material of said intermediate layer, a resin to be a raw material of said fluorine-based resin layer, a resin to be a raw material of said second intermediate layer, and a resin to be a raw material of said second substrate layer.

Assignees

Inventors

Classifications

  • Manufacture of films or sheets · CPC title

  • comprising vinyl {(co)polymers; comprising acrylic (co)polymers} · CPC title

  • comprising polyesters · CPC title

  • Food packaging · CPC title

  • comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title

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Frequently asked questions

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What does patent US11220390B2 cover?
A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in that order, in which the substrate layer contains any one or more kinds of a polyolefin-based resin, a polyester-based resin or a vinyl-based resin, the intermediate layer contains a polyethylene resin and a modified polyethylene resin, and the intermediate layer has a thickness of 5 μm or more and 50 μ…
Who is the assignee on this patent?
Fujimori Kogyo Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 11 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).