Thermally conductive silicone grease composition

Patent metadata

Field	Value
Publication number	US-11186798-B2
Application number	US-201816762548-A
Country	US
Kind code	B2
Filing date	Oct 10, 2018
Priority date	Nov 9, 2017
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m·K or more and less than 5.5 W/m·K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa·s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties.

First claim

The invention claimed is:

1. A heat conductive silicone grease composition comprising:
(A) 5 to 99 parts by weight of an organopolysiloxane represented by the general formula (1):

wherein R 1 is each independently a substituted or unsubstituted C 1 -C 18 monovalent hydrocarbon group, R 2 is each independently an alkyl, alkoxyalkyl, alkenyl or acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3, and having a kinematic viscosity at 25° C. of 10 to 10,000 mm 2 /s,
(B) 1 to 95 parts by weight of an organopolysiloxane represented by the average compositional formula (2):
R 3 c SiO (4-c)/ 2  (2)

wherein R 3 is each independently a substituted or unsubstituted C 1 -C 18 monovalent hydrocarbon group, and c is a number of 1.8 to 2.2, and having a kinematic viscosity at 25° C. of 10 to 100,000 mm 2 /s, the total amount of components (A) and (B) being 100 parts by weight,
(C) a spherical aluminum oxide powder having an average sphericity of at least 0.8, a count of up to 30 surface hydroxyl groups/nm 2 , and an average particle size of 3 to 20 μm, a content of coarse particles with a size of 25 to 45 μm in laser diffraction type particle size distribution being up to 0.2% by weight based on the overall powder (C), and
(D) a spherical and/or irregular zinc oxide powder having an average particle size of 0.01 μm to less than 3 μm, a content of coarse particles with a size of 25 to 45 μm in laser diffraction type particle size distribution being up to 0.2% by weight based on the overall powder (D),
components (C) and (D) being blended in a weight ratio of from 5:5 to 9.5:0.5, the total amount of components (C) and (D) being 65 to 83% by volume of the overall composition,
the composition having a thermal conductivity of 2 W/m·K to less than 5.5 W/m·K as measured by the hot disk method according to ISO 22007-2, and a viscosity at 25° C. of 5 to 800 Pa·s as measured by a spiral viscometer at rotational speed 10 rpm.

2. The heat conductive silicone grease composition of claim 1 which after heat degradation at 200° C. for 100 hours, turns to an uncured grease state having a viscosity at 25° C. of up to 1,000 Pa·s as measured by a spiral viscometer at rotational speed 10 rpm.

3. The heat conductive silicone grease composition of claim 1 , further comprising (E) a volatile solvent in which components (A) and (B) are dispersible or dissolvable, in an amount of up to 100 parts by weight per 100 parts by weight of components (A) and (B) combined.

4. The heat conductive silicone grease composition of claim 1 , further comprising (F) an alkoxysilane having the general formula (3):
R 4 d R 5 e Si(OR 6 ) 4-d-e   (3)

wherein R 4 is each independently a C 9 -C 15 alkyl group, R 5 is each independently a substituted or unsubstituted C 1 -C 8 monovalent hydrocarbon group, R 6 is each independently a C 1 -C 6 alkyl group, d is an integer of 1 to 3, e is an integer of 0 to 2, d+e is an integer of 1 to 3, in an amount of 0.1 to 50 parts by weight per 100 parts by weight of components (A) and (B) combined,
components (C) and (D) being surface treated with component (F).

5. The heat conductive silicone grease composition of claim 1 , which after standing in 130° C./85% RH atmosphere for 96 hours, has a thermal resistance at 25° C. of up to 15 mm 2 ·K/W as measured by the laser flash method.

6. The heat conductive silicone grease composition of claim 1 , having a volume resistivity of at least 1×10 9 Ω·cm.

Assignees

• Shinetsu Chemical Co

Inventors

• Iwata Mitsuhiro

Classifications

• C10N2010/04

  Groups 2 or 12 · CPC title

• C10M2229/0465

  used as base material · CPC title

• C08L83/06

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title

• C08K5/541

  containing oxygen · CPC title

• C10N2020/06

  Particles of special shape or size · CPC title