Systems and methods for producing parts at elevated temperatures

US11207808B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-11207808-B1
Application numberUS-202016915624-A
CountryUS
Kind codeB1
Filing dateJun 29, 2020
Priority dateJun 29, 2020
Publication dateDec 28, 2021
Grant dateDec 28, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mold assembly for producing a part includes a first section, a second section movably coupled to the first section, and a cavity defined by the first section and the second section, the cavity being shaped to receive a part while the first section and the second section are movably coupled to each other. The mold assembly includes a joint formed by adjacent surfaces of the first section and the second section and a seal extending along the joint.

First claim

Opening claim text (preview).

What is claimed is: 1. A mold assembly for producing a part, the mold assembly comprising: a first section; a second section movably coupled to the first section such that the second section is configured to move away from the first section during expansion of the part; a cavity defined by the first section and the second section, the cavity being shaped to receive a part while the first section and the second section are movably coupled to each other; a joint formed by adjacent surfaces of the first section and the second section; a seal extending along the joint and spaced away from the cavity, the seal being breakable after the second section has moved away from the first section; and a separation device that includes a scissor mechanism including a pair of legs configured to increase a distance between the first section and the second section. 2. The mold assembly of claim 1 , wherein the joint includes a seam extending between the first section and the second section and the seal includes a sealing material applied along the seam. 3. The mold assembly of claim 1 , wherein the separation device is configured to apply a force to linearly separate the first section and the second section. 4. The mold assembly of claim 1 , wherein the scissor mechanism includes a rod configured to increase the distance between the first section and the section sliding within a slide mechanism connected to a leg of the pair of legs. 5. The mold assembly of claim 1 , wherein the seal is formed with a frangible material that extends to a bottom edge formed by a seam of the joint. 6. The mold assembly of claim 5 , wherein the seam extends from the cavity to the bottom edge formed by the seam. 7. The mold assembly of claim 1 , wherein the pair of legs are configured to apply a force to linearly separate the first section and the second section. 8. The mold assembly of claim 1 , wherein the scissor mechanism includes a sliding rod extending across the pair of legs. 9. The mold assembly of claim 8 , wherein the sliding rod extends through a slide mechanism. 10. The mold assembly of claim 9 , wherein the sliding rod is fixed to a leg of the pair of legs. 11. The mold assembly of claim 1 , wherein the pair of legs forms a first pair of ends connected to the first section and to the second section, respectively, and a second pair of ends that extend away from the first section and the second section. 12. A mold assembly for producing a part, the mold comprising: a first section; a second section movably coupled to the first section; a cavity defined by the first section and the second section, the cavity being shaped to receive a part while the first section and the second section are movably coupled to each other; a joint formed by adjacent surfaces of the first section and the second section; a seal extending along the joint; and a scissor mechanism having a pair of legs, a slide mechanism and a rod extending through the slide mechanism and being secured to one leg of the pair of legs, the scissor mechanism being configured to move the first and second sections away from each other. 13. The mold assembly of claim 12 , wherein the slide mechanism is configured to permit sliding movement of the rod through the slide mechanism as the rod expands. 14. The mold assembly of claim 13 , wherein the slide mechanism is configured to restrict sliding movement of the rod through the slide mechanism as the rod contracts.

Assignees

Inventors

Classifications

  • Heads; Nozzles · CPC title

  • of articles of definite length, i.e. discrete articles {(B29C35/0227 takes precedence)} · CPC title

  • Products made by additive manufacturing · CPC title

  • using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title

  • with sealing means or the like (seals on envelopes used in tyre retreading B29D30/542; for injection moulding footwear B29D35/0045) · CPC title

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Frequently asked questions

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What does patent US11207808B1 cover?
A mold assembly for producing a part includes a first section, a second section movably coupled to the first section, and a cavity defined by the first section and the second section, the cavity being shaped to receive a part while the first section and the second section are movably coupled to each other. The mold assembly includes a joint formed by adjacent surfaces of the first section and t…
Who is the assignee on this patent?
Thermwood Corp
What technology area does this patent fall under?
Primary CPC classification B29C43/3607. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).