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US-2018304356-A1 · Oct 25, 2018 · US
Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part
US11217359B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11217359-B2 |
| Application number | US-201816634002-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 24, 2018 |
| Priority date | Jul 25, 2017 |
| Publication date | Jan 4, 2022 |
| Grant date | Jan 4, 2022 |
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- Title
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Abstract
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A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
First claim
Opening claim text (preview).
The invention claimed is: 1. A copper-silver alloy consisting of: Cu; and Ag, wherein the copper-silver alloy has an average crystal grain diameter of 0.1 μm or less, and satisfies a requirement that a difference between a peak of ( 111 ) plane angle of the Cu and a peak of ( 111 ) plane angle of pure Cu is at least 0.812% of the peak of ( 111 ) plane angle of the pure Cu and a requirement that a difference between a peak of ( 111 ) plane angle of the Ag and a peak of ( 111 ) plane angle of pure Ag is at least 0.231% of the peak of ( 111 ) plane angle of the pure Ag. 2. A conduction part comprising the copper-silver alloy according to claim 1 .
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Classifications
Making non-ferrous alloys (by electrothermic methods C22B4/00; by electrolysis C25C1/24, C25C3/36) · CPC title
- C23C26/00Primary
Coating not provided for in groups C23C2/00 - C23C24/00 · CPC title
Alloys based on copper · CPC title
Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title
using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title
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- What does patent US11217359B2 cover?
- A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silve…
- Who is the assignee on this patent?
- Senju Metal Industry Co, Univ Osaka
- What technology area does this patent fall under?
- Primary CPC classification C23C26/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).