Polishing composition, method for producing same, and polishing method

Patent metadata

Field	Value
Publication number	US-11214711-B2
Application number	US-201615579844-A
Country	US
Kind code	B2
Filing date	May 6, 2016
Priority date	Jun 8, 2015
Publication date	Jan 4, 2022
Grant date	Jan 4, 2022

Abstract

The present invention is a polishing composition, containing zirconium oxide as abrasive grains, the polishing composition having pH of 11.0 or more and less than 12.5, the zirconium oxide having element concentrations of sodium, magnesium, aluminum, potassium, calcium, titanium, chromium, iron, manganese, nickel, copper, zinc, lead, and cobalt of less than 1 ppm each. There can be provided a polishing composition that enables semiconductor substrates having high flatness not only in the inner circumferential portion but also in the outer circumferential portion with little contamination due to metal impurities to be obtained at high productivity.

First claim

The invention claimed is:

1. A polishing composition, comprising zirconium oxide as abrasive grains,
the polishing composition having pH of 11.0 or more and less than 12.5, the zirconium oxide having element concentrations of sodium, magnesium, aluminum, potassium, calcium, titanium, chromium, iron, manganese, nickel, copper, zinc, lead, and cobalt of less than 1 ppm each,
wherein the abrasive grains of the zirconium oxide have an average primary particle size of 5 nm or more and less than 100 nm.

2. The polishing composition according to claim 1 , wherein the content of the zirconium oxide is 0.1 to 10 mass % with respect to the whole polishing composition.

3. The polishing composition according to claim 1 , further comprising either or both of a nonionic surfactant and an anionic surfactant as a water-soluble polymer.

4. The polishing composition according to claim 2 , further comprising either or both of a nonionic surfactant and an anionic surfactant as a water-soluble polymer.

5. The polishing composition according to claim 3 , wherein the polishing composition comprises one or more compounds selected from the group consisting of polyvinyl pyrrolidone, polyvinyl alcohol, polyacrylamide, polyethylene glycol, polyoxyethylene alkyl ether, and polyether as the nonionic surfactant.

6. The polishing composition according to claim 4 , wherein the polishing composition comprises one or more compounds selected from the group consisting of polyvinyl pyrrolidone, polyvinyl alcohol, polyacrylamide, polyethylene glycol, polyoxyethylene alkyl ether, and polyether as the nonionic surfactant.

7. The polishing composition according to claim 3 , wherein the polishing composition comprises one or more compounds selected from the group consisting of polyacrylic acid or a salt thereof, polysulfonic acid or a salt thereof, and polycarboxylic acid or a salt thereof as the anionic surfactant.

8. The polishing composition according to claim 4 wherein the polishing composition comprises one or more compounds selected from the group consisting of polyacrylic acid or a salt thereof, polysulfonic acid or a salt thereof, and polycarboxylic acid or a salt thereof as the anionic surfactant.

9. The polishing composition according to claim 3 , wherein the content of the water-soluble polymer is 0.001 to 0.5 mass % with respect to the whole polishing composition.

10. A polishing composition according to claim 5 , wherein the content of the water-soluble polymer is 0.001 to 0.5 mass % with respect to the whole polishing composition.

11. The polishing composition according to claim 7 , wherein the content of the water-soluble polymer is 0.001 to 0.5 mass % with respect to the whole polishing composition.

12. The polishing composition according to claim 1 , further comprising an oxidizing agent.

13. The polishing composition according to claim 2 , further comprising an oxidizing agent.

14. The polishing composition according to claim 12 , wherein the content of the oxidizing agent is 0.01 to 1.0 mass % with respect to the whole polishing composition.

15. The polishing composition according to claim 13 , wherein the content of the oxidizing agent is 0.01 to 1.0 mass % with respect to the whole polishing composition.

16. The polishing composition according to claim 12 , wherein the polishing composition comprises hydrogen peroxide as the oxidizing agent.

17. The polishing composition according to claim 14 , wherein the polishing composition comprises hydrogen peroxide as the oxidizing agent.

18. A polishing method, comprising polishing a semiconductor substrate with the polishing composition according to claim 1 .

19. The polishing method according to claim 18 , wherein the semiconductor substrate is a single crystal silicon substrate.

20. A method for producing a polishing composition containing zirconium oxide as abrasive grains, the method comprising:
preparing zirconium oxide having element concentrations of sodium, magnesium, aluminum, potassium, calcium, titanium, chromium, iron, manganese, nickel, copper, zinc, lead, and cobalt of less than 1 ppm each;
adding the prepared zirconium oxide to water; and
adding a pH adjuster to a solution containing the zirconium oxide to adjust pH of the solution to 11.0 or more and less than 12.5,
wherein a polishing composition is produced by using the solution after adjusting the pH.

21. The polishing composition according to claim 3 ,
wherein the nonionic surfactant comprises one or more compounds selected from the group consisting of polyvinyl pyrrolidone, polyvinyl alcohol, polyacrylamide, polyoxyethylene alkyl ether, and polyether, and
wherein the anionic surfactant comprises one or more compounds selected from the group consisting of polyacrylic acid, polysulfonic acid and polycarboxylic acid.

Assignees

• Shinetsu Chemical Co

Inventors

• Nojima Yoshihiro
• Takahashi Mitsuhito

Classifications

• H10P90/129

  by polishing · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• C01P2002/30

  Three-dimensional structures · CPC title

• C01P2006/80

  Compositional purity · CPC title

• C01P2004/32

  Spheres · CPC title