Patch Antenna Elements and Parasitic Feed Pads
US-2019221935-A1 · Jul 18, 2019 · US
Hybrid and thinned millimeter-wave antenna solutions
US11211688B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11211688-B2 |
| Application number | US-201816638567-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 28, 2018 |
| Priority date | Oct 3, 2017 |
| Publication date | Dec 28, 2021 |
| Grant date | Dec 28, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a board assembly; an annular patch antenna disposed within the board assembly and having a rectangular outside perimeter, the annular patch antenna electrically coupled to a first feed; a rectangular patch antenna disposed within the board assembly the rectangular patch antenna electrically coupled to a second feed; and a parasitic layer gap-coupled to the annular patch antenna and to the rectangular patch antenna and disposed outside the rectangular outside perimeter, wherein the annular patch antenna and the rectangular patch antenna are electrically coupled to a common feed. 2. The apparatus of claim 1 , wherein the parasitic layer is co-planar with the annular patch antenna in a first layer of the board assembly. 3. The apparatus of claim 2 , wherein the rectangular patch antenna is disposed on a plane between a ground plane of the board assembly and the first layer of the board assembly. 4. The apparatus of claim 1 , wherein the common feed allows the parasitic layer to be shared between the annular patch antenna and the rectangular patch antenna through gap coupling, and wherein the parasitic layer is electrically isolated from annular patch antenna and the rectangular patch antenna.
Assignees
Inventors
Classifications
- H01Q1/2283Primary
mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title
electromagnetically coupled to the feed line · CPC title
using two or more imbricated arrays (H01Q5/49 takes precedence) · CPC title
Patch antenna array · CPC title
Crossed polarisation dual antennas (orthomode horns H01Q13/0258; cross-polarised rear feeds H01Q19/136; orthomode transducers H01P1/161) · CPC title
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- What does patent US11211688B2 cover?
- Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch anten…
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification H01Q1/2283. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).