Singulation of optical waveguide materials

Patent metadata

Field	Value
Publication number	US-11199658-B2
Application number	US-202017126574-A
Country	US
Kind code	B2
Filing date	Dec 18, 2020
Priority date	Dec 20, 2019
Publication date	Dec 14, 2021
Grant date	Dec 14, 2021

Abstract

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

First claim

The invention claimed is:

1. A method for singulating an optical waveguide material at a contour, the method comprising:
directing a first laser beam from a first laser onto a first side of the optical waveguide material to generate a first plurality of perforations in the optical waveguide material;
directing a second laser beam from a second laser onto a second side of the optical waveguide material to generate a second plurality of perforations in the optical waveguide material, wherein the second side is opposite the first side, and the first plurality of perforations and the second plurality of perforations define a perforation zone at the contour; and
directing a third laser beam from a third laser at the perforation zone to singulate the optical waveguide material at the perforation zone.

2. The method of claim 1 , wherein the first laser beam generates the first plurality of perforations by chemically altering a first portion of the optical waveguide material at the contour, the first portion corresponds to the first plurality of perforations, the second laser beam generates the second plurality of perforations by chemically altering a second portion of the optical waveguide material at the contour, and the second portion corresponds to the second plurality of perforations.

3. The method of claim 1 , wherein the first laser beam generates the first plurality of perforations by ablating a first portion of the optical waveguide material at the contour, the first portion corresponds to the first plurality of perforations, the second laser beam generates the second plurality of perforations by ablating a second portion the optical waveguide material at the contour, and the second portion corresponds to the second plurality of perforations.

4. The method of claim 1 , further comprising rotating the optical waveguide material about an axis in a plane of the optical waveguide material, such that the second side faces the second laser.

5. The method of claim 4 , further comprising instantiating, by the first laser beam, a plurality of fiducial markers in the optical waveguide material, the plurality of fiducial markers in a spaced relationship with the contour.

6. The method of claim 5 , further comprising responsive to the rotating of the optical waveguide material, positioning the optical waveguide material, such that the fiducial markers are in the spaced relationship with the contour.

7. The method of claim 5 , further comprising moving the optical waveguide material laterally on a substrate chuck, such that the fiducial markers are in the spaced relationship with the contour.

8. The method of claim 1 , further comprising directing the first laser beam onto the first side of the optical waveguide material to incise boundary markers on the first side prior to the directing of the first laser beam onto the first side of the optical waveguide material to generate the first plurality of perforations, such that the contour is located between the boundary markers.

9. The method of claim 1 , wherein the second plurality of perforations is generated, such that a spacing between the first plurality of perforations and the second plurality of perforations is less than a specified accuracy tolerance.

10. The method of claim 1 , wherein singulating the optical waveguide material at the perforation zone comprises heating the optical waveguide material at the perforation zone to expand the first plurality of perforations and the second plurality of perforations.

11. The method of claim 1 , wherein the first laser and the second laser are the same, and a frequency of the first laser is in a range from 100 kHz to 300 kHz.

12. An apparatus for singulating an optical waveguide material at a contour, the apparatus comprising:
a first laser configured to emit a first laser beam onto a first side of the optical waveguide material to generate a first plurality of perforations in the optical waveguide material;
a second laser configured to emit a second laser beam onto a second side of the optical waveguide material to generate a second plurality of perforations in the optical waveguide material, wherein the second side is opposite the first side, and the first plurality of perforations and the second plurality of perforations define a perforation zone at the contour; and
a third laser configured to emit a third laser beam at the perforation zone to singulate the optical waveguide material at the perforation zone.

13. The apparatus of claim 12 , wherein the first laser beam generates the first plurality of perforations by chemically altering a first portion of the optical waveguide material at the contour, the first portion corresponds to the first plurality of perforations, the second laser beam generates the second plurality of perforations by chemically altering a second portion of the optical waveguide material at the contour, and the second portion corresponds to the second plurality of perforations.

14. The apparatus of claim 12 , wherein the first laser beam generates the first plurality of perforations by ablating a first portion of the optical waveguide material at the contour, the first portion corresponds to the first plurality of perforations, the second laser beam generates the second plurality of perforations by ablating a second portion the optical waveguide material at the contour, and the second portion corresponds to the second plurality of perforations.

15. The apparatus of claim 12 , further comprising a motor operatively coupled to the optical waveguide material and configured to rotate the optical waveguide material about an axis in a plane of the optical waveguide material, such that the second side of the optical waveguide material faces the second laser.

16. The apparatus of claim 15 , wherein the first laser is further configured to instantiate, by the first laser beam, a plurality of fiducial markers in the optical waveguide material, the plurality of fiducial markers in a spaced relationship with the contour.

17. The apparatus of claim 16 , wherein the motor is further configured to position the optical waveguide material, responsive to rotating of the optical waveguide material, such that the plurality of fiducial markers are in the spaced relationship with the contour.

18. The apparatus of claim 16 , further comprising an air bearing configured to move the optical waveguide material laterally on a substrate chuck, such that the fiducial markers are in the spaced relationship with the contour.

19. The apparatus of claim 12 , wherein the first laser is further configured to emit the first laser beam onto the first side of the optical waveguide material to incise boundary markers on the first side prior to emitting the first laser beam onto the first side of the optical waveguide material to generate the first plurality of perforations, such that the contour is located between the boundary markers.

20. The apparatus of claim 12 , wherein the second laser is configured to emit the second laser beam to generate the second plurality of perforations, such that a spacing between the first plurality of perforations and the second plurality of perforations is less than a specified accuracy tolerance.

Assignees

• Magic Leap Inc

Inventors

• Martinez Jr Arturo Manuel
• Singh Vikramjit
• Vaughn Michal Beau Dennison
• Sawicki Joseph Christopher

Classifications

• G02B6/138

  by using polymerisation · CPC title

• B23K26/359

  by providing a line or line pattern, e.g. a dotted break initiation line · CPC title

• C03B33/0222

  Scoring using a focussed radiation beam, e.g. laser · CPC title

• G02B6/132 Primary

  by deposition of thin films · CPC title

• B23K2103/56

  being semiconducting · CPC title