Component carrier comprising a double layer structure

Patent metadata

Field	Value
Publication number	US-11197367-B2
Application number	US-202016840620-A
Country	US
Kind code	B2
Filing date	Apr 6, 2020
Priority date	Apr 10, 2019
Publication date	Dec 7, 2021
Grant date	Dec 7, 2021

Abstract

A component carrier with a double layer structure is illustrated and described. The double layer structure includes an electrically conductive patterned layer structure and a further patterned layer structure made of a two-dimensional material. The patterned layer structure and the further patterned layer structure have at least partly the same pattern. In an embodiment the component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and at least one double layer structure connected with the stack.

First claim

The invention claimed is:

1. A method of manufacturing a component carrier, the method comprising:
providing a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the electrically conductive layer structure is connected with a further layer structure made of a two-dimensional material to form a double layer structure; and
commonly patterning at least a part of the electrically conductive layer structure and the further layer structure;
wherein the double layer structure is an antenna, wherein the double layer structure forms a dual band antenna where the further patterned layer structure forms a dipole antenna for higher end frequencies and the electrically conductive patterned layer structure forms a dipole antenna for lower end frequencies.

2. The method according to claim 1 , further comprising:
patterning of one of the electrically conductive patterned layer structure and the further patterned layer structure while using the other one of the electrically conductive patterned layer structure and the further patterned layer structure as a mask.

3. The method according to claim 1 , wherein the further patterned layer structure is patterned by plasma etching.

4. The method according to claim 1 , further comprising:
depositing the further layer structure on the electrically conductive layer structure by chemical vapor deposition.

5. A component carrier, comprising: a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; and a double layer structure comprising: an electrically conductive patterned layer structure; and a further patterned layer structure made of a two-dimensional material, where the further patterned layer structure forms a dipole antenna for higher end frequencies and the electrically conductive patterned layer structure forms a dipole antenna for lower end frequencies: wherein the patterned layer structure and the further patterned layer structure have at least partly the same pattern, wherein the double layer structure forms a dual band antenna.

6. The component carrier according to claim 5 , wherein the double layer structure is configured to transmit respective signals through the electrically conductive patterned layer structure and the further patterned layer structure.

7. The component carrier according to claim 5 , wherein the electrically conductive patterned layer structure comprises copper and the further patterned layer structure comprises graphene.

8. The component carrier according to claim 5 , wherein a thickness of the electrically patterned layer structure is greater than a thickness of the further patterned layer structure.

9. The component carrier according to claim 5 , wherein the electrically patterned layer structure has a lower absolute electrical resistance than the further patterned layer structure.

Assignees

• At & S Austria Tech & Systemtechnik Ag

Inventors

• Gavagnin Marco
• Schulz Gernot
• Schlaffer Erich
• Silvano De Sousa Jonathan

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W70/664

  Carbon-based materials, e.g. fullerenes · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W70/66 Primary

  Conductive materials thereof · CPC title