Systems and methods for joining nodes and other structures

US11214317B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11214317-B2
Application numberUS-201815961767-A
CountryUS
Kind codeB2
Filing dateApr 24, 2018
Priority dateApr 24, 2018
Publication dateJan 4, 2022
Grant dateJan 4, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additively manufactured node is disclosed. A node is an additively manufactured (AM) structure that includes a feature, e.g., a socket, a channel, etc., for accepting another structure, e.g., a tube, a panel, etc. The node can include a node surface of a receptacle extending into the node. The receptacle can receive a structure, and a seal interface on the node surface can seat a seal member between the node surface and the structure to create an adhesive region between the node and the structure, the adhesive region being bounded by the node surface, the structure, and the seal member. The node can also include two channels connecting an exterior surface of the node to the adhesive region. In this way, adhesive can be injected into the adhesive region between the node and the structure, and the adhesive can be contained by the seal member.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: an additively manufactured node having a receptacle extending into the node, the receptacle including a first surface, and the node including an exterior surface, a first channel connecting the exterior surface to the first surface, and a second channel connecting the exterior surface to the first surface; a structure inserted in the receptacle, the structure including a second surface opposing the first surface; a seal member arranged between the node and the structure, wherein an adhesive region between the node and the structure is bounded by the first surface, the second surface, and a surface of the seal member, the adhesive region connecting to each of the first and second channels; and an adhesive arranged in the adhesive region, wherein the adhesive adjoins the seal member surface and attaches the first surface to the second surface, and wherein the adhesive region extends around a perimeter of the structure and a portion of a first end of the adhesive region overlaps a portion of a second end of the adhesive region in a direction of insertion of the structure in the receptacle, and the first channel connects to the adhesive region proximate to the first end, and the second channel connects to the adhesive region proximate to the second end. 2. The apparatus of claim 1 , further comprising: a fill material filling the first and second channels. 3. The apparatus of claim 1 , wherein the receptacle includes a hole. 4. The apparatus of claim 1 , wherein the adhesive region is hermetically sealed. 5. The apparatus of claim 1 , wherein the first end of the adhesive region opposes the second end of the adhesive region. 6. The apparatus of claim 1 , wherein the seal member includes a first seal member portion around the structure, a second seal member portion around the structure, and a third seal member portion extending from the first seal member portion to the second seal member portion and spiraling around the structure, the first channel connecting to the adhesive region proximate to the first seal member portion, and the second channel connecting to the adhesive region proximate to the second seal member portion. 7. The apparatus of claim 1 , further comprising: a second seal member around the structure, wherein the second seal member is arranged outside the adhesive region. 8. The apparatus of claim 7 , further comprising: a third seal member around the structure, wherein the third seal member is arranged outside the adhesive region, and the adhesive region is arranged between the second and third seal members. 9. The apparatus of claim 1 , wherein the first surface of the receptacle includes one or more grooves, and a portion of the seal member is arranged in the one or more grooves. 10. The apparatus of claim 1 , wherein the seal member includes a seal attached to the structure. 11. The apparatus of claim 10 , wherein the first surface includes a chamfered edge of the node, and the seal member attached to the structure abuts the chamfered edge.

Assignees

Inventors

Classifications

  • by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined · CPC title

  • by suction · CPC title

  • Using vacuum · CPC title

  • by gluing (gluing of plastics material B29C65/48) · CPC title

  • Connections therefor, e.g. joints (B62D29/045 takes precedence) · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11214317B2 cover?
An additively manufactured node is disclosed. A node is an additively manufactured (AM) structure that includes a feature, e.g., a socket, a channel, etc., for accepting another structure, e.g., a tube, a panel, etc. The node can include a node surface of a receptacle extending into the node. The receptacle can receive a structure, and a seal interface on the node surface can seat a seal member…
Who is the assignee on this patent?
Divergent Tech Inc
What technology area does this patent fall under?
Primary CPC classification B62D23/005. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).