Additive manufacturing device utilizing EB-laser composite scan

US11192187B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11192187-B2
Application numberUS-201615556797-A
CountryUS
Kind codeB2
Filing dateMar 9, 2016
Priority dateMar 10, 2015
Publication dateDec 7, 2021
Grant dateDec 7, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additive manufacturing device utilizing an electron beam and laser integrated scanning comprises: a vacuum generating chamber (1); a worktable means having a forming region at least provided in the vacuum generating chamber (1); a powder supply means configured to supply a powder to the forming region; an electron-beam emission focusing and scanning means (6) and an laser-beam emission focusing and scanning means (7) configured in such a manner that a scanning range of the electron-beam emission focusing and scanning means (6) and a scanning range of the laser-beam emission focusing and scanning means (7) cover at least a part of the forming region; and a controller configured to control the electron-beam emission focusing and scanning means (6) and the laser-beam emission focusing and scanning means (7) to perform a powder integrated-scanning and forming treatment on the forming region.

First claim

Opening claim text (preview).

What is claimed is: 1. An additive manufacturing device utilizing an electron beam and laser integrated scanning, comprising: a vacuum generating chamber; a worktable means having a forming region at least provided in the vacuum generating chamber; a powder supply means configured to supply a powder to the forming region, the powder supply means comprising a powder feeder configured to supply the powder to an upper surface of the operation platform; and a powder laying unit provided on the operation platform and configured to push the powder into a forming cylinder and lay the powder flat therein; at least one electron-beam emission focusing and scanning means and at least one laser-beam emission focusing and scanning means, the laser-beam emission focusing and scanning means being disposed outside the vacuum generating chamber and configured to emit a laser beam into the vacuum generating chamber, the electron-beam emission focusing and scanning means and the laser-beam emission focusing and scanning means being configured in such a manner that a scanning range of the electron-beam emission focusing and scanning means and a scanning range of the laser-beam emission focusing and scanning means cover at least a part of the forming region; and a controller configured to control the electron-beam emission focusing and scanning means and the laser-beam emission focusing and scanning means to perform a powder integrated-scanning and forming treatment on the forming region, wherein the electron-beam emission focusing and scanning means comprises a casing provided outside the vacuum generating chamber; a filament configured to produce an electron beam and provided in the casing; a cathode provided in the casing and located below the filament; a grid electrode provided in the casing and located below the cathode; an anode provided in the casing and located below the grid electrode; a focusing coil provided in the casing and located below the anode; and a deflection coil provided in the casing and located below the focusing coil, wherein the laser-beam emission focusing and scanning means comprises a laser source configured to produce the laser beam and a focusing and scanning unit connected with the laser source, and the focusing and scanning unit is connected with the vacuum generating chamber, wherein a scanning area of the electron-beam emission focusing and scanning means and a scanning area of the laser-beam emission focusing and scanning means at least partially overlap, the powder integrated-scanning and forming treatment comprises scanning, heating, sintering and melting the powder via an electron beam emitted by the electron-beam emission focusing and scanning means and scanning, heating, sintering and melting the powder via the laser beam emitted by the laser-beam emission focusing and scanning means, and the controller is configured to control the electron beam emitted by the electron-beam emission focusing and scanning means and the laser beam emitted by the laser-beam emission focusing and scanning means to simultaneously or alternatively perform the scanning on the powder in a same area or different areas in the forming region, wherein the focusing and scanning unit is protected from radiation produced in the vacuum forming chamber by means of a protection cover, and wherein the protection cover defines an opening for passage of the laser beam emitted by the laser-beam emission focusing and scanning means. 2. The additive manufacturing device according to claim 1 , wherein the scanning range of the electron-beam emission focusing and scanning means and the scanning range of the laser-beam emission focusing and scanning means cover the whole forming region. 3. The additive manufacturing device according to claim 1 , wherein the controller is configured to control the laser beam emitted by the laser-beam emission focusing and scanning means to form a required section contour in the forming region; and the controller is configured to control the electron beam emitted by the electron-beam emission focusing and scanning means to scan the powder in the section contour, melt and deposit the powder so as to form a required section. 4. The additive manufacturing device according to claim 1 , wherein at least one of the electron-beam emission focusing and scanning means and the laser-beam emission focusing and scanning means is adjustable in position relative to the worktable means. 5. The additive manufacturing device according to claim 2 , wherein at least one of the electron-beam emission focusing and scanning means and the laser-beam emission focusing and scanning means is adjustable in position relative to the worktable means. 6. The additive manufacturing device according to claim 1 , wherein the worktable means is movable in the vacuum generating chamber so as to enlarge the scanning range of the electron-beam emission focusing and scanning means and the scanning range of the laser-beam emission focusing and scanning means. 7. The additive manufacturing device according to claim 1 , wherein the additive manufacturing device comprises two electron-beam emission focusing and scanning means and one laser-beam emission focusing and scanning means, and the laser-beam emission focusing and scanning means is disposed between the two electron-beam emission focusing and scanning means. 8. The additive manufacturing device according to claim 1 , wherein the additive manufacturing device comprises four electron-beam emission focusing and scanning means and one laser-beam emission focusing and scanning means, and the electron-beam emission focusing and scanning means are arranged around the laser-beam emission focusing and scanning means. 9. The additive manufacturing device according to claim 1 , wherein the powder comprises at least one of a ceramic powder and a metal powder. 10. The additive manufacturing device according to claim 1 , wherein the worktable means comprises: an operation platform, the forming region being disposed on the operation platform; a piston-type forming cylinder means provided below the operation platform and comprising the forming cylinder and a piston-type elevating member, an upper edge of the forming cylinder being flush with the operation platform, and the piston-type elevating member being configured to rise and fall in the forming cylinder. 11. The additive manufacturing device according to claim 1 , wherein the additive manufacturing device comprises a nozzle inserted into the protection cover, and the nozzle is configured to inject inert gas into the protection cover. 12. An additive manufacturing device utilizing an electron beam and laser integrated scanning, comprising: a vacuum generating chamber; a worktable means having a forming region at least provided in the vacuum generating chamber; a powder supply means configured to supply a powder to the forming region, the powder supply means comprising a powder feeder configured to supply the powder to an upper surface of the operation platform; and a powder laying unit provided on the operation platform and configured to push the powder into a forming cylinder and lay the powder flat therein; at least one electron-beam emission focusing and scanning means and at least one laser-beam emission focusing and scanning means, the laser-beam emission focusing and scanning means being disposed outside the vacuum generating chamber and configured to emit a laser beam into the vacuum generating chamber, the electron-beam emission focusing and scanning means and the laser-beam emission focusing and scanning means being configured in such a manner that a scanning range of the electron-beam emission focusing a

Assignees

Inventors

Classifications

  • Two or more · CPC title

  • Platforms or substrates · CPC title

  • Scanning parameters, e.g. hatch distance or scanning strategy · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • characterised by the type, e.g. laser or electron beam · CPC title

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What does patent US11192187B2 cover?
An additive manufacturing device utilizing an electron beam and laser integrated scanning comprises: a vacuum generating chamber (1); a worktable means having a forming region at least provided in the vacuum generating chamber (1); a powder supply means configured to supply a powder to the forming region; an electron-beam emission focusing and scanning means (6) and an laser-beam emission focus…
Who is the assignee on this patent?
Univ Tsinghua
What technology area does this patent fall under?
Primary CPC classification B29C64/153. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 07 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).