Universal pluggable datacenter cooling system

Patent metadata

Field	Value
Publication number	US-11212943-B2
Application number	US-202016798214-A
Country	US
Kind code	B2
Filing date	Feb 21, 2020
Priority date	Feb 21, 2020
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.

First claim

What is claimed is:

1. A datacenter cooling system, comprising:
a first cooling loop comprising a heat exchanger and a cooling manifold to be coupled to a plurality of servers, the heat exchanger to exchange heat between the first cooling loop and a second cooling loop that comprises a cooling distribution unit (CDU), the CDU to exchange heat between the second cooling loop and a primary cooling loop, the primary cooling loop to exit a datacenter to dissipate heat to an external cooling medium.

2. The datacenter cooling system of claim 1 , further comprising:
a first coolant in the first cooling loop, the first coolant independent of a second coolant in the second cooling loop and a third coolant in the primary cooling loop.

3. The datacenter cooling system of claim 1 , further comprising:
a module comprising the first cooling loop for assembly within a rack of the datacenter and comprising fluid couplers to couple with the second cooling loop and to couple with one or more server trays of the rack.

4. The datacenter cooling system of claim 1 , further comprising:
the fluid couplers adapted to receive at least one mating coupler from the one or more server trays or from the second cooling loop by a snap-in connection.

5. The datacenter cooling system of claim 1 , wherein a first coolant in the first cooling loop is water and wherein a second coolant in the second cooling loop and a primary coolant in the primary cooling loop are both a dielectric fluid alone or a dielectric fluid with a water component.

6. The datacenter cooling system of claim 1 , further comprising:
a cooling plate for insertion within a rack of the datacenter and for coupling with the first cooling loop, the cooling plate to receive a coolant and to provide a path for the coolant to exit back into the first cooling loop.

7. The datacenter cooling system of claim 6 , further comprising:
an area associated with the cooling plate for comprising computing components of the datacenter or for comprising at least one server tray.

8. The datacenter cooling system of claim 1 , further comprising:
secondary couplers of one or more server trays or of a cooling plate located within a rack of the datacenter, the secondary couplers for receiving coolant from the first cooling loop, for passing the coolant through the cooling plate that is associated with one or more computing components, and for returning the coolant to the first cooling loop.

9. The datacenter cooling system of claim 1 , wherein the heat exchanger is located external or internal to a rack of the datacenter and wherein the first cooling loop is adapted to draw heat from within the rack to the second cooling loop external to the rack.

10. The datacenter cooling system of claim 1 , wherein the primary cooling loop interfaces with a cooling tower that enables dissipation of the heat transferred from the first cooling loop to the second cooling loop using the external cooling medium.

11. A method of cooling a datacenter, comprising:
providing a primary cooling loop that partly extends external to the datacenter to dissipate heat to an external cooling medium;
providing a second cooling loop that comprises a cooling distribution unit (CDU), the CDU to exchange heat between the second cooling loop and a primary cooling loop; and
providing a first cooling loop comprising a heat exchanger and a cooling manifold to be coupled to a plurality of servers, the heat exchanger the heat exchanger to exchange heat between the first cooling loop and the second cooling loop.

12. The method of claim 11 , further comprising:
providing a first coolant in the first cooling loop, the first coolant independent of a second coolant in the second cooling loop and a third coolant in the primary cooling loop.

13. The method of claim 11 , further comprising:
assembling a module comprising the first cooling loop within a rack of the datacenter; and
coupling fluid couplers in the first cooling loop with the second cooling loop and with one or more server trays of the rack.

14. The method of claim 11 , further comprising:
adapting the fluid couplers to receive at least one mating coupler from the one or more server trays or the second cooling loop by a snap-in connection.

15. The method of claim 11 , further comprising, wherein a first coolant in the first cooling loop is water and wherein a second coolant in the second cooling loop and a primary coolant in the primary cooling loops are both a dielectric fluid alone or a dielectric fluid with a water component.

16. The method of claim 11 , further comprising:
inserting a cooling plate within a rack of the datacenter; and
coupling the cooling plate with the first cooling loop, the cooling plate to receive a coolant and to provide a path for the coolant to exit back into the first cooling loop.

17. The method of claim 16 , further comprising:
providing an area associated with the cooling plate for comprising computing components of the datacenter or for comprising at least one server tray.

18. The method of claim 11 , further comprising:
enabling secondary couplers of one or more server trays or of a cooling plate located within a rack of the datacenter to receive coolant from the first cooling loop;
enabling the coolant to pass through the cooling plate; and
returning the coolant to the first cooling loop.

19. The method of claim 11 , further comprising:
positioning the heat exchanger external or internal to a rack of the datacenter; and
adapting the first cooling loop to draw heat from within the rack to the second cooling loop external to the rack.

20. The method of claim 11 , further comprising:
enabling the primary cooling loop to interface with a cooling tower that enables dissipation of the heat transferred from the first cooling loop to the second cooling loop using the external cooling medium.

Assignees

• Nvidia Corp

Inventors

• Heydari Ali

Classifications

• H05K7/2079

  within rooms for removing heat from cabinets · CPC title

• H05K7/20781 Primary

  within cabinets for removing heat from server blades · CPC title

• H05K7/20636

  within sub-racks for removing heat from electronic boards · CPC title

• H05K7/20536

  for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title