Thermally conductive composite silicone rubber sheet and method for manufacturing same

US11214721B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11214721-B2
Application numberUS-201716341838-A
CountryUS
Kind codeB2
Filing dateOct 6, 2017
Priority dateOct 14, 2016
Publication dateJan 4, 2022
Grant dateJan 4, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for preparing a heat-conductive composite silicone rubber sheet, the heat-conductive composite silicone rubber sheet comprising a non-adhesive high hardness heat-conductive silicone rubber sheet and an acrylic pressure-sensitive adhesive layer laid on one surface of the silicone rubber sheet, the non-adhesive high hardness heat-conductive silicone rubber sheet including a heat-conductive silicone rubber layer which is a cured product of a heat-conductive silicone composition containing a heat conductive filler, the cured product having a hardness of 60 to 96 on Durometer A scale and an intermediate reinforcing layer, and the acrylic pressure-sensitive adhesive layer being a cured product of an acrylic pressure-sensitive adhesive composition comprising 100 parts by weight of an acrylic pressure-sensitive adhesive composed of a polymer obtained from a monomer mixture containing 5 to 50 mol % of a hydroxyl-containing monomer, and 0.05 to 5 parts by weight of a chelate curing agent, the method comprising the steps of: applying the heat-conductive silicone composition onto front surface and back surface of the intermediate reinforcing layer, and heat curing the heat-conductive silicone composition to obtain the non-adhesive high-hardness heat-conductive silicone rubber, and directly applying the acrylic pressure-sensitive adhesive composition comprising an acrylic pressure-sensitive adhesive and a chelate curing agent onto one surface of the obtained non-adhesive high-hardness heat-conductive silicone rubber sheet, and heat curing the acrylic pressure-sensitive adhesive composition for shaping. 2. The method of claim 1 , wherein the acrylic pressure-sensitive adhesive composition further comprises 0.05 to 5 parts by weight of a tackifier resin.

Assignees

Inventors

Classifications

  • Organics · CPC title

  • Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)} · CPC title

  • Arrangements for heating · CPC title

  • organic · CPC title

  • C09J7/25Primary

    based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds · CPC title

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Frequently asked questions

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What does patent US11214721B2 cover?
Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressur…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification C09J7/25. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).