Film forming method for metal film and film forming apparatus therefor
US-2017335479-A1 · Nov 23, 2017 · US
US11214889B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11214889-B2 |
| Application number | US-202016816738-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2020 |
| Priority date | Mar 22, 2019 |
| Publication date | Jan 4, 2022 |
| Grant date | Jan 4, 2022 |
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Provided is a film forming apparatus for forming a metal film, capable of uniformly pressurizing a substrate surface with an electrolyte membrane subjected to the fluid pressure of an electrolytic solution containing metal ions during film formation even when an insoluble anode is used. A housing of the apparatus includes a partition member between the anode and the electrolyte membrane, for partitioning a housing chamber into first and second housing chambers. The partition member includes a porous body impregnated with cation exchange resin. The first housing chamber houses the anode insoluble in a first electrolytic solution. The second housing chamber has formed therein a hermetically sealed space in which a second electrolytic solution containing metal ions is enclosed within the housing, by the electrolyte membrane and the partition member. The apparatus is also provided with a pump (pressure unit) that pressurizes the second electrolytic solution in the second housing chamber.
Opening claim text (preview).
What is claimed is: 1. A film forming apparatus for forming a metal film, comprising at least: an anode; an electrolyte membrane between the anode and a substrate, the substrate serving as a cathode; a housing having a housing chamber that houses a first electrolytic solution that contacts the anode and a second electrolytic solution that contacts the electrolyte membrane; and a power supply, wherein: the power supply is configured to supply a voltage across the anode and the substrate while the electrolyte membrane is pressurized against the substrate so that metal ions contained in the electrolyte membrane are reduced on a surface of the substrate and a metal film is thus formed on the surface of the substrate, the electrolyte membrane is attached to the housing to cover an opening of the housing communicating with the housing chamber, the housing has a partition member between the anode and the electrolyte membrane, the partition member partitioning the housing into a first housing chamber on a side of the anode that houses the first electrolytic solution and a second housing chamber on a side of the electrolyte membrane that houses the second electrolytic solution, the partition member includes a porous body impregnated with cation exchange resin, the first housing chamber houses the anode, the anode is insoluble in the first electrolytic solution, the first housing chamber comprises an opening to outside of the film forming apparatus to allow gas generated by the anode to rise through the first electrolytic solution and be discharged, the second housing chamber has a hermetically sealed space in which the second electrolytic solution is enclosed within the housing by the electrolyte membrane and the partition member, the second electrolytic solution containing the metal ions, and the film forming apparatus comprises a pressure unit configured to press the electrolyte membrane onto the substrate which also pressurizes the second electrolytic solution in the second housing chamber. 2. The film forming apparatus for forming a metal film according to claim 1 , further comprising an actuator that is configured to move the housing toward the substrate to bring the electrolyte membrane into contact with the substrate. 3. The film forming apparatus for forming a metal film according to claim 1 , wherein the electrolyte membrane separates the second electrolytic solution from the substrate. 4. A film forming apparatus for forming a metal film, comprising at least: an anode; an electrolyte membrane between the anode and a substrate, the substrate serving as a cathode; a housing having a housing chamber that houses a first electrolytic solution that contacts the anode and a second electrolytic solution that contacts the electrolyte membrane; and a power supply, wherein: the power supply is configured to supply a voltage across the anode and the substrate while the electrolyte membrane is pressurized against the substrate so that metal ions contained in the electrolyte membrane are reduced on a surface of the substrate and a metal film is thus formed on the surface of the substrate, the electrolyte membrane is attached to the housing to cover an opening of the housing communicating with the housing chamber, the housing has a partition member between the anode and the electrolyte membrane, the partition member partitioning the housing into a first housing chamber on a side of the anode that houses the first electrolytic solution and a second housing chamber on a side of the electrolyte membrane that houses the second electrolytic solution, the partition member includes a porous body impregnated with cation exchange resin, the first housing chamber houses the anode, the anode is insoluble in the first electrolytic solution, the first housing chamber comprises an opening to outside of the film forming apparatus to allow gas generated by the anode to rise through the first electrolytic solution and be discharged, the second housing chamber has a hermetically sealed space in which the second electrolytic solution is enclosed within the housing by the electrolyte membrane and the partition member, the second electrolytic solution containing the metal ions, and the film forming apparatus comprises a pressure unit configured to pressurize the second electrolytic solution in the second housing chamber, and an actuator that is configured to move the housing toward the substrate to bring the electrolyte membrane into contact with the substrate.
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