Superconductor thermal filter

Patent metadata

Field	Value
Publication number	US-11189773-B2
Application number	US-201916554155-A
Country	US
Kind code	B2
Filing date	Aug 28, 2019
Priority date	Aug 28, 2019
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

A superconductor thermal filter is disclosed that includes a normal metal layer having a first side, an insulating layer overlying the first side of the normal metal layer, and a multilayer superconductor structure having a first side overlying a side of the insulating layer opposite the side that overlies the normal metal layer. The multilayer superconductor structure is comprised of a plurality of superconductor layers with each superconductor layer having a smaller superconducting energy band gap than the preceding superconductor as the superconductor layers extend away from the normal metal layer. The thermal filter further includes a normal metal layer quasiparticle trap having a first side and a second side with the first side being disposed on a second side of the multilayer superconductor. A bias voltage is applied between the normal metal layer and the normal metal layer quasiparticle trap to remove hot electrons from the normal metal layer.

First claim

What is claimed is:

1. A superconductor thermal filter comprising:
a normal metal layer having a first side and a second side;
an insulating layer overlying the first side of the normal metal layer;
a multilayer superconductor structure having a first side overlying a side of the insulating layer opposite the side that overlies the normal metal layer, the multilayer superconductor structure comprised of a plurality of superconductor layers with each superconductor layer having a smaller superconducting energy band gap than the preceding superconductor as the superconductor layers extend away from the normal metal layer; and
a normal metal layer quasiparticle trap having a first side and a second side, the first side being disposed on a second side of the multilayer superconductor structure;
wherein a bias voltage is applied between the normal metal layer and the normal metal layer quasiparticle trap to remove hot electrons from the normal metal layer through each superconductor layer of the multilayer superconductor structure to the normal metal layer quasiparticle trap.

2. The superconductor thermal filter of claim 1 , wherein the multilayer superconductor structure comprises a first superconductor layer with a first energy bandgap, a second superconductor layer with a second energy bandgap and a third superconductor layer with a third energy bandgap, such that the first energy bandgap is greater than the second energy bandgap, and the second energy bandgap is greater than the third energy bandgap.

3. The superconductor thermal filter of claim 2 , wherein the first superconducting layer is formed of niobium (Nb) with a superconducting energy bandgap of 2Δ=30.5×10 −4 eV, the second superconducting layer is formed of tin (Sn) with a superconducting energy bandgap of 2Δ=11.5×10 −4 eV, and the third superconducting layer is formed of aluminum (Al) with a superconducting energy bandgap of 2Δ=3.4×10 −4 eV.

4. The superconductor thermal filter of claim 2 , wherein the first superconductor layer is formed of aluminum (Al) with a superconducting energy bandgap of 2Δ=3.4×10 −4 eV, the second superconductor layer is formed of molybdenum (Mo) with a superconducting energy bandgap of 2Δ=2.7×10 −4 eV, and the third superconducting layer is formed of titanium (Ti) with a superconducting energy bandgap of 2Δ=1.2×10 −4 eV.

5. The superconductor thermal filter of claim 1 , wherein each of the plurality of superconductor layers have a thickness thicker than 4 coherence lengths associated with the respective superconductor of the respective superconductor layer.

6. The superconductor thermal filter of claim 1 , wherein each of the plurality of superconductor layers are selected to have a thermal boundary resistance mismatch between the interfaces of adjoining superconductor layers.

7. The superconductor thermal filter of claim 1 , wherein at least one of the plurality of superconducting layers have a film layer thickness that is ¼ wavelength or a multiple of a ¼ wavelength of the dominant phonon associated with the operating temperature of the respective at least one superconductor layers.

8. A solid state cooler comprising the superconductor thermal filter as claimed in claim 1 .

9. A multichip device comprising a first device coupled to a second device by at least a portion of the superconductor thermal filter as claimed in claim 1 .

10. A refrigeration system comprising a plurality of refrigeration stages, wherein at least one stage of the refrigeration system comprises a refrigeration container and a plurality of superconductor thermal filters as claimed in claim 1 disposed about the refrigeration container.

11. The superconductor thermal filter of claim 1 , wherein exposing the second side of the normal metal layer quasiparticle trap to a first environment at a first temperature holds a second environment on the second side of the normal metal layer to a second temperature that is less than the first temperature.

12. A method of forming a superconductor thermal filter, the method comprising:
providing a normal metal layer having a first side and a second side;
disposing an insulating layer overlying the first side of the normal metal layer;
disposing a multilayer superconductor structure having a first side overlying a side of the insulating layer opposite the side that overlies the normal metal layer, the multilayer superconductor structure comprised of a plurality of superconductor layers with each superconductor layer having a smaller superconducting energy band gap than the preceding superconductor as the superconductor layers extend away from the normal metal layer; and
disposing a normal metal layer quasiparticle trap with a first side and a second side, the first side being disposed on a second side of the multilayer superconductor structure.

13. The method of claim 12 , further comprising applying a bias voltage between the normal metal layer and the normal metal layer quasiparticle trap to remove hot electrons from the normal metal layer through each superconductor layer of the multilayer superconductor structure to the normal metal layer quasiparticle trap.

14. The method of claim 12 , wherein the multilayer superconductor structure comprises a first superconductor layer with a first energy bandgap, a second superconductor layer with a second energy bandgap and a third superconductor layer with a third energy bandgap, such that the first energy bandgap is greater than the second energy bandgap, and the second energy bandgap is greater than the third energy bandgap.

15. The method of claim 14 , wherein the first superconducting layer is formed of niobium (Nb) with a superconducting energy bandgap of 2Δ=30.5×10 −4 eV, the second superconducting layer is formed of tin (Sn) with a superconducting energy bandgap of 2Δ=11.5×10 −4 eV, and the third superconducting layer is formed of aluminum (Al) with a superconducting energy bandgap of 2Δ=3.4×10 −4 eV.

16. The method of claim 14 , wherein the first superconductor layer is formed of aluminum (Al) with a superconducting energy bandgap of 2Δ=3.4×10 −4 eV, the second superconductor layer is formed of molybdenum (Mo) with a superconducting energy bandgap of 2Δ=2.7×10 −4 eV, and the third superconducting layer is formed of titanium (Ti) with a superconducting energy bandgap of 2Δ=1.2×10 −4 eV.

17. The method of claim 12 , wherein each of the plurality of superconductor layers have a thickness thicker than 4 coherence lengths associated with the respective superconductor of the respective superconductor layer.

18. The method of claim 12 , wherein each of the plurality of superconductor layers are selected to have a thermal boundary resistance mismatch between the interfaces of adjoining superconductor layers.

19. The method of claim 12 , wherein at least one of the plurality of superconducting layers have a film layer thickness that is ¼ wavelength or a multiple of a ¼ wavelength of the dominant phonon associated with the operating temperature of the at least one superconductor layers.

20. The method of claim 12 , further comprising exposing the second side of the normal metal layer quasiparticle trap to a first environment at a first temperature, wherein the second side of the normal metal layer has a second environment that is held at a second temperature that is less than the first temperature.

Assignees

• Hathaway Aaron A
• Young Robert M
• Przybysz John X
• Boyd Greg
• Keane Zachary
• Northrop Grumman Systems Corp

Inventors

• Hathaway Aaron A
• Young Robert M
• Przybysz John X
• Boyd Greg
• Keane Zachary

Classifications

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/222

  Multilayered bumps, e.g. a coating on top and side surfaces of a bump core · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W40/25

  characterised by their materials · CPC title