Edge sealant application for optical devices
US-2019377200-A1 · Dec 12, 2019 · US
US11198233B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11198233-B2 |
| Application number | US-201917285877-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 16, 2019 |
| Priority date | Oct 16, 2018 |
| Publication date | Dec 14, 2021 |
| Grant date | Dec 14, 2021 |
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In an example method of forming a waveguide part having a predetermined shape, a photocurable material is dispensed into a space between a first mold portion and a second mold portion opposite the first mold portion. A relative separation between a surface of the first mold portion with respect to a surface of the second mold portion opposing the surface of the first mold portion is adjusted to fill the space between the first and second mold portions. The photocurable material in the space is irradiated with radiation suitable for photocuring the photocurable material to form a cured waveguide film so that different portions of the cured waveguide film have different rigidity. The cured waveguide film is separated from the first and second mold portions. The waveguide part is singulated from the cured waveguide film. The waveguide part corresponds to portions of the cured waveguide film having a higher rigidity than other portions of the cured waveguide film.
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What is claimed is: 1. A method of forming a waveguide part having a predetermined shape, the method comprising: dispensing a photocurable material into a space between a first mold portion and a second mold portion opposite the first mold portion; adjusting a relative separation between a surface of the first mold portion with respect to a surface of the second mold portion opposing the surface of the first mold portion to fill the space between the first and second mold portions; irradiating the photocurable material in the space with radiation suitable for photocuring the photocurable material to form a cured waveguide film so that different portions of the cured waveguide film have different rigidity; separating the cured waveguide film from the first and second mold portions; and singulating the waveguide part from the cured waveguide film, wherein the waveguide part corresponds to portions of the cured waveguide film having a higher rigidity than other portions of the cured waveguide film. 2. The method of claim 1 , wherein different portions of the photocurable material are irradiated with different amounts of radiation. 3. The method of claim 2 , wherein portions of the photocurable material irradiated with higher radiation doses correspond to portions of the cured waveguide film having higher rigidity than portions of the waveguide film irradiated with lower radiation doses. 4. The method of claim 2 , wherein different amounts of radiation are supplied by irradiating the space through a mask. 5. The method of claim 4 , wherein the mask includes apertures corresponding to the predetermined shape of the waveguide part. 6. The method of claim 1 , wherein the waveguide part has a thickness of no more than 1000 μm and an area of at least 1 cm 2 . 7. A method of forming a waveguide part having a predetermined shape, the method comprising: dispensing a photocurable material into a space between a first mold portion and a second mold portion opposite the first mold portion; adjusting a relative separation between a surface of the first mold portion with respect to a surface of the second mold portion opposing the surface of the first mold portion to fill the space between the first and second mold portions; irradiating the photocurable material in the space with radiation suitable for photocuring the photocurable material to form a cured waveguide film; separating the cured waveguide film from the first and second mold portions to provide the waveguide part; and singulating a portion of the cured waveguide film in the predetermined shape from the cured waveguide film; annealing the singulated portion to provide the waveguide part, wherein the waveguide part has a rigidity higher than a rigidity of the cured waveguide film. 8. The method of claim 7 , wherein the singulated portion is annealed by irradiating the singulated portion with radiation suitable for photocuring the photocurable material. 9. The method of claim 7 , wherein the singulated portion is annealed by heating the singulated portion. 10. The method of claim 7 , wherein the waveguide part has a thickness of no more than 1000 μm and an area of at least 1 cm 2 . 11. A method of forming a waveguide part having a predetermined shape, the method comprising: positioning a frame between a first mold portion and a second mold portion, the frame having a rigidity, and the frame defining a first aperture having the predetermined shape; dispensing a photocurable material into the aperture of the frame; irradiating the photocurable material in the aperture with radiation suitable for photocuring the photocurable material to form a cured waveguide film having a rigidity different from the frame's rigidity; separating the cured waveguide film from the first and second mold portions; and singulating the waveguide part from the cured waveguide film by cutting a path along the frame, the path at least partially encircling the aperture, and extracting, from the frame along the path, the waveguide part comprising the cured photocurable material. 12. The method of claim 11 , wherein the frame defines a plurality of apertures, each having the predetermined shape. 13. The method of claim 12 , wherein the photocurable material is dispensed into each of the apertures of the frame. 14. The method of claim 13 , wherein the photocurable material in each of the apertures is simultaneously irradiated with the radiation. 15. The method of claim 14 , wherein the cured waveguide film comprises the cured photocurable material in each of the apertures. 16. The method of claim 11 , wherein the waveguide part has a thickness of no more than 1000 μm and an area of at least 1 cm 2 .
using transparant moulds · CPC title
Production of light guides · CPC title
Annealing · CPC title
Shaping techniques involving a cutting or machining operation · CPC title
Moulds or cores · CPC title
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