Circuit assembly, a system and a method for cooling quantum electric devices

Patent metadata

Field	Value
Publication number	US-11210601-B2
Application number	US-201616066207-A
Country	US
Kind code	B2
Filing date	Dec 27, 2016
Priority date	Dec 29, 2015
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A circuit assembly for cooling a quantum electrical device, use of said circuit assembly, a system and a method for cooling a quantum electric device are provided. The circuit assembly comprises a quantum electric device to be cooled, at least one normal-metal-insulator-superconductor (NIS) tunnel junction electrically connected to the quantum electric device and at least one superconductive lead for supplying a drive voltage VQCR for said at least one NIS tunnel junction. The quantum electric device is cooled when the voltage VQCR is supplied to at least one NIS tunnel junction, said voltage VQCR being equal to or below the voltage NΔ/e, where N=1 or N=2, N is the number of NIS tunnel junctions electrically coupled in series with the means for generating the voltage, Δ is the energy gap in the superconductor density of states, and e is the elementary charge.

First claim

The invention claimed is:

1. A circuit assembly for cooling a quantum electric device through photon-assisted single-electron tunneling from a normal-metal to a superconductor, the circuit assembly comprising a quantum electric device to be cooled, wherein the circuit assembly further comprises:
at least one normal-metal-insulator-superconductor (NIS) tunnel junction electrically connected to the quantum electric device,
at least one superconductive lead electrically connected to the at least one normal-metal-insulator-superconductor (NIS) tunnel junction for supplying a drive voltage V QCR for said at least one normal-metal-insulator-superconductor (NIS) tunnel junction,
wherein the energy difference hω 0 /(2π) between two energy states of the quantum electric device is in the range of h(0.3-300 GHz), where h is the Planck constant; and
wherein the effective capacitance C of the quantum electric device is given by C=π/(ρ R K ω 0 ), wherein R K is the von Klitzing constant, and p is the zero-temperature probability of a photon capture event in the course of a single-electron tunneling event which lies in the range of 0.00001-0.1.

2. The circuit assembly according to claim 1 , wherein the tunneling resistance R T of the at least one NIS tunnel junction is substantially in the range of 10 kΩ-100 MΩ.

3. The circuit assembly according to claim 1 , wherein the circuit assembly comprises two normal-metal-insulator-superconductor (NIS) tunnel junctions electrically coupled in series with respect to one another and to at least one superconductive lead, and the quantum electric device electrically coupled in between said two normal-metal-insulator-superconductor (NIS) tunnel junctions.

4. The circuit assembly according to claim 1 , wherein the circuit assembly comprises two normal-metal-insulator-superconductor (NIS) tunnel junctions electrically coupled in parallel with respect to one another between the quantum electric device and at least one superconductive lead.

5. The circuit assembly according to claim 1 , wherein the circuit assembly further comprises at least one lithographically manufactured interdigitated capacitor electrically coupled in series between the at least one normal-metal-insulator-superconductor (NIS) tunnel junction and the quantum electric device.

6. The circuit assembly according to claim 1 , wherein the circuit assembly further comprises at least one lithographically manufactured thin-film parallel plate capacitor comprising at least one layer comprising two superconductive films separated by a dielectric layer, said thin-film parallel plate capacitor electrically coupled in series between the at least one normal-metal-insulator-superconductor (NIS) tunnel junction and the quantum electric device.

7. The circuit assembly according to claim 1 , wherein the circuit assembly further comprises at least one lithographically manufactured interdigitated capacitor electrically coupled in series between the at least one normal-metal-insulator-superconductor (NIS) tunnel junction and a ground.

8. The circuit assembly according to claim 1 , wherein the circuit assembly further comprises at least one lithographically manufactured thin-film parallel plate capacitor comprising at least one layer, said layer comprising two superconductive films separated by a dielectric layer, said thin-film parallel plate capacitor being electrically coupled in series between the at least one normal-metal-insulator-superconductor (NIS) tunnel junction and a ground.

9. The circuit assembly according to claim 1 , wherein the circuit assembly further comprises at least one lithographically manufactured resistor electrically coupled in series between the at least one normal-metal-insulator-superconductor (NIS) tunnel junction and the quantum electric device.

10. The circuit assembly according to claim 1 , wherein the circuit assembly further comprises at least one coil comprising superconductive wires and electrically coupled in series between the at least one superconductive lead for supplying a drive voltage V QCR and the at least one normal-metal-insulator-superconductor (NIS) tunnel junction.

11. The circuit assembly according to claim 1 , wherein the drive voltage V QCR is AC voltage.

12. The circuit assembly according to claim 1 , wherein the quantum electric device is a quantum annealer.

Assignees

• Iqm Finland Oy

Inventors

• Möttönen Mikko
• Tan Kuan Yen
• Partanen Matti

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/28

  comprising Peltier coolers · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10N69/00 Primary

  Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00 · CPC title

• H10N60/11 Primary

  Single-electron tunnelling devices · CPC title