Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition and cured product comprising same, use thereof, and method for preparing alkoxysilyl compound
US-2018155370-A1 · Jun 7, 2018 · US
US11214583B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11214583-B2 |
| Application number | US-201716619464-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 5, 2017 |
| Priority date | Jun 5, 2017 |
| Publication date | Jan 4, 2022 |
| Grant date | Jan 4, 2022 |
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The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.
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The invention claimed is: 1. A compound having an alkoxysilyl group and an active ester group selected from a group consisting of Formulae AF to LF below: in Formula AF, -p- is —C(CH 3 ) 2 —, —CH 2 —, —C(CF 3 ) 2 —, —S—, —SO 2 —, in Formula FF, -q- is —CH 2 — or a direct linkage, in Formula GF, r is hydrogen, a hydroxyl group, a C1-C10 alkyl group, or a C1-C10 aromatic group, preferably a C6-C10 aromatic group, in Formula IF, s is in Formula LF, t is in Formulae IF to LF, n is an integer equal to or greater than 1, in Formulae AF to EF, at least one of a plurality of Ps is —(CH 2 )mSiRaRbRc, at least one of Ra, Rb, and Rc is a C1-C5 alkoxy group and the remainders thereof are alkyl groups having 1 to 10 carbon atoms, the alkyl group and the alkoxy group are a linear or branched alkyl group and a linear or branched alkoxy group, m is an integer ranging from 3 to 10, the remainders thereof are hydrogen or alkenyl group of —(CH 2 ) l CHCH 2 , where l is an integer ranging from 1 to 8, at least one of a plurality of Qs is —COR 1 , where R 1 is an aliphatic, alicyclic, or aromatic hydrocarbon group of C1-C20, and the aliphatic hydrocarbon group is a linear or branched aliphatic hydrocarbon group, and the remainder of the plurality of Qs are hydrogen, in Formulae FF to LF, at least one of a plurality of Rs is —(CH 2 )mSiRaRbRc or —CONH(CH 2 )mSiRaRbRc, where at least one of Ra, Rb, and Rc is a C1-C5 alkoxy group, and the remainders thereof are alkyl groups having 1 to 10 carbon atoms, the alkyl group and the alkoxy group are linear or branched, m is an integer ranging from 3 to 10, at least one of a plurality of Rs is —COR 1 , R 1 is an aliphatic, alicyclic, or aromatic hydrocarbon group of C1-C20, the aliphatic hydrocarbon group is linear or branched, and the remainder of the plurality of Rs are hydrogen or alkenyl group of —(CH 2 ) l CHCH 2 , independently, where l is an integer ranging from 1 to 8. 2. An epoxy composition comprising a compound having an alkoxysilyl group and an active ester group selected from a group consisting of Formulae AF to LF of claim 1 . 3. The epoxy composition of claim 2 , further comprising: an epoxy compound, a curing agent, and a filler. 4. An electrical and electronic material including the epoxy composition of claim 2 . 5. The electrical and electronic material of claim 4 , wherein the electrical and electronic material is a substrate, a film, a laminated substrate, prepreg, a printed circuit board, or a packaging material. 6. An adhesive comprising the epoxy composition of claim 2 . 7. A paint comprising the epoxy composition of claim 2 .
Compounds having Si-O-C linkages (Si-O-acyl linkages C07F7/1896) · CPC title
non-conjugated, e.g. paracyclophanes or xylenes · CPC title
Epoxynovolacs · CPC title
Silylation · CPC title
Silica · CPC title
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