Capacitor structure with MIM layer over metal pillars

Patent metadata

Field	Value
Publication number	US-11211448-B2
Application number	US-201916704180-A
Country	US
Kind code	B2
Filing date	Dec 5, 2019
Priority date	Dec 5, 2019
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A capacitor structure for an integrated circuit (IC) is provided. The capacitor structure includes a plurality of spaced metal pillars with each metal pillar positioned on a corresponding underlying metal wire of an underlying metal layer. A metal-insulator-metal layer is positioned over and between the metal pillars. At least one contact is operatively coupled to a first metal pillar of the plurality of metal pillars. The metal-insulator-metal layer creates a MIM capacitor that undulates over the metal pillars, creating a higher density capacitance compared to conventional planar MIM capacitors. The metal pillars extend into the metal-insulator-metal layer, which reduces contact resistance. The capacitor structure can be integrated into an IC with no major integration issues. A related method is also provided.

First claim

What is claimed is:

1. A capacitor structure for an integrated circuit (IC), the capacitor structure comprising:
a plurality of spaced metal pillars, each metal pillar positioned on a corresponding underlying metal wire of an underlying metal layer; and
a metal-insulator-metal layer over and along a side of the plurality of spaced metal pillars.

2. The capacitor structure of claim 1 , wherein the metal-insulator-metal layer includes a first capacitor metal layer over and along the side of the plurality of spaced metal pillars, an insulator layer over the first capacitor metal layer, and a second capacitor metal layer over the insulator layer.

3. The capacitor structure of claim 2 , further comprising at least one contact operatively coupled to the second capacitor metal layer.

4. The capacitor structure of claim 3 , wherein the at least one contact is aligned over a first metal pillar of the plurality of spaced metal pillars.

5. The capacitor structure of claim 2 , wherein the first capacitor metal layer and the second capacitor metal layer include a metal selected from the group comprising: titanium nitride (TiN), ruthenium (Ru), and tantalum nitride (TaN);
wherein the insulator layer includes a high dielectric constant (high-K) material selected from the group comprising: tantalum oxide (Ta 2 O 5 ), barium titanium oxide (BaTiO 3 ), hafnium oxide (HfO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), hafnium silicate oxide (HfSixOy) or hafnium silicon oxynitride (HfSixOyNz), where x, y, and z represent relative proportions, each greater than or equal to zero; and
wherein each of the underlying metal wires includes copper (Cu).

6. The capacitor structure of claim 2 , wherein the first capacitor metal layer and the insulator layer undulate over the plurality of spaced metal pillars, and the second capacitor metal layer fills any remaining space between the plurality of spaced metal pillars and extends over the plurality of spaced metal pillars.

7. The capacitor structure of claim 2 , wherein each metal pillar of the plurality of spaced metal pillars is contacted on three sides by the first capacitor metal layer.

8. The capacitor structure of claim 2 , wherein the plurality of spaced metal pillars includes at least three metal pillars.

9. A capacitor structure for an integrated circuit (IC), the capacitor structure comprising:
a first metal pillar over a first underlying metal wire of an underlying metal layer;
a second metal pillar over a second underlying metal wire of the underlying metal layer, the first metal pillar and the first underlying metal wire spaced from the second metal pillar and the second underlying metal wire; and
a metal-insulator-metal layer over and along a side of the first metal pillar and over and along a side of the second pillar, wherein the metal-insulator-metal layer includes a first capacitor metal layer over and along the side of the first and second metal pillars, an insulator layer over the first capacitor metal layer, a second capacitor metal layer over the insulator layer; and
at least one contact operatively coupled to the second capacitor metal layer.

10. The capacitor structure of claim 9 , wherein the at least one contact is aligned over a respective metal pillar.

11. The capacitor structure of claim 9 , wherein the first capacitor metal layer and the second capacitor metal layer include a metal selected from the group comprising: titanium nitride (TiN), ruthenium (Ru), and tantalum nitride (TaN);
wherein the insulator layer includes a high dielectric constant (high-K) material selected from the group comprising: tantalum oxide (Ta 2 O 5 ), barium titanium oxide (BaTiO 3 ), hafnium oxide (HfO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), hafnium silicate oxide (HfSixOy) or hafnium silicon oxynitride (HfSixOyNz), where x, y, and z represent relative proportions, each greater than or equal to zero; and
wherein the first and second underlying metal wires include copper (Cu).

12. The capacitor structure of claim 9 , wherein the first capacitor metal layer and the insulator layer undulates over the first and second metal pillars, and the second capacitor metal layer fills any remaining space between the first and second metal pillars and extends over the first and second metal pillars.

13. The capacitor structure of claim 9 , wherein each metal pillar is contacted on three sides by the first capacitor metal layer.

14. The capacitor structure of claim 9 , further comprising at least one third metal pillar over a corresponding third underlying metal wire of the underlying metal layer, each of the at least one third metal pillar and corresponding third underlying metal wire spaced from and between the first metal pillar and the first underlying metal wire and the second metal pillar and the second underlying metal wire.

15. A method of forming a metal-insulator-metal (MIM) capacitor for an integrated circuit, the method comprising:
forming a metal pillar over each of a selected plurality of spaced underlying metal wires of an underlying metal layer; and
forming a metal-insulator-metal layer over and along a side of the metal pillars to form the MIM capacitor.

16. The method of claim 15 , wherein forming the metal pillars over each of the selected plurality of spaced underlying metal wires includes:
forming a material layer over an etch stop layer (ESL) over the selected plurality of spaced underlying metal wires;
patterning a cavity in the material layer and the ESL over each of the selected plurality of spaced underlying metal wires;
filling each cavity with a metal; and
removing the material layer to leave the metal pillar over each of the selected plurality of spaced underlying metal wires.

17. The method of claim 15 , wherein forming the metal-insulator-metal layer over and along the side of the metal pillars includes:
forming a first capacitor metal layer over and along the side of the metal pillars;
forming an insulator layer over the first capacitor metal layer; and
forming a second capacitor metal layer over the insulator layer,
wherein the first capacitor metal layer and the insulator layer undulate over the metal pillars, and the second capacitor metal layer fills any remaining space between the metal pillars and extends over the metal pillars.

18. The method of claim 17 , wherein the first capacitor metal layer and the second capacitor metal layer include a metal selected from the group comprising: titanium nitride (TiN), ruthenium (Ru), and tantalum nitride (TaN);
wherein the insulator layer includes a high dielectric constant (high-K) material selected from the group comprising: tantalum oxide (Ta 2 O 5 ), barium titanium oxide (BaTiO 3 ), hafnium oxide (HfO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), hafnium silicate oxide (HfSixOy) or hafnium silicon oxynitride (HfSixOyNz), where x, y, and z represent relative proportions, each greater than or equal to zero and x+y+z=1; and
wherein each of the selected plurality of spaced underlying metal wires includes copper (Cu).

19. The method of claim 17 , further comprising forming at least one contact landing on an upper surface of the second capacitor metal layer.

20. The method of claim 15 , further comprising:
forming an interlayer dielectric (ILD) over the MIM capacitor; and
patterning the MIM capacitor to a selected dimension.

Assignees

• Globalfoundries Us Inc

Inventors

• Singh Sunil K
• Ramanathan Eswar

Classifications

• H10W20/496

  Capacitor integral with wiring layers · CPC title

• H10W20/063

  by forming conductive members before forming protective insulating material · CPC title

• H10D1/682

  having dielectrics comprising perovskite structures · CPC title

• H10D1/716

  having vertical extensions · CPC title

• H10D1/042 Primary

  using deposition processes to form electrode extensions · CPC title