Temperature sensors

US11199456B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11199456-B2
Application numberUS-201616324958-A
CountryUS
Kind codeB2
Filing dateOct 25, 2016
Priority dateOct 25, 2016
Publication dateDec 14, 2021
Grant dateDec 14, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.

First claim

Opening claim text (preview).

What is claimed is: 1. A temperature sensor, comprising: a resistor formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles, wherein the resistor has a positive temperature coefficient of resistance; a first electrical contact at a first end of the resistor; a second electrical contact at a second end of the resistor; and a resistance measuring device connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor. 2. The temperature sensor of claim 1 , wherein the elemental transition metal particles comprise silver particles, copper particles, gold particles, or combinations thereof. 3. The temperature sensor of claim 1 , wherein the matrix of fused thermoplastic polymer particles comprises a fusing agent selected from carbon black, a near-infrared absorbing dye, a near-infrared absorbing pigment, a tungsten bronze, a molybdenum bronze, metal nanoparticles, a conjugated polymer, or combinations thereof. 4. The temperature sensor of claim 1 , wherein the resistor further comprises a halogen salt in the matrix of sintered elemental transition metal particles; the matrix of fused thermoplastic polymer particles, or both. 5. The temperature sensor of claim 1 , wherein the resistor has a resistance from 1 ohm to 1 Mega ohm. 6. A 3-dimensional printed part having an integrated temperature sensor, comprising: a part body formed of fused thermoplastic polymer particles; a resistor formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles, wherein the matrix of fused thermoplastic polymer particles is continuously fused to the fused thermoplastic polymer particles of the part body, and wherein the resistor has a positive temperature coefficient of resistance; a first electrical contact at a first end of the resistor; a second electrical contact at a second end of the resistor; and a resistance measuring device connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor. 7. The 3-dimensional printed part of claim 6 , wherein the elemental transition metal particles comprise silver particles, copper particles, gold particles, or combinations thereof. 8. The 3-dimensional printed part of claim 6 , wherein the fused thermoplastic polymer particles comprise a fusing agent selected from carbon black, a near-infrared absorbing dye, a near-infrared absorbing pigment, a tungsten bronze, a molybdenum bronze, metal nanoparticles, a conjugated polymer, or combinations thereof. 9. The 3-dimensional printed part of claim 6 , wherein the resistor further comprises a halogen salt in the matrix of sintered elemental transition metal particles, the matrix of fused thermoplastic polymer particles, or both. 10. The 3-dimensional printed part of claim 6 , wherein the resistor has a resistance from 1 ohm to 1 Mega ohm. 11. The 3-dimensional printed part of claim 6 , wherein the resistor is embedded in the part body. 12. The 3-dimensional printed part of claim 6 , wherein the part is formed of multiple layers of fused thermoplastic polymer particles stacked in a z-axis direction, and wherein the resistor is oriented at least partially in the z-axis direction. 13. A method of making a 3-dimensional printed part having an integrated temperature sensor, the method comprising: dispensing a conductive fusing agent composition onto a first area of a layer of thermoplastic polymer particles, wherein the conductive fusing agent composition comprises a transition metal and a first liquid jetting vehicle; dispensing a second fusing agent composition onto a second area of the layer of thermoplastic polymer particles, wherein the second fusing agent composition comprises a second liquid jetting vehicle and a fusing agent capable of absorbing electromagnetic radiation to produce heat; fusing the first and second areas with electromagnetic radiation to form a resistor in the first area and a part body in the second area, wherein the resistor comprises a matrix of sintered transition metal particles interlocked with a matrix of fused thermoplastic polymer particles, and the part body comprises fused thermoplastic polymer particles, and wherein the resistor has a positive temperature coefficient of resistance; and connecting a resistance measuring device to the resistor to measure a resistance of the resistor. 14. The method of claim 13 , wherein the resistor is embedded in the part body. 15. The method of claim 13 , wherein the transition metal is in the form of elemental transition metal particles.

Assignees

Inventors

Classifications

  • B29C64/153Primary

    using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • G01K7/223Primary

    characterised by the shape of the resistive element · CPC title

  • Means for process control, e.g. cameras or sensors · CPC title

  • by embedding the binder within the powder bed · CPC title

  • characterised by the type, e.g. laser or electron beam · CPC title

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Frequently asked questions

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What does patent US11199456B2 cover?
A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be co…
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B29C64/153. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 14 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).