Wafer polishing apparatus

Patent metadata

Field	Value
Publication number	US-11198207-B2
Application number	US-201816004722-A
Country	US
Kind code	B2
Filing date	Jun 11, 2018
Priority date	Jan 8, 2018
Publication date	Dec 14, 2021
Grant date	Dec 14, 2021

Abstract

The present invention provides a wafer polishing apparatus, including: a surface plate having a polishing pad attached on an upper surface thereof; a slurry injection nozzle configured to inject slurry toward the polishing pad; at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate; an index configured to support so as to connect the at least one polishing head at an upper portion thereof; and a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer.

First claim

What is claimed is:

1. A wafer polishing apparatus comprising:
a surface plate having a polishing pad attached on an upper surface thereof;
a slurry injection nozzle configured to inject slurry toward the polishing pad;
at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate;
an index configured to support the at least one polishing head at an upper portion of the polishing head; and
a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer,
wherein the particle suction part comprises:
a main body coupled to the index to surround a portion of an outer circumferential surface of the polishing head, the main body having a first end portion and a second end portion, and the main body to horizontally extend from the first end portion in a first circumferential direction to the second end portion such that the main body is less than a complete circumferential shape;
a guide disposed at a lower portion of the main body and having a pointed shape toward the surface plate, the guide having a first end portion and a second end portion, and the guide to horizontally extend from the first end portion of the guide in the first circumferential direction to the second end portion of the guide such that the guide is less than a complete circumferential shape;
at least one suction hole disposed in the guide so as to be adjacent to the at least one polishing head;
a flow path which communicates with the at least one suction hole and through which the sucked particles move is formed at an inner side of the main body and the guide; and
an air pump installed at the index and configured to suck the particles through the guide and move the particles along the flow path,
wherein the first end portion of the main body is horizontally spaced apart from the second end portion of the main body in the first circumferential direction, the main body and the guide have a shape of a horse's hoof in a horizontal direction, and the first end portion of the guide is horizontally spaced apart from the second end portion of the guide in the first circumferential direction,
wherein a separation distance between the first end portion of the guide and the second end portion of the guide in a second circumferential direction is same as a separation distance between the first end portion of the main body and the second end portion of the main body in the second circumferential direction, wherein the second circumferential direction is opposite to the first circumferential direction,
wherein the slurry injection nozzle is external to the main body and is disposed between the first end portion of the main body and the second end portion of the main body,
wherein the flow path is provided in a vertical direction from the at least one suction hole disposed in the guide to the main body, and
wherein the guide is disposed above the surface plate in the vertical direction, and the main body is disposed above the guide in the vertical direction.

2. The wafer polishing apparatus of claim 1 , wherein the at least one suction hole has a slot shape disposed along an inner circumferential surface of the guide.

3. The wafer polishing apparatus of claim 1 , wherein the at least one suction hole comprises a plurality of suction sub holes disposed at the guide, and each of the plurality of suction sub holes are spaced apart from each other.

4. The wafer polishing apparatus of claim 3 , wherein the main body comprises a plurality of main body parts, and the guide comprises a plurality of guide parts, each of the plurality of main body parts are spaced apart from each other and each of the plurality of guide parts are spaced apart from each other, and the plurality of main body parts and the plurality of guide parts are disposed to surround the portion of the outer circumferential surface of the polishing head.

5. The wafer polishing apparatus of claim 4 , further comprising an exhaust part disposed at a lower portion of the surface plate to suck and discharge the particles.

6. The wafer polishing apparatus of claim 1 , wherein the vertical direction is perpendicular to the horizontal direction.

7. The wafer polishing apparatus of claim 1 , wherein the guide has the pointed shape in the vertical direction toward the surface plate.

Assignees

• Sk Siltron Co Ltd

Inventors

• Choi Yong

Classifications

• B24B37/107 Primary

  in a rotary movement only, about an axis being stationary during lapping · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/105

  the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement · CPC title

• B24B37/34 Primary

  Accessories · CPC title

• B24B55/03

  designed as a complete equipment for feeding or clarifying coolant · CPC title