Semiconductor device having gate dielectric and inhibitor film over gate dielectric

Patent metadata

Field	Value
Publication number	US-11211465-B2
Application number	US-201916714889-A
Country	US
Kind code	B2
Filing date	Dec 16, 2019
Priority date	Mar 13, 2014
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

One or more semiconductor devices are provided. The semiconductor device comprises a gate body, a conductive prelayer over the gate body, at least one inhibitor film over the conductive prelayer and a conductive layer over the at least one inhibitor film, where the conductive layer is tapered so as to have a top portion width that is greater than the bottom portion width. One or more methods of forming a semiconductor device are also provided, where an etching process is performed to form a tapered opening such that the tapered conductive layer is formed in the tapered opening.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a first sidewall spacer;
a second sidewall spacer;
a gate dielectric between the first sidewall spacer and the second sidewall spacer;
a conductive pre-layer over the gate dielectric and between the first sidewall spacer and the second sidewall spacer;
a first inhibitor film in direct contact with the conductive pre-layer, over the conductive pre-layer, and between the first sidewall spacer and the second sidewall spacer;
a second inhibitor film in direct contact with the conductive pre-layer, over the conductive pre-layer, and between the first sidewall spacer and the second sidewall spacer; and
a conductive layer over the first inhibitor film and the second inhibitor film and between the first sidewall spacer and the second sidewall spacer, wherein, in an area between the first sidewall spacer and the second sidewall spacer:
the conductive layer has a first width at a first height above a substrate underlying the conductive layer,
at the first height, the conductive layer is laterally coincident with the first inhibitor film,
the first width is measured in a first direction extending from the first sidewall spacer to the second sidewall spacer,
the first height is measured in a second direction perpendicular to the first direction and perpendicular to a top surface of the substrate,
the conductive layer has a second width, measured in the first direction, at a second height, measured in the second direction, above the substrate,
at the second height, the conductive layer is laterally coincident with the first inhibitor film,
the first width is less than the second width, and
the first height is less than the second height.

2. The semiconductor device of claim 1 , wherein, in the area between the first sidewall spacer and the second sidewall spacer:
the conductive pre-layer has a first thickness at a third height above the substrate,
at the third height, the conductive pre-layer is laterally coincident with the first inhibitor film,
the first thickness is measured in the first direction,
the third height is measured in the second direction,
the conductive pre-layer has a second thickness, measured in the first direction, at a fourth height, measured in the second direction, above the substrate,
at the fourth height, the conductive pre-layer is laterally coincident with the first inhibitor film,
the first thickness is greater than the second thickness, and
the third height is less than the fourth height.

3. The semiconductor device of claim 1 , wherein the second inhibitor film is spaced apart from the first inhibitor film by the conductive layer.

4. The semiconductor device of claim 1 , wherein:
the first inhibitor film is in direct contact with a first portion of an upper surface of the conductive pre-layer,
the conductive layer is in direct contact with a second portion of the upper surface of the conductive pre-layer,
the second inhibitor film is in direct contact with a third portion of the upper surface of the conductive pre-layer, and
the second portion of the upper surface of the conductive pre-layer is between the first portion of the upper surface of the conductive pre-layer and the third portion of the upper surface of the conductive pre-layer.

5. The semiconductor device of claim 1 , wherein the conductive pre-layer comprises at least one of a metal or polysilicon.

6. The semiconductor device of claim 1 , wherein the first inhibitor film comprises tungsten.

7. The semiconductor device of claim 1 , wherein the first inhibitor film comprises at least one of WN x , WO x , WSi x , or W(CH) x , where x is a positive value.

8. The semiconductor device of claim 1 , wherein the conductive pre-layer and the conductive layer have a same composition.

9. The semiconductor device of claim 1 , comprising:
a work-function metal layer between the gate dielectric and the conductive pre-layer.

10. The semiconductor device of claim 1 , comprising:
an interfacial layer under the gate dielectric and between the first sidewall spacer and the second sidewall spacer.

11. The semiconductor device of claim 1 , comprising:
a capping layer between the gate dielectric and the conductive pre-layer.

12. A semiconductor device, comprising:
a first sidewall spacer;
a second sidewall spacer;
a gate dielectric between the first sidewall spacer and the second sidewall spacer;
a first inhibitor film over the gate dielectric and between the first sidewall spacer and the second sidewall spacer, wherein a distance between the gate dielectric and the first inhibitor film, measured in a first direction, varies as a function of height, measured in a second direction perpendicular to the first direction;
a second inhibitor film over the gate dielectric and between the first sidewall spacer and the second sidewall spacer, wherein the second inhibitor film is spaced apart from the first inhibitor film;
a conductive pre-layer between the gate dielectric and the first inhibitor film; and
a conductive layer over the first inhibitor film, wherein the conductive layer is in direct contact with the conductive pre-layer.

13. The semiconductor device of claim 12 ,
wherein the conductive layer is between a bottom edge of the first inhibitor film and a bottom edge of the second inhibitor film.

14. The semiconductor device of claim 12 , wherein, in an area between the first sidewall spacer and the second sidewall spacer:
the first inhibitor film is separated from the second inhibitor film by a first distance at a first height above a substrate underlying the first inhibitor film,
the first distance is measured in the first direction,
the first direction extends from the first sidewall spacer to the second sidewall spacer,
the first height is measured in the second direction,
the second direction is perpendicular to a top surface of the substrate,
the first inhibitor film is separated from the second inhibitor film by a second distance, measured in the first direction, at a second height, measured in the second direction, above the substrate,
the first distance is less than the second distance, and
the first height is less than the second height.

15. The semiconductor device of claim 12 , wherein the conductive pre-layer and the conductive layer have a same composition.

16. The semiconductor device of claim 12 , comprising:
a work-function metal layer between the gate dielectric and the conductive pre-layer.

17. A semiconductor device, comprising:
a first sidewall spacer;
a second sidewall spacer;
a gate dielectric between the first sidewall spacer and the second sidewall spacer; and
a first inhibitor film over the gate dielectric and between the first sidewall spacer and the second sidewall spacer, wherein:
the first inhibitor film is separated from the first sidewall spacer by a first distance at a first height above a substrate underlying the first inhibitor film,
the first distance is measured in a first direction extending from the first sidewall spacer to the second sidewall spacer,
the first distance is measured from a surface of the first inhibitor film closest to the first sidewall spacer to a surface of the first sidewall spacer closest to the first inhibitor film,
the first height is measured in a second direction perpendicular to the first direction and perpendicular to a top surface of the substrate,
the first inhibitor film is separated from the first sidewall spacer by a second distance, measured in the first direction, at a second height, measured in the secon

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Khaderbad Mrunal A
• Tsau Hsueh Wen
• Lee Chia-Ching
• Lee Da-Yuan
• Wei Hsiao-Kuan
• Hung Chih-Chang
• Chang Huicheng
• Chang Weng

Classifications

• H10P50/268

  of silicon-containing layers · CPC title

• H10P50/267

  using plasmas · CPC title

• H10D64/01318

  the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN (comprising a layer of alloys of Si, Ge or C H10D64/01314) · CPC title

• H10D64/0134

  with a treatment, e.g. annealing, after the formation of the insulator and before the formation of the conductor · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title