Self-sensing of printed polymer structures

US11199517B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11199517-B2
Application numberUS-201916539184-A
CountryUS
Kind codeB2
Filing dateAug 13, 2019
Priority dateAug 13, 2018
Publication dateDec 14, 2021
Grant dateDec 14, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A structural health monitoring method is provided that utilizes self-sensing printed polymer structures. The method is based on resistivity properties of conductive materials, which can be integrated to a 3D printed polymer structure during additive manufacturing. An article to be monitored has at least one 3D printed polymer structure including a circuit comprising at least one conductive pathway extending through a non-conductive material. The resistance across the circuit is measured during or after loading of the article to determine a resistance value. The measured resistance value is compared to a known resistance value, and based on the comparison, a defect can be detected in the 3D printed polymer structure. Structural health monitoring systems and articles with integrated structural health monitoring are also provided.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for monitoring the structural health of an article, comprising: providing an article having at least one 3D printed polymer structure printed from a non-conductive polymer material and a conductive polymer material, the conductive polymer material forming a parallel circuit comprising multiple conductive pathways of the conductive polymer material through the non-conductive polymer material, wherein the non-conductive and conductive polymer materials are deposited in multiple layers incremented in a first direction, and the multiple conductive pathways extend along a second direction that is substantially perpendicular to the first direction, and the multiple conductive pathways are spaced from each other in the second direction by known distances; loading the article; during or after loading, measuring a resistance across the parallel circuit to determine a measured resistance value; comparing the measured resistance value to multiple known resistance values, each one of the multiple known resistance values indicative of a break in at least one of the multiple conductive pathways; and determining, based on the comparison: whether a defect is present in the 3D printed polymer structure; an estimated length of the defect based on which of the multiple conductive pathways are indicated as comprising a break and based on the known distances; and at least one of: a propagation of the defect within the 3D printed polymer structure; and a direction of propagation of the defect within the 3D printed polymer structure. 2. The method of claim 1 , comprising measuring at least one prior resistance across the parallel circuit prior to loading the article to determine at least one of the known resistance values. 3. The method of claim 1 , comprising monitoring the resistance across the parallel circuit continuously during loading. 4. The method of claim 1 , wherein determining, based on the comparison, whether the defect is present in the 3D printed polymer structure comprises determining whether the measured resistance value is greater than the known resistance values. 5. The method of claim 4 , wherein determining, based on the comparison, whether the defect is present in the 3D printed polymer structure comprises determining whether a difference between the measured resistance value and the known resistance values is greater than a threshold value. 6. The method of claim 1 , wherein: the article comprises multiple circuits, each circuit comprising at least one conductive pathway through the non-conductive polymer material; during or after loading, measuring a resistance across each of the multiple circuits to determine a measured resistance value for each of the multiple circuits; comparing the measured resistance values for each of the multiple circuits to a known resistance value for each of the multiple circuits; determining a location of the defect within the 3D printed polymer structure. 7. A method for monitoring the structural health of an article, comprising: providing an article having at least one 3D printed polymer structure printed from a non-conductive polymer material and a conductive polymer material, the conductive polymer material forming a parallel circuit having multiple conductive pathways, wherein the non-conductive and conductive polymer materials are deposited in multiple layers incremented in a first direction, and the multiple conductive pathways extend along a second direction that is substantially perpendicular to the first direction, wherein the multiple conductive pathways are spaced from each other in the second direction by known distances; loading the article; during or after loading, measuring a resistance across the parallel circuit to determine a measured resistance value; comparing the measured resistance value to multiple known resistance values, each one of the multiple known resistance values indicative of a break in one of the multiple conductive pathways; determining, based on the comparison: whether a defect is present in the 3D printed polymer structure; a location of the defect based on which of the multiple conductive pathways are indicated as comprising a break; an estimated length of the defect based on which of the multiple conductive pathways are indicated as comprising a break and based on the known distances; and at least one of: a propagation of the defect within the 3D printed polymer structure; and a direction of propagation of the defect within the 3D printed polymer structure. 8. The method of claim 1 , comprising generating an alert indicating that the defect is present in the 3D printed polymer structure. 9. The method of claim 8 , wherein the alert indicates at least one of: the location of the defect within the 3D printed polymer structure; the estimated length of the defect within the 3D printed polymer structure; the propagation of the defect within the 3D printed polymer structure; and the direction of propagation of the defect within the 3D printed polymer structure. 10. The method of claim 1 , comprising scheduling maintenance on the article to correct the defect. 11. The method of claim 1 wherein the multiple layers of the non-conductive polymer material are deposited by an additive manufacturing machine in a two-dimensional plane and define a void area extending through the multiple layers of the non-conductive polymer material in a direction perpendicular to the two-dimensional plane; wherein a portion of the multiple conductive pathways comprises conductive material deposited by the additive manufacturing machine and filling the void area.

Assignees

Inventors

Classifications

  • Auxiliary operations or equipment, e.g. for material handling · CPC title

  • G01N27/20Primary

    Investigating the presence of flaws · CPC title

  • using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Processes of additive manufacturing · CPC title

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What does patent US11199517B2 cover?
A structural health monitoring method is provided that utilizes self-sensing printed polymer structures. The method is based on resistivity properties of conductive materials, which can be integrated to a 3D printed polymer structure during additive manufacturing. An article to be monitored has at least one 3D printed polymer structure including a circuit comprising at least one conductive path…
Who is the assignee on this patent?
Ut Battelle Llc
What technology area does this patent fall under?
Primary CPC classification G01N27/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 14 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).