Resin composition

Patent metadata

Field	Value
Publication number	US-11199776-B2
Application number	US-201716314822-A
Country	US
Kind code	B2
Filing date	Jul 25, 2017
Priority date	Jul 27, 2016
Publication date	Dec 14, 2021
Grant date	Dec 14, 2021

Abstract

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position:

wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO) n —; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO) n —; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

First claim

The invention claimed is:

1. A resin composition comprising:
(a) an alkali-soluble resin;
(b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at a position ortho to the hydroxyl group; and
(c) a photosensitive compound:

wherein in general formula (1),
X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO) n —;
Y is an alkylene group containing 1 to 10 carbon atoms; and
n is an integer of 1 to 20.

2. A resin composition as set forth in claim 1 , wherein the amido-phenol compound of (1) is represented by any one of general formulae (3) to (5):

wherein in general formulae (3) to (5),
m is an integer of 1 to 4;
X is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the carbonyl carbon in general formulae (3) to (5) or a monovalent organic group that has —(YO) n —;
Y is an alkylene group containing 1 to 10 carbon atoms;
n is an integer of 1 to 20;
Z is a single bond, a hydrogen atom, an alkoxy group, —O—, —SO 2 —, —C(CF 3 ) 2 —, —O—R 1 —O—, —C(═O)—, —C(═O)O—R 2 —OC(═O)—, —C(═O)NH—R 3 —NHC(═O)—, or a monovalent to tetravalent hydrocarbon group containing 1 to 20 carbon atoms; and
R 1 to R 3 are each a divalent hydrocarbon group containing 1 to 20 carbon atoms;
m being 2 when Z is a single bond.

3. A resin composition as set forth in claim 1 , wherein the alkali-soluble resin of (a) contains polyimide, polybenzoxazole, polyamide-imide, a precursor of any thereof, and/or a copolymer thereof.

4. A resin composition as set forth in claim 1 , further comprising: (d) a thermal crosslinking agent.

5. An organic EL display apparatus comprising a drive circuit, a planarization layer, a first electrode, an insulation layer, a luminescence layer, and a second electrode disposed on a substrate, the planarization layer and/or the insulation layer being formed from a cured film produced by curing a resin composition as set forth in claim 1 .

6. A semiconductor electronic component comprising an electrode, a metal wiring, an interlaminar insulation layer, and/or a surface protection layer disposed on a substrate, the interlaminar insulation layer and/or the surface protection layer being formed of a cured film produced by curing a resin composition as set forth in claim 1 .

7. Semiconductor equipment comprising an electrode, a metal wiring, an interlaminar insulation layer, and/or a surface protection layer disposed on a substrate, the interlaminar insulation layer and/or the surface protection layer being formed of a cured film produced by curing a resin composition as set forth in claim 1 .

8. A production method for an organic EL display apparatus comprising a step for producing a photosensitive resin film formed of a resin composition as set forth in claim 1 , a step for exposing the photosensitive resin film to light, a step for developing the light-exposed photosensitive resin film, and a step for heat-treating the developed photosensitive resin film.

9. A cured film comprising an alkali-soluble resin (a), and a benzoxazole compound as represented by any one of general formulae (11) to (13) given below:

wherein in general formulae (11) to (13),
W is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to a carbon atom in the oxazole ring in general formulae (11) to (13) or a monovalent organic group that has —(YO) n —;
m is an integer of 1 to 4;
Y is an alkylene group containing 1 to 10 carbon atoms;
n is an integer of 1 to 20;
Z is a single bond, a hydrogen atom, an alkoxy group, —O—, —SO 2 —, —C(CF 3 ) 2 —, —O—R 1 —O—, —C(═O)—, —C(═O)O—R 2 —OC(═O)—, —C(═O)NH—R 3 —NHC(═O)—, or a monovalent to tetravalent hydrocarbon group containing 1 to 20 carbon atoms; and
R 1 to R 3 are each a divalent hydrocarbon group containing 1 to 20 carbon atoms;
m being 2 when Z is a single bond.

Assignees

• Toray Industries

Inventors

• Komori Yusuke
• Miyoshi Kazuto

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W72/01951

  Changing the shapes of bond pads · CPC title

• H10W72/244

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W70/69

  Insulating materials thereof · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title