Method and apparatus for capturing volume information of three-dimensional samples

Patent metadata

Field	Value
Publication number	US-11215536-B2
Application number	US-202016922182-A
Country	US
Kind code	B2
Filing date	Jul 7, 2020
Priority date	Jul 16, 2019
Publication date	Jan 4, 2022
Grant date	Jan 4, 2022

Abstract

Methods and apparatuses for capturing volume information of microscopic samples include a microscope system having at least one particle beam column, by which a beam of focused, charged particles can be generated, and an in-situ microtome, i.e., a microtome integrated in the microscope system. The method cam include a) providing a sample including a volume of interest (VOI); b) setting a cut surface lying within the sample; c) defining the set cut surface as processing surface; d) exposing the cut surface by virtue of ablating sample material by cutting with the in-situ microtome; and e) processing the sample with the particle beam, wherein the start point of the processing is disposed on the exposed processing surface.

First claim

What is claimed is:

1. A method of using a microscope system, the method comprising:
defining a cut surface lying within a sample as a processing surface;
using a microtome in the microscope system to remove sample material to expose the cut surface; and
processing the sample with a first particle beam of focused, charged particles generated by a first particle beam column in the microscope system,
wherein a start point of the processing is on the exposed processing surface.

2. The method of claim 1 , further comprising imaging the sample.

3. The method of claim 2 , further comprising using a second particle beam in the microscope system to image the sample with a second beam of focused, charged particles generated by the second particle beam.

4. The method of claim 3 , further comprising rotating the sample about an axis of rotation that extends perpendicular to an optical axis of the first particle beam column so that the first particle beam is substantially perpendicular to the processing surface.

5. The method of claim 1 , wherein processing the sample with the first particle beam comprises at least one method selected from the group consisting of using FIB/SEM nano-tomography, generating a cross section, preparing a TEM lamella, and preparing a micro-sample.

6. The method of claim 1 , further comprising:
after exposing the cut surface, imaging the cut surface; and
using the image of the cut surface as a basis to define the processing surface.

7. The method of claim 1 , further comprising:
measuring a cutting force for the removal performed by the microtome to determine changes in the cutting force; and
based on the determined changes in the cutting force, defining the cut surface where a change in the cutting force is determined as the processing surface.

8. The method of claim 1 , further comprising:
after exposing the cut surface, irradiating the cut surface with charged particles;
detecting interaction products of the interaction between material of the sample and the charged particles;
integrating detection signals for the detected interaction products over the surface of the sample;
determining changes in an intensity of the integrated detection signals; and
defining a relevant cut surface is defined as the processing surface when a change in the intensity of the integrated detection signals exceeds a threshold.

9. The method of claim 1 , further comprising:
after exposing the cut surface, irradiating the cut surface with charged particles;
measuring a sample current;
registering changes in the sample current; and
defining a relevant cut surface as the processing surface when a change in the registered sample current exceeds a threshold.

10. The method of claim 1 , further comprising defining the processing surface based on a number of cutting processes performed using the microtome.

11. The method of claim 10 , further comprising setting a thickness for each cutting process performed using the microtome.

12. The method of claim 1 , further comprising positioning the sample relative to a cutting apparatus of the microtome to expose a volume of interest of the sample in a relatively short period of time.

13. The method of claim 1 , further comprising using a correlative data record to set the cut surface and to define the cut surface as the processing surface.

14. An apparatus, comprising:
one or more processing devices; and
one or more machine-readable hardware storage devices comprising instructions that are executable by the one or more processing devices to perform operations comprising the method of claim 1 .

15. The apparatus of claim 14 , further comprising a microscope system, comprising:
a microtome; and
a first particle beam column configured to generate a first beam of focused, charged particles.

16. The apparatus of claim 15 , further comprising a second particle beam column configured to generate a second beam of focused, charged particles.

17. The apparatus of claim 16 , wherein:
the first particle beam column has first optical axis;
the second particle beam column has a second optical axis;
the first and second optical axes define a first angle relative to each other; and
the microtome generates a cut surface in the sample; and
the sample is rotatable about an axis of rotation that extends perpendicular to the first optical axis so the processing surface is alignable at a second angle relative to a normal of the first optical axis so that the first particle beam is configured to be substantially perpendicular to the processing surface.

18. The apparatus of claim 17 , wherein the axis of rotation is configured so that the second angle adopts an absolute value of the first angle.

19. The apparatus of claim 15 , wherein the microtome comprises a holding apparatus configured to receive a sample.

20. One or more machine-readable hardware storage devices comprising instructions that are executable by one or more processing devices to perform operations comprising the method of claim 1 .

Assignees

• Zeiss Carl Microscopy Gmbh

Inventors

• Thaler Marlene
• Kirmse Robert
• Biberger Josef
• Kimling Judith
• Ehrhardt Lars

Classifications

• G01N1/32 Primary

  Polishing; Etching · CPC title

• G01N1/06 Primary

  providing a thin slice, e.g. microtome · CPC title

• H01J37/28

  with scanning beams {(H01J37/268, H01J37/292, H01J37/2955 take precedence)} · CPC title

• H01J37/3023

  Program control · CPC title

• H01J2237/31749

  Focused ion beam · CPC title