Electronic device comprising antenna

Patent metadata

Field	Value
Publication number	US-11189906-B2
Application number	US-201816003599-A
Country	US
Kind code	B2
Filing date	Jun 8, 2018
Priority date	Jun 9, 2017
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

An electronic device includes a housing including a first plate, a second plate opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, and including at least part of a conductive material, a flexible printed circuit board (FPCB) attached on an inner surface of the housing, a first antenna element which is included in the FPCB and in which a slot is formed, and a first radio frequency integrated circuit (RFIC) for the first antenna element. An opening is formed in the side member or the second plate of the housing. The FPCB is attached the inner surface of the housing such that at least part in which the slot of the first antenna element is formed is exposed through the opening. At least part of the opening is filled with an insulating material.

First claim

What is claimed is:

1. A portable communication device comprising:
a housing including a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a side surface facing perpendicular to the first direction and the second direction, wherein at least part of the side surface includes a conductive part having a pattern used for radiation of a first signal corresponding to a first frequency band; and
a printed circuit board disposed in the housing and including a flexible circuit board part, a first circuit board part connected to a first end part of the flexible circuit board part, and a second circuit board part connected to a second end part of the flexible circuit board part,
wherein a surface of the flexible circuit board part between the first end part and the second end part is disposed adjacent to the side surface of the housing;
wherein a first antenna, facing the first side of the housing, and used for radiation of a second signal corresponding to a second frequency band at least partly different from the first frequency band, is disposed on the first circuit board part;
wherein a second antenna, facing the second side of the housing, and used for radiation of the second signal or a third signal corresponding to the second frequency band, is disposed on the second circuit board part; and
wherein a radio frequency integrated circuit (RFIC), supporting the second frequency band, is disposed on a rear side of the first antenna with respect to the printed circuit board.

2. The portable communication device of claim 1 , further comprising another radio frequency integrated circuit (RFIC), electrically connected to the conductive part, and supporting the first frequency band.

3. The portable communication device of claim 1 , further comprising:
another radio frequency integrated circuit (RFIC) supporting the second frequency band;
an intermediate frequency circuit configured to change an intermediate frequency signal to a baseband signal or change the baseband signal to the intermediate frequency signal; and
a switch configured to selectively connect the radio frequency integrated circuit or the other radio frequency integrated circuit to the intermediate frequency circuit.

4. The portable communication device of claim 3 , wherein the other radio frequency integrated circuit is disposed on the first circuit board part and is facing the second side of the housing.

5. A portable communication device comprising:
a housing including a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a side surface facing perpendicular to the first direction and the second direction, wherein at least part of the side surface includes a conductive part having a pattern used for radiation of a first signal corresponding to a first frequency band;
a first radio frequency integrated circuit (RFIC) and a second radio frequency integrated circuit (RFIC) supporting a second frequency band at least partly different from the first frequency band;
an intermediate frequency circuit configured to change an intermediate frequency signal to a baseband signal or change the baseband signal to the intermediate frequency signal;
a switch configured to selectively connect the first radio frequency integrated circuit or the second radio frequency integrated circuit to the intermediate frequency circuit; and
a printed circuit board coupled to the housing and including a flexible circuit board part, a first circuit board part connected to a first end part of the flexible circuit board part, and a second circuit board part connected to a second end part of the flexible circuit board part,
wherein a first antenna, facing the second side of the housing, and used for radiation of a second signal corresponding to the second frequency band, is disposed on the first circuit board part; and
wherein a second antenna, facing a direction different from the second side, and used for radiation of the second signal or a third signal corresponding to the second frequency band, is disposed on the second circuit board part.

6. The portable communication device of claim 5 , wherein the first antenna radiates the second signal toward the second direction, and wherein the second antenna radiates the third signal toward a third direction different from the first direction and the second direction.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Sung Chul

Classifications

• H01Q1/243

  with built-in antennas · CPC title

• H04M1/026 Primary

  Details of the structure or mounting of specific components · CPC title

• H01Q9/42

  with folded element, the folded parts being spaced apart a small fraction of the operating wavelength · CPC title

• H01Q21/08

  the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title