Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device
US-12073996-B2 · Aug 27, 2024 · US
Ring molded article manufacturing method and ring material
US11208910B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11208910-B2 |
| Application number | US-201916689557-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 20, 2019 |
| Priority date | Sep 1, 2014 |
| Publication date | Dec 28, 2021 |
| Grant date | Dec 28, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Various implementations include a ring material used for producing a ring molded article. The ring molded article has two convex portions which respectively protrude on opposite sides of the ring molded article in a direction of a center axis thereof and extend in a direction of a circumference of the ring molded article. A straight line passing through centers of gravity of first and second side regions is inclined by an angle relative to the center axis of the ring material, the first and second side regions are obtained by virtually dividing a one half section of the ring material based on a middle of a maximum height of the ring material in the direction of the center axis of the ring material, and a range of the angle is 7 degrees to 40 degrees.
First claim
Opening claim text (preview).
The invention claimed is: 1. A ring material configured for being subjected to forging to produce a ring molded article having two convex portions which respectively protrude on opposite sides of the ring molded article in a direction of a center axis thereof and extend in a direction of a circumference of the ring molded article, wherein the ring material comprises: first and second side regions, wherein a straight line passing through centers of gravity of the first and second side regions is inclined by an angle relative to a center axis of the ring material, the first and second side regions are obtained by virtually dividing a one half section of the ring material which is configured for being placed inside two molds, based on a middle of a maximum height of the ring material in the direction of the center axis of the ring material, the angle of the straight line relative to the center axis of the ring material is 7 degrees to 40 degrees, wherein a radially outer peripheral surface of the ring material relative to the center axis is formed in a substantially arcuate shape which protrudes radially outwardly in a cross section of the ring material along a plane parallel to the center axis and the straight line, and a radially inner peripheral surface of the ring material relative to the center axis is formed in a substantially arcuate shape which protrudes radially inwardly in a cross section of the ring material along the plane parallel to the center axis and the straight line.
Assignees
Inventors
Classifications
- C22C19/03Primary
based on nickel · CPC title
Dies or mountings therefor · CPC title
- B21K21/08Primary
Shaping hollow articles with different cross-section in longitudinal direction, e.g. nozzles, spark-plugs · CPC title
discs, e.g. disc wheels · CPC title
Component parts, details, or accessories, not provided for in, or of interest apart from, other groups · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11208910B2 cover?
- Various implementations include a ring material used for producing a ring molded article. The ring molded article has two convex portions which respectively protrude on opposite sides of the ring molded article in a direction of a center axis thereof and extend in a direction of a circumference of the ring molded article. A straight line passing through centers of gravity of first and second si…
- Who is the assignee on this patent?
- Nippon Institute Of Tech, Hitachi Metals Ltd
- What technology area does this patent fall under?
- Primary CPC classification C22C19/03. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).