Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

Patent metadata

Field	Value
Publication number	US-11194135-B2
Application number	US-201916507984-A
Country	US
Kind code	B2
Filing date	Jul 10, 2019
Priority date	Jul 31, 2015
Publication date	Dec 7, 2021
Grant date	Dec 7, 2021

Abstract

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

First claim

The invention claimed is:

1. A layered lens structure obtained by
laminating a plurality of lens attached substrates, wherein the plurality of lens attached substrates includes three or more lens attached substrates, and wherein each lens attached substrate includes:
a carrier substrate;
a through-hole formed in the carrier substrate; and
a lens portion formed only inside the through-hole of the carrier substrate; and

laminating the plurality of lens attached substrates to a sensor substrate that includes an optical sensor.

2. The layered lens structure of claim 1 , wherein each lens attached substrate further includes:
a light-shielding film disposed on an inner side wall of the through-hole.

3. A camera module with a layered lens structure obtained by:
laminating a plurality of lens attached substrates to a sensor substrate that includes an optical sensor, wherein the plurality of lens attached substrates includes three or more lens attached substrates, and wherein each lens attached substrate of the plurality of lens attached substrates includes:
a carrier substrate in which a through-hole is formed; and
a lens portion formed only inside the through-hole of the substrate.

4. The camera module of claim 3 , wherein each lens attached substrate further includes:
a light-shielding film disposed on an inner side wall of the through-hole.

5. A method of manufacturing a layered lens structure,
the method comprising:
laminating a plurality of lens attached substrates, wherein the plurality of lens attached substrates includes three or more lens attached substrates, and wherein each lens attached substrate includes:
a carrier substrate;
a through-hole formed in the carrier substrate; and
a lens portion formed only inside the through-hole of the carrier substrate; and

laminating the plurality of lens attached substrates to a sensor substrate that includes an optical sensor.

6. The method of claim 5 , wherein each lens attached substrate further includes:
a light-shielding film disposed on an inner side wall of the through-hole.

7. A manufacturing apparatus including:
a layered lens structure manufacturing unit which includes:
a lens attached substrate manufacturing unit including a through-hole forming unit forming a through-hole in a carrier substrate and a lens forming unit forming a lens only in the through-hole;
a first bonding unit laminating and bonding a plurality of lens attached substrates manufactured by the lens attached substrate manufacturing unit, wherein the plurality of lens attached substrates includes three or more lens attached substrates; and
a second bonding unit which laminates and bonds a layered lens structure manufactured by the first bonding unit and a sensor substrate having an optical sensor formed on the sensor substrate.

8. The manufacturing apparatus of claim 7 , wherein a film forming unit forms a light shielding film on an inner side wall of the through-hole.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Moriya Yusuke
• Iwasaki Masanori
• Oinoue Takashi
• Hagimoto Yoshiya
• Matsugai Hiroyasu
• Itou Hiroyuki
• Saito Suguru
• Ohshima Keiji
• Fujii Nobutoshi
• Tazawa Hiroshi
• Shiraiwa Toshiaki
• Ishida Minoru

Classifications

• G03B30/00

  Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles · CPC title

• B29D11/00298

  Producing lens arrays · CPC title

• G02B27/0018

  with means for preventing ghost images (anti-reflection coatings G02B1/11) · CPC title

• G02B13/0085 Primary

  employing wafer level optics · CPC title

• G02B3/0012

  characterised by the manufacturing method · CPC title