LED filament assembly and lamp including the same

US11217568B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11217568-B2
Application numberUS-202117240105-A
CountryUS
Kind codeB2
Filing dateApr 26, 2021
Priority dateDec 29, 2018
Publication dateJan 4, 2022
Grant dateJan 4, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An LED filament assembly includes a frame, a first electrode disposed on a first end of the frame, and a second electrode disposed on a second end of the frame. The LED filament assembly includes a first group of LED chips capable of emitting a first color, a second group of LED chips capable of emitting a second color, and a third group of LED chips capable of emitting a third color. The first group of LED chips is disposed on the frame along a longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode. Similarly, the second and the third group of LED chips are also disposed on the frame along the longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode. A lamp including such an LED filament assembly is also disclosed.

First claim

Opening claim text (preview).

We claim: 1. A LED filament assembly, comprising: a frame; a first electrode disposed on a first end of the frame; a second electrode disposed on a second end of the frame; a first group of LED chips capable of emitting a first color, the first group of LED chips is disposed on the frame along a longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode; a second group of LED chips capable of emitting a second color different from the first color, the second group of LED chips is disposed on the frame along the longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode; a third group of LED chips capable of emitting a third color different from the first color and the second color, the third group of LED chips is disposed on the frame along the longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode, wherein the frame includes a plurality of ceramic films, each of the ceramic films is configured to have one of the first group of LED chips, one of the second group of LED chips, and one of the third LED chips installed thereon. 2. The LED filament assembly of claim 1 , wherein the first group of LED chips is capable of emitting red light, the second group of LED chips is capable of emitting green light, and the third group of LED chips is capable of emitting blue light. 3. The LED filament assembly of claim 1 , wherein the first group of LED chips and the third group of LED chips are realized by a first color LED flip-chips with different phosphors, and the second group of LED chips is realized by a second color LED flip-chips. 4. The LED filament assembly of claim 3 , wherein the second group of LED chips is arranged between the first group of LED chips and the third group of LED chips. 5. The LED filament assembly of claim 4 , wherein the first group of LED chips is realized by blue LED flip-chips with green phosphor, the second group of LED chips is realized by red LED flip-chips, and the third group of LED chips 33 is realized by blue LED flip-chips. 6. The LED filament assembly of claim 1 , wherein the first group of LED chips, the second group of LED chips, and the third group of LED chips is physically arranged in parallel to each other. 7. The LED filament assembly of claim 1 , wherein the LED filament assembly further comprises a fourth group of LED chips capable of emitting white light, the fourth group of LED chips is disposed on the frame along the longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode. 8. The LED filament assembly of claim 7 , wherein the first group of LED chips, the second group of LED chips, the third group of LED chips, and the fourth group of LED chips is physically arranged in parallel to each other. 9. The LED filament assembly of claim 7 , wherein the fourth group of LED chips is disposed on the fourth layer. 10. The LED filament assembly of claim 7 , wherein the first electrode and the second electrode are capable of providing a first power to the first group of LED chips, a second power to the second group of LED chips, a third power to the third group of LED chips, and a fourth power to the fourth group of LED chips to enable the first group of LED chips, the second group of LED chips, the third group of LED chips and the fourth group of LED chips to emit light with different luminance. 11. The LED filament assembly of claim 1 , wherein the LED filament assembly further comprises a transmissive tape wrapping the first group, the second group, and the third group of LED chips. 12. The LED filament assembly of claim 11 , wherein the transmissive tape includes silicon gel. 13. The LED filament assembly of claim 12 , wherein the transmissive tape includes silicon gel and diffusion powder. 14. The LED filament assembly of claim 1 , wherein the first electrode and the second electrode are capable of providing a first power to the first group of LED chips, a second power to the second group of LED chips, and a third power to the third group of LED chips to enable the first group of LED chips, the second group of LED chips, and the third group of LED chips to emit light with different luminance. 15. The LED filament assembly of claim 1 , wherein the frame includes a flexible printed circuit board. 16. The LED filament assembly of claim 1 , wherein the frame includes a polyimide film.

Assignees

Inventors

Classifications

  • H10W90/00Primary

    Package configurations · CPC title

  • comprising an assembly of point-like light sources · CPC title

  • having two or more wavelength conversion materials · CPC title

  • Light emitting diode [LED] · CPC title

  • square or rectangular, e.g. for light panels · CPC title

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What does patent US11217568B2 cover?
An LED filament assembly includes a frame, a first electrode disposed on a first end of the frame, and a second electrode disposed on a second end of the frame. The LED filament assembly includes a first group of LED chips capable of emitting a first color, a second group of LED chips capable of emitting a second color, and a third group of LED chips capable of emitting a third color. The first…
Who is the assignee on this patent?
Xiamen Eco Lighting Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).