Joining structure of thin metal plate and base material, and welding method of thin metal plate and base material
US-2018335060-A1 · Nov 22, 2018 · US
Method for producing a cohesive laser bond connection and apparatus for forming a laser bond connection
US11192206B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11192206-B2 |
| Application number | US-201916434348-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 7, 2019 |
| Priority date | Jun 8, 2018 |
| Publication date | Dec 7, 2021 |
| Grant date | Dec 7, 2021 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
Methods for producing a cohesive laser bond connection, wherein, in a first method step, a bond element (2) made from copper is provided, in a second method step, a contact element (3) made from copper is provided, and, in a third method step, the bond element (2) and the contact element (3) are connected to one another in a joined fashion under the action of green laser radiation (1).
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing a cohesive laser bond connection, wherein in a first method step, a bond element ( 2 ) formed from copper is provided, in a second method step, a contact element ( 3 ) made from copper is provided, in a third method step, the bond element ( 2 ) and the contact element ( 3 ) are connected to one another in a joined fashion under the action of green laser radiation with a laser beam ( 1 ), and in a fourth method step, after the third method step, severing the bond element ( 2 ) at a location that is not connected to the contact element ( 3 ). 2. The method according to the preceding claim 1 , characterized in that the green laser radiation ( 1 ) has a wavelength of 532 nm. 3. The method according to claim 1 , characterized in that the bond element ( 2 ) and the contact element ( 3 ) are immediately connected to one another. 4. The method according to claim 1 , characterized in that the bond element ( 2 ) has a cross-sectional area arranged perpendicularly to a longitudinal direction of the bond element ( 2 ), wherein the cross-sectional area of the bond element ( 2 ) has a square, rectangular, or round shape. 5. The method according to claim 1 , characterized in that the bond element ( 2 ) has a width arranged perpendicularly to a longitudinal direction of the bond element ( 2 ), wherein the width of the bond element has a value of less than 5 cm. 6. The method according to claim 1 , characterized in that the bond element ( 2 ) has a width arranged perpendicularly to a longitudinal direction of the bond element ( 2 ), wherein the width of the bond element has a value of less than 1 cm. 7. The method according to claim 1 , characterized in that the bond element ( 2 ) has a width arranged perpendicularly to a longitudinal direction of the bond element ( 2 ), wherein the width of the bond element has a value of less than 0.5 cm. 8. The method according to claim 1 , characterized in that the contact element ( 3 ), provided in the second method step, is a voltage tap of a battery cell of a battery module or a monitoring system of a battery module. 9. The method according to claim 1 , characterized in that the bond element ( 2 ) provided in the first method step has a first end and a second end, wherein the first end is connected in a joined fashion to a voltage tap of a battery cell and the second end is connected in a joined fashion to a voltage tap of a further battery cell, or wherein the first end is connected in a joined fashion to a voltage tap of a battery cell and the second end is connected to a monitoring system of the battery module. 10. The method according to claim 1 , characterized in that, during the third method step, the action of the laser beam ( 1 ) is selected in a manner such that the evaporation temperature of copper is never exceeded. 11. The method according to claim 2 , characterized in that the bond element ( 2 ) and the contact element ( 3 ) are immediately connected to one another. 12. The method according to claim 11 , characterized in that the bond element ( 2 ) has a cross-sectional area arranged perpendicularly to a longitudinal direction of the bond element ( 2 ), wherein the cross-sectional area of the bond element ( 2 ) has a square, rectangular, or round shape. 13. The method according to claim 12 , characterized in that the bond element ( 2 ) has a width arranged perpendicularly to a longitudinal direction of the bond element ( 2 ), wherein the width of the bond element has a value of less than 0.5 cm. 14. The method according to claim 13 , characterized in that the contact element ( 3 ), provided in the second method step, is a voltage tap of a battery cell of a battery module or a monitoring system of a battery module. 15. The method according to claim 14 , characterized in that the bond element ( 2 ) provided in the first method step has a first end and a second end, wherein the first end is connected in a joined fashion to a voltage tap of a battery cell and the second end is connected in a joined fashion to a voltage tap of a further battery cell, or wherein the first end is connected in a joined fashion to a voltage tap of a battery cell and the second end is connected to a monitoring system of the battery module. 16. The method according to claim 15 , characterized in that, during the third method step, the action of the laser beam ( 1 ) is selected in a manner such that the evaporation temperature of copper is never exceeded.
Assignees
Inventors
Classifications
Conductors · CPC title
Energy control of the laser beam (B23K26/0622 takes precedence) · CPC title
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28) · CPC title
Energy storage using batteries · CPC title
using optical means · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11192206B2 cover?
- Methods for producing a cohesive laser bond connection, wherein, in a first method step, a bond element (2) made from copper is provided, in a second method step, a contact element (3) made from copper is provided, and, in a third method step, the bond element (2) and the contact element (3) are connected to one another in a joined fashion under the action of green laser radiation (1).
- Who is the assignee on this patent?
- Bosch Gmbh Robert
- What technology area does this patent fall under?
- Primary CPC classification B23K26/242. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 07 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).