Methods and apparatus for embedding a wire intermittently

Patent metadata

Field	Value
Publication number	US-11203165-B2
Application number	US-201916459325-A
Country	US
Kind code	B2
Filing date	Jul 1, 2019
Priority date	Jul 3, 2018
Publication date	Dec 21, 2021
Grant date	Dec 21, 2021

Abstract

A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.

First claim

What is claimed is:

1. A method for intermittently embedding a wire during a three-dimensional printing process, the method comprising:
embedding a first portion of wire into a substrate at a first location using a wire embedding system comprising a three-dimensional printer including a heating element and a wire guide arm, wherein embedding the first portion of the wire comprises:
lowering the wire guide arm toward the substrate to move the wire to the substrate, wherein the wire guide arm is configured to guide the wire from a wire spool to beneath a contact surface of the heating element, wherein the heating element is laterally separated from the wire guide arm;
lowering the heating element to contact the wire;
heating, with the heating element, the wire and substrate while pressure is applied to the wire by the contact surface of the heating element, wherein the heating element embeds the first portion of the wire into the substrate at the first location;

lifting the wire embedding system away from the substrate;
moving the wire embedding system in a first direction relative to the substrate; and
embedding a second portion of the wire into the substrate at a second location using the wire embedding system.

2. The method of claim 1 wherein lifting the wire embedding system away from the substrate comprises lifting the wire guide arm away from the substrate, and lifting the heating element away from the substrate after lifting the wire guide arm away from the substrate.

3. The method of claim 1 , wherein heating the wire and substrate using the heating element comprises providing heat using one of ultrasonic heating, joule heating, conduction heating, convention heating, or infrared heating.

4. The method of claim 1 , wherein embedding the first or second portion of the wire into the substrate at the first or second location further comprises:
moving an edge press bar of the wire embedding system towards the substrate to contact the wire after providing heat to the wire and substrate using the heating element, wherein the edge press bar moves along a surface of the heating element; and
applying pressure, with the edge press bar, to the wire at the first or second location, adjacent to the contact surface of the heating element.

5. The method of claim 4 , wherein lifting the wire embedding system away from the substrate comprises:
lifting the wire guide arm away from the substrate;
lifting the heating element away from the substrate; and
lifting the edge press bar away from the substrate after lifting the heating element away from the substrate, wherein the edge press bar maintains pressure against the wire at the first or second location as the substrate cools.

6. The method of claim 5 , wherein lifting the heating element and the wire guide arm away from substrate is in a second direction, wherein the first direction is perpendicular to the second direction.

7. The method of claim 1 , further comprising:
moving an edge press bar of the wire embedding system towards the substrate to contact the second portion of the wire after providing heat to the wire and substrate using the heating element, wherein the edge press bar moves along a surface of the heating element;
applying pressure, with the edge press bar, to the wire at the second location, adjacent to the contact surface of the heating element;
lifting the wire guide arm and heating element away from the substrate;
turning the wire guide arm of the wire embedding system relative to the substrate while the edge press bar remains in contact with the wire;
lifting the edge press bar away from the substrate;
moving the wire embedding system in a second direction relative to the substrate; and
embedding a third portion of the wire into the substrate at a third location using the wire embedding system.

8. The method of claim 1 , wherein the wire guide arm has a spring configured to absorb a portion of pressure that would otherwise be applied to the substrate.

9. The method of claim 1 , wherein the heating element comprises a three-dimensional printer extruder.

10. The method of claim 1 , wherein a wire positioning system comprising the wire guide arm and the wire spool is configured to rotate about the heating element using a rotation mechanism.

11. The method of claim 1 , wherein a tension control box provides a set amount of tension to the wire.

12. A method for intermittently embedding a wire during a three-dimensional printing process, the method comprising:
embedding a wire in a substrate at a number of predetermined locations in a series of sequential embedding instances using heat and pressure, wherein embedding comprises:
lowering a wire guide arm toward the substrate to move the wire to the substrate, wherein the wire guide arm is configured to guide the wire from a wire spool to beneath a contact surface of a heating element, wherein the heating element is laterally separated from the wire guide arm and wherein the heating element is part of a three-dimensional printer;
lowering the heating element to contact the wire;
heating, with the heating element, the wire and substrate while pressure is applied to the wire by the contact surface of the heating element, wherein the heating element embeds a portion of the wire into the substrate; and

removing the heat and pressure from the wire in between the series of sequential embedding instances.

13. The method of claim 12 , wherein guiding the wire extending from the wire spool to beneath the heating element using the wire guide arm comprises sending the wire through an alignment feature of the wire guide arm.

14. The method of claim 12 , wherein removing the heat and pressure from the wire comprises:
lifting the wire guide arm away from the substrate; and
lifting the heating element away from the substrate after lifting the wire guide arm away from the substrate.

15. The method of claim 12 , wherein embedding the wire into the substrate further comprises:
moving an edge press bar towards the substrate to contact the wire after providing heat to the wire and substrate using the heating element, wherein the edge press bar moves along an angled surface of the heating element; and
applying pressure, with the edge press bar, to the wire adjacent to the contact surface of the heating element.

16. The method of claim 15 , wherein removing the heat and pressure from the wire further comprises:
lifting the edge press bar away from the substrate after lifting the heating element away from the substrate, wherein the edge press bar maintains pressure against the wire as the substrate cools.

17. The method of claim 15 , wherein embedding a wire in a substrate in a series of sequential embedding instances comprises forming a corner in the wire by:
embedding a first portion of the wire into the substrate at a first location;
lifting the wire guide arm, heating element, and edge press bar away from the substrate;
moving the wire guide arm and heating element in a first direction relative to the substrate;
embedding a second portion of the wire into the substrate at a second location;
lifting the wire guide arm and heating element away from the substrate;
turning the wire guide arm relative to the substrate while the edge press bar remains in contact with the wire;
lifting the edge press bar away from the substrate;
moving the wire guide arm and heating element in a second direction relative to the substrate; and
embedding a third portion of the wire into the substrate at a third location.

18. The method of cla

Assignees

• Univ Texas

Inventors

• Kim Chi Yen
• Wicker Ryan
• Espalin David
• Sullivan Charlie

Classifications

• B29C66/1122

  Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

• B29C66/73921

  characterised by the materials of both parts being thermoplastics · CPC title

• B29C66/9261

  by controlling or regulating the displacement of the joining tools · CPC title

• B29C65/10

  using hot gases {(e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined} · CPC title

• B29C65/44 Primary

  Joining a heated non plastics element to a plastics element · CPC title