Wire material for canted coil spring and canted coil spring

Patent metadata

Field	Value
Publication number	US-11186902-B2
Application number	US-201716492895-A
Country	US
Kind code	B2
Filing date	Dec 4, 2017
Priority date	Mar 10, 2017
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

A wire material for a canted coil spring includes a core wire composed of a steel having a pearlite structure, a copper plating layer covering the outer peripheral surface of the core wire, the copper plating layer being composed of copper or a copper alloy, and a hard layer disposed adjacent to the outer periphery of the copper plating layer, the hard layer having a higher hardness than the copper plating layer. The steel constituting the core wire contains 0.5% or more by mass and 1.0% or less by mass carbon, 0.1% or more by mass and 2.5% or less by mass silicon, and 0.3% or more by mass and 0.9% or less by mass manganese, the balance being iron and unavoidable impurities.

First claim

The invention claimed is:

1. A wire material for a canted coil spring, the wire material comprising:
a core wire composed of a steel having a pearlite structure;
a copper plating layer covering an outer peripheral surface of the core wire, the copper plating layer being composed of copper or a copper alloy; and
a hard layer disposed adjacent to an outer periphery of the copper plating layer, the hard layer having a higher hardness than the copper plating layer,
the steel containing 0.5% or more by mass and 1.0% or less by mass carbon, 0.8% or more by mass and 2.5% or less by mass silicon, and 0.3% or more by mass and 0.9% or less by mass manganese, the balance being iron and unavoidable impurities,
wherein the steel further contains more than 0.5% by mass and 1.8% or less by mass chromium,
wherein the wire material has a tensile strength of 900 MPa or more and 3,000 MPa or less, and
wherein an oxygen concentration at an interface between the core wire and the copper plating layer is 10% or less by mass.

2. The wire material for a canted coil spring according to claim 1 , wherein a ratio of a thickness of the hard layer to a thickness of the copper plating layer is 1/10 or more and less than 1.

3. The wire material for a canted coil spring according to claim 1 , wherein the hard layer is a plating layer.

4. The wire material for a canted coil spring according to claim 1 , wherein the hard layer is a nickel layer or a chromium layer and directly covers the copper plating layer.

5. The wire material for a canted coil spring according to claim 1 , wherein the wire material has a conductivity of 15% IACS or more and 50% IACS or less.

6. The wire material for a canted coil spring according to claim 1 , wherein an alloy region containing a metal element constituting the copper plating layer and a metal element constituting the hard layer is disposed between the copper plating layer and the hard layer.

7. The wire material for a canted coil spring according to claim 6 , wherein the hard layer is a nickel layer, and
the alloy region contains copper and nickel.

8. The wire material for a canted coil spring according to claim 1 , wherein a gold layer, a silver layer, or a tin layer is disposed on the hard layer so as to constitute an outer peripheral surface of the wire material for a canted coil spring.

9. A canted coil spring, comprising the wire material for a canted coil spring according to claim 1 .

10. The wire material for a canted coil spring according to claim 1 , wherein the steel contains 1.8% or more by mass and 2.5% or less by mass silicon.

Assignees

• Sumitomo Electric Industries

Inventors

• Akada Takumi
• Izumida Hiromu
• Hosoe Akihisa

Classifications

• C22C38/002

  containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60 · CPC title

• C22C38/12

  containing tungsten, tantalum, molybdenum, vanadium, or niobium · CPC title

• Y10T428/12715

  Next to Group IB metal-base component · CPC title

• Y10T428/12903

  Cu-base component · CPC title

• Y10T428/12882

  Cu-base component alternative to Ag-, Au-, or Ni-base component · CPC title