Manufacturing method of antenna pattern, manufacturing method of RFID inlay, manufacturing method of RFID label, and manufacturing method of RFID medium

Patent metadata

Field	Value
Publication number	US-11196167-B2
Application number	US-201916961746-A
Country	US
Kind code	B2
Filing date	Jan 31, 2019
Priority date	Feb 21, 2018
Publication date	Dec 7, 2021
Grant date	Dec 7, 2021

Abstract

The manufacturing method of the antenna pattern has: a step of forming a dipole antenna on a front surface of a continuous substrate while conveying the continuous substrate; and a step of forming a sub-element on a back surface of the continuous substrate.

First claim

The invention claimed is:

1. A manufacturing method of an antenna pattern having a dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step; and
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step.

2. The manufacturing method of the antenna pattern according to claim 1 , wherein
in the first adhesive-agent coating step and the second adhesive-agent coating step, a position for coating the adhesive agent is aligned such that a blank space between the edges of the antenna pattern and the adhesive agent coated at the inner side of the edges is wider along an upstream side in a conveying direction.

3. The manufacturing method of the antenna pattern according to claim 2 , further comprising
a pressing step of applying pressure on the dipole antenna and the sub-element placed on the continuous substrate.

4. The manufacturing method of the antenna pattern according to claim 2 , wherein
the unwanted portion is removed by suction in the first removal step and the second removal step.

5. The manufacturing method of the antenna pattern according to claim 1 , wherein
the unwanted portion is removed by suction in the first removal step and the second removal step.

6. A manufacturing method of an RFID inlay provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having the dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of a edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step; and
an IC-chip mounting step of mounting the IC chip by using a conductive material on a specific position on the dipole antenna.

7. A manufacturing method of an RFID label adhered to an adherend, the RFID label being provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having a substrate with a printing surface, the dipole antenna formed on a first surface of the substrate, and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
an IC-chip mounting step of mounting the IC chip by using a conductive material on a specific position on the dipole antenna; and
a step of temporarily adhering a separator with the adhesive agent on a surface of the substrate on a reverse side of the printing surface.

8. A manufacturing method of an RFID label adhered to an adherend, the RFID label being provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having the dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
an IC-chip mounting step of mounting the IC chip by using a conductive materi

Assignees

• Sato Holdings Kk

Inventors

• Escaro Rodly
• Maeda Yoshimitsu
• Adib Faiz Adi Ezarudin Bin
• Ota Miki

Classifications

• H01Q9/26 Primary

  with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength (resonant loop antennas H01Q7/00) · CPC title

• B42D25/305

  Associated digital information (record carriers for use with machines and with at least a part designed to carry digital markings G06K19/00) · CPC title

• H01Q19/02

  Details {(fastening of an element on a boom H01Q1/1228)} · CPC title

• G06K19/07

  with integrated circuit chips · CPC title

• G06K19/0775

  arrangements for connecting the integrated circuit to the antenna · CPC title