Melt processable thermoplastic composite comprising a multimodal dielectric filler

US11198263B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11198263-B2
Application numberUS-201916357929-A
CountryUS
Kind codeB2
Filing dateMar 19, 2019
Priority dateMar 22, 2018
Publication dateDec 14, 2021
Grant dateDec 14, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In an embodiment, a thermoplastic composite comprises a thermoplastic polymer; and a dielectric filler having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution; and a flow modifier.

First claim

Opening claim text (preview).

What is claimed is: 1. A melt processable thermoplastic composite comprising: a thermoplastic polymer; a dielectric filler having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution; wherein the dielectric filler comprises silica; and a flow modifier. 2. The melt processable thermoplastic composite of claim 1 , wherein the thermoplastic composite has a dielectric constant of greater than or equal to 5 at 500 MHz to 10 GHz and a dielectric loss of less than or equal to 0.007 at 500 MHz to 10 GHz. 3. The melt processable thermoplastic composite of claim 1 , wherein the thermoplastic polymer comprises a poly(aryl)etherketone, a polysulfone, a poly(phenylene sulfide), a poly(ether imide), a poly(amide imide), a fluoropolymer, a polyolefin, or a combination comprising at least one of the foregoing. 4. The melt processable thermoplastic composite of claim 1 , wherein the thermoplastic polymer comprises a poly(ether ether ketone), a polyethylene, a poly(phenylene oxide), a cyclic olefin copolymer, or a combination comprising at least one of the foregoing. 5. The melt processable thermoplastic composite of claim 1 , wherein the thermoplastic composite comprises 10 to 90 vol % of the thermoplastic polymer based on a total volume of the thermoplastic composite. 6. The melt processable thermoplastic composite of claim 1 , wherein the thermoplastic polymer comprises or consists of a liquid crystalline polymer. 7. The melt processable thermoplastic composite of claim 1 , wherein the dielectric filler comprises titanium dioxide, barium titanate, strontium titanate, corundum, wollastonite, boron nitride, aluminum oxide, aluminum nitride, silicon carbide, beryllia, magnesia, or a combination comprising at least one of the foregoing. 8. The melt processable thermoplastic composite of claim 1 , wherein the dielectric filler comprises a first plurality of particles having a first average particle size and a second plurality of particles having a second average particle size; wherein the first average particle size corresponds to the peak of the first mode and the second average particle size corresponds to the peak of the second mode; and wherein the peak of the first mode of the multimodal particle size distribution is 10 to 20 times that of the peak of the second mode of the multimodal particle size distribution. 9. The melt processable thermoplastic composite of claim 8 , wherein the first plurality of particles comprises silica and the second plurality of particles comprises titanium dioxide. 10. The melt processable thermoplastic composite of claim 8 , wherein the first plurality of particles and the second plurality of particles comprises titanium dioxide. 11. The melt processable thermoplastic composite of claim 1 , wherein the multimodal particle size distribution is bimodal or trimodal. 12. The melt processable thermoplastic composite of claim 1 , wherein the peak of the first mode is 1 to 10 micrometers and the peak of the second mode is 0.01 to 1 micrometers. 13. The melt processable thermoplastic composite of claim 1 , wherein the thermoplastic composite comprises 10 to 90 vol % of the dielectric filler based on a total weight of the thermoplastic composite. 14. The melt processable thermoplastic composite of claim 1 , wherein the flow modifier comprises a ceramic filler, a fluoropolymer, a silsesquioxane, or a combination comprising at least one of the foregoing. 15. The melt processable thermoplastic composite of claim 1 , wherein the flow modifier is present in an amount of 0.5 to 5 vol % based on the total volume of the thermoplastic composite. 16. A melt processable thermoplastic composite comprising: 10 to 90 vol % a thermoplastic polymer based on a total weight of the thermoplastic composite comprising a poly(aryl)etherketone, a polysulfone, a poly(phenylene sulfide), a poly(ether imide), a poly(amide imide), a fluoropolymer, a polyolefin, a liquid crystalline polymer, or a combination comprising at least one of the foregoing; 10 to 90 vol % a dielectric filler based on a total weight of the thermoplastic composite having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at 10 to 20 times that of a peak of a second mode of the multimodal particle size distribution; wherein the dielectric filler comprises titanium dioxide, barium titanate, strontium titanate, silica, corundum, wollastonite, boron nitride, aluminum oxide, aluminum nitride, silicon carbide, beryllia, magnesia, or a combination comprising at least one of the foregoing; and 0.5 to 5 vol % of a flow modifier based on the total volume of the thermoplastic composite; wherein the thermoplastic composite has a dielectric constant of greater than or equal to 5 at 500 MHz to 10 GHz and a dielectric loss of less than or equal to 0.007 at 500 MHz to 10 GHz. 17. An article comprising the melt processable thermoplastic composite of claim 1 , wherein the article optionally comprises a conductive layer disposed on at least one side of the melt processable thermoplastic composite. 18. The article of claim 17 , wherein the article is an antenna. 19. A method of forming an article comprising: injection molding, extruding, or layer-by-layer printing the melt processable thermoplastic composite of claim 1 . 20. A melt processable thermoplastic composite comprising: 10 to 90 vol % a thermoplastic polymer based on a total weight of the thermoplastic composite comprising a polystyrene, a poly(phenylene ether), or a combination comprising at least one of the foregoing; 10 to 90 vol % a dielectric filler based on a total weight of the thermoplastic composite having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at 10 to 20 times that of a peak of a second mode of the multimodal particle size distribution; wherein the dielectric filler comprises titanium dioxide, barium titanate, strontium titanate, silica, corundum, wollastonite, boron nitride, aluminum oxide, aluminum nitride, silicon carbide, beryllia, magnesia, silica, or a combination comprising at least one of the foregoing; and 0.5 to 5 vol % of a flow modifier based on the total volume of the thermoplastic composite; wherein the thermoplastic composite has a dielectric constant of greater than or equal to 5 at 500 MHz to 10 GHz and a dielectric loss of less than or equal to 0.007 at 500 MHz to 10 GHz.

Assignees

Inventors

Classifications

  • containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

  • plastics; resins; waxes · CPC title

  • mainly consisting of inorganic substances · CPC title

  • Fillers; Inorganic pigments; Reinforcing additives · CPC title

  • Inorganic substances · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11198263B2 cover?
In an embodiment, a thermoplastic composite comprises a thermoplastic polymer; and a dielectric filler having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution; and a flow modifier.
Who is the assignee on this patent?
Rogers Corp
What technology area does this patent fall under?
Primary CPC classification C08K3/013. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 14 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).