Sintered component

US11219950B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11219950-B2
Application numberUS-201916356572-A
CountryUS
Kind codeB2
Filing dateMar 18, 2019
Priority dateDec 12, 2014
Publication dateJan 11, 2022
Grant dateJan 11, 2022

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a method for manufacturing a sintered component having a hole formed therein, in which a sintered component having no defect, such as cracks, can be manufactured with good productivity and also a reduction in tool life accompanied by forming the hole can be suppressed. The method for manufacturing a sintered component includes a molding step of press-molding a raw material powder containing a metal powder and thus fabricating a green body; a drilling step of forming a hole in the green body using a candle-type drill and thus forming a thin-walled portion, of which a thickness Gt as measured between an inner circumferential surface of the hole and an outer surface of the green body is smaller than a diameter Gd of the hole; and a sintering step of sintering the green body after the drilling step.

First claim

Opening claim text (preview).

The invention claimed is: 1. A sintered component having a first hole extending in an axial direction of the sintered component and a second hole formed in the sintered component and smaller than the first hole, the sintered component comprising: a thin-walled portion having a thickness St as measured between an inner circumferential surface of the second hole and an outer surface of the sintered component smaller than a diameter Sd of the second hole, wherein a ten point medial height Rz of the inner circumferential surface of the second hole is 20 μm or more. 2. The sintered component according to claim 1 , wherein the second hole penetrates from an inner circumferential surface of the first hole to the outer surface of the sintered component. 3. The sintered component according to claim 1 , wherein the sintered component has a cylindrical shape, wherein the first hole extends in an axial direction of the cylindrical shape, wherein the second hole penetrates from an inner circumferential surface of the first hole to an outer circumferential surface of the cylindrical shape, and wherein the thickness St of the thin-walled portion is measured between the inner circumferential surface of the second hole and a bottom surface of the cylindrical shape and is smaller than the diameter Sd of the second hole.

Assignees

Inventors

Classifications

  • containing inorganic lubricating or binding agents, e.g. metal salts · CPC title

  • B22F3/162Primary

    Machining, working after consolidation · CPC title

  • Tube or ring forms · CPC title

  • containing tungsten, tantalum, molybdenum, vanadium, or niobium · CPC title

  • Ferrous alloys, e.g. steel alloys (cast-iron alloys C22C37/00) · CPC title

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Frequently asked questions

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What does patent US11219950B2 cover?
Provided is a method for manufacturing a sintered component having a hole formed therein, in which a sintered component having no defect, such as cracks, can be manufactured with good productivity and also a reduction in tool life accompanied by forming the hole can be suppressed. The method for manufacturing a sintered component includes a molding step of press-molding a raw material powder co…
Who is the assignee on this patent?
Sumitomo Electric Sintered Alloy Ltd
What technology area does this patent fall under?
Primary CPC classification B22F3/162. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 11 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).