High density coil design and process
US-2020090854-A1 · Mar 19, 2020 · US
Multilayer inductor manufacturing method and multilayer inductor
US11217388B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11217388-B2 |
| Application number | US-201816006592-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 12, 2018 |
| Priority date | Jun 22, 2017 |
| Publication date | Jan 4, 2022 |
| Grant date | Jan 4, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A multilayer inductor manufacturing method includes stacking a first coil conductor layer on a first magnetic layer; stacking a first burn-away material on side surfaces of the first coil conductor layer; stacking a second magnetic layer on the first burn-away material and first magnetic layer; stacking a second burn-away material on the second magnetic layer laterally outside an upper surface of the first coil conductor layer; stacking a second coil conductor layer on the upper surface of the first coil conductor layer and second burn-away material; stacking a third burn-away material on side surfaces and an upper surface of the second coil conductor layer; stacking a third magnetic layer on side surfaces of the third burn-away material and the second magnetic layer; stacking a fourth magnetic layer on the third burn-away material and the third magnetic layer; and burning away the first, second, and third burn-away materials via firing.
First claim
Opening claim text (preview).
What is claimed is: 1. A multilayer inductor comprising: an element body formed by stacking magnetic layers in a stacking direction; and a coil that is provided inside the element body and wound in a substantially helical shape, the coil being formed by stacking in the stacking direction a plurality of coil wiring lines that are wound in substantially planar shapes, and the coil wiring lines each including one or more coil conductor layers that are stacked in the stacking direction so as to be in surface contact with each other, wherein in a cross section, which is taken along the stacking direction, of at least one coil wiring line among the plurality of coil wiring lines, hollow portions exist between the magnetic layers and width-direction side surfaces of the one or more coil conductor layers, an upper surface of a first coil conductor layer, and a lower surface of at least one coil conductor layer among second and subsequent coil conductor layers, wherein in the at least one coil wiring line, a maximum width of the second and subsequent coil conductor layers is smaller than a maximum width of a lowermost coil conductor layer. 2. The multilayer inductor according to claim 1 , wherein two or more of the coil wiring lines are electrically connected in parallel with each other. 3. The multilayer inductor according to claim 2 , wherein among the two or more coil wiring lines that are electrically connected in parallel with each other, the number of coil conductor layers forming at least one coil wiring line is different from the number of coil conductor layers forming another coil wiring line.
Assignees
Inventors
Classifications
Printed windings · CPC title
with the coil helically wound around a magnetic core · CPC title
- H01F41/046Primary
structurally combined with ferromagnetic material · CPC title
Magnetic cores · CPC title
- H01F17/0013Primary
with stacked layers · CPC title
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Frequently asked questions
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- What does patent US11217388B2 cover?
- A multilayer inductor manufacturing method includes stacking a first coil conductor layer on a first magnetic layer; stacking a first burn-away material on side surfaces of the first coil conductor layer; stacking a second magnetic layer on the first burn-away material and first magnetic layer; stacking a second burn-away material on the second magnetic layer laterally outside an upper surface …
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H01F41/046. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).